Abstract: A portable cooler container with active temperature control includes a container body with an insulated chamber to receive medicines, vaccines, biological samples or other medical goods. A control system is at least partially disposed between an outer wall and an inner wall of the container body. An electronic display screen on one of the lid and the container body configured to display shipping address information for the portable cooler container.

Abstract: A portable cooler container with active temperature control includes a container body with an insulated chamber to receive medicines, vaccines, biological samples or other medical goods. A control system is at least partially disposed between an outer wall and an inner wall of the container body. An electronic display screen on one of the lid and the container body configured to display shipping address information for the portable cooler container.

Abstract: A chip layout for a high speed semiconductor device is disclosed. The chip layout isolates Rx terminals and Rx ports from Tx terminals and Tx ports. A serial interface is centrally located to reduce latency, power and propagation delays. Stacked die that contain one or more devices with the chip layout are characterized by having improved latency, bandwidth, power consumption, and propagation delays.

Abstract: A chip layout for a high speed semiconductor device is disclosed. The chip layout isolates Rx terminals and Rx ports from Tx terminals and Tx ports. A serial interface is centrally located to reduce latency, power and propagation delays. Stacked die that contain one or more devices with the chip layout are characterized by having improved latency, bandwidth, power consumption, and propagation delays.

Abstract: A chip layout isolates Rx terminals and Rx ports from Tx terminals and Tx ports. Tx terminals are grouped contiguously to each other, and are segregated as a group to a given edge of the package, Rx terminals are similarly grouped and segregated to a different edge of the package. Tx and Rx data channels are disposed in a respective single layer of the package, or both are disposed in a same single layer of the package. Rx ports and Tx ports are located at an approximate center of the package, with Tx and Rx ports disposed on respective opposite sides of an axis bisecting the package. Data signals received by, and transmitted from, the chip flow in a same direction, from a first edge of the package to the center of the package and from the center of the package to a second edge of the package, respectively.