Abstract: An optical subassembly comprises a micro-optical bench and a corresponding molded device submount having an optical detector, LED, or laser diode mounted thereon. The optical bench is a semiconductor wafer having one or more grooves etched therein. A submount groove is designed to receive a cooperating ridge on a bottom surface of the molded device submount so as to limit the movement of the submount on the optical bench. An optical fiber is secured in an alignment groove and secured to the optical bench. To complete the subassembly, it is only necessary to set the axial distance between the optical detector, LED, or laser diode and a distal end of the optical fiber. A fiber stop incorporated into the micro-optical bench automatically adjusts the axial positioning of the distal end of the fiber to the optical detector, LED, or laser diode. In addition, a hermetically sealed package is provided with a faceplate that is secured to the package.

Abstract: A method and apparatus for aligning an optical fiber (120) with an optoelectronic hybrid device (112) and locking the optical fiber in the aligned position are disclosed. A fiber coated with an external layer of gold is threaded through a solder preform (130). The optical fiber (120) rests upon a ceramic substrate (104). The ceramic substrate also supports a device submount (108) that houses the optoelectronic device (112). The ceramic substrate (104) supports a resistor/heater formed of a thin film of nickel-chromium alloy (604). The resistor/heater supports a pad (609) formed of a layer of nickel (610) and a layer of gold (612). Located atop the pad (609) is the solder preform (130). Precise control of heating is provided by applying a predetermined voltage to the resistor/heater (122) for precise time periods, thereby eliminating the necessity of making temperature measurements during heating. As the resistor/heater (122) is energized, the solder preform is liquefied.