Abstract: A method of making a photonic integrated circuit (PIC) is provided. The method comprises depositing a functional resist material layer over a substrate, disposing and pressing a stamp with a plurality of nanopatterns into the functional resist material for a period of time, and removing the stamp from the functional resist material to provide nanofeatures that are inverted versions of the nanopatterns, wherein the nanofeatures form one or more optical elements.

Abstract: Systems and methods are provided for protecting a temperature sensitive object. A system includes a temperature sensitive object and a thermal control material in thermal communication with the temperature sensitive object. The thermal control material has an emissivity that varies as a function of temperature, and includes a substrate comprising a first surface comprising one of a photonic crystal, a metamaterial, a metasurface, and a multilayer film, a solid state phase change material in contact with the surface, and a reflective thin film material at one of a second surface of the substrate, at a surface of the solid state phase change material, and on an opposite side of an optical cavity from the substrate.

Abstract: A method of making a photonic integrated circuit (PIC) is provided. The method comprises depositing a functional resist material layer over a substrate, disposing and pressing a stamp with a plurality of nanopatterns into the functional resist material for a period of time, and removing the stamp from the functional resist material to provide nanofeatures that are inverted versions of the nanopatterns, wherein the nanofeatures form one or more optical elements.

Abstract: A method of making a photonic integrated circuit (PIC) is provided. The method comprises depositing a functional resist material layer over a substrate, disposing and pressing a stamp with a plurality of nanopatterns into the functional resist material for a period of time, and removing the stamp from the functional resist material to provide nanofeatures that are inverted versions of the nanopatterns, wherein the nanofeatures form one or more optical elements.

Abstract: A method of making a photonic integrated circuit (PIC) is provided. The method comprises depositing a functional resist material layer over a substrate, disposing and pressing a stamp with a plurality of nanopatterns into the functional resist material for a period of time, and removing the stamp from the functional resist material to provide nanofeatures that are inverted versions of the nanopatterns, wherein the nanofeatures form one or more optical elements.

Abstract: Systems and methods are provided for protecting a temperature sensitive object. A system includes a temperature sensitive object and a thermal control material in thermal communication with the temperature sensitive object. The thermal control material has an emissivity that varies as a function of temperature, and includes a substrate comprising a first surface comprising one of a photonic crystal, a metamaterial, a metasurface, and a multilayer film, a solid state phase change material in contact with the surface, and a reflective thin film material at one of a second surface of the substrate, at a surface of the solid state phase change material, and on an opposite side of an optical cavity from the substrate.

Abstract: Plasmonic pixels may provide an array of nanoparticles in a desired arrangement on a substrate, and may be overcoated with a top layer. The nanoparticles may be nanorods, nanoshells, nanoparticles, spiky shells, cubes, triangles, prisms, disks, nanowires, gratings, Fano structures, and/or other single or coupled nano structures. The array of nanoparticles may support two polarized surface plasmon resonances. Further, a plasmon response of the array of nanoparticles may be diffractively coupled. The nanoparticles may be arranged in a square or hexagonal array. The color of the plasmonic pixel may be controlled by the plasmon response of the nanoparticles, a distance between nanoparticles along axial directions, and/or a method of excitation.

Abstract: In general, the invention relates to a unit that includes a semiconductor and a plasmonic material disposed on the semiconductor, where a potential barrier is formed between the plasmonic material and the semiconductor. The unit further includes an insulator disposed on the semiconductor and adjacent to the plasmonic material and a transparent conductor disposed on the plasmonic material, where, upon illumination, the plasmonic material is excited resulting the excitation of an electron with sufficient energy to overcome the potential barrier.

Abstract: In general, the invention relates to a unit that includes a semiconductor and a plasmonic material disposed on the semiconductor, where a potential barrier is formed between the plasmonic material and the semiconductor. The unit further includes an insulator disposed on the semiconductor and adjacent to the plasmonic material and a transparent conductor disposed on the plasmonic material, where, upon illumination, the plasmonic material is excited resulting the excitation of an electron with sufficient energy to overcome the potential barrier.