Patents by Inventor Mark William Ronay
Mark William Ronay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240147631Abstract: Devices, systems, and methods for making and using highly sustainable circuit assemblies are disclosed herein. In various aspects, the highly sustainable circuit assembly includes a substrate layer; and a pattern of contact points supported by the substrate layer. The pattern of contact points can be configured to correspond to at least one terminal of an electrical component. The pattern of contact points can include a deformable conductive material. The deformable conductive material can be a non-hazardous, readily reclaimable, readily recyclable material.Type: ApplicationFiled: February 25, 2022Publication date: May 2, 2024Applicant: Liquid Wire, LLCInventors: Jorge E. Carbo, JR., Sai Srinivas Desabathina, Michael Adventure Hopkins, Charles J. Kinzel, Mark S. Kruskopf, Jesse Michael Martinez, Katherine M. Nelson, Taylor V. Neumann, Trevor Antonio Rivera, Mark William Ronay, Michael Jasper Wallans, Austin Michael Clarke
-
Publication number: 20240138062Abstract: Devices, systems, and methods for making and using circuit assemblies having a pattern of deformable conductive material formed therein are disclosed herein. In various aspects, a circuit assembly can include a substrate layer; a first pattern of deformable conductive material formed on a surface of the substrate layer using a removable stencil; and a first stacked layer configured to cover at least a portion of the first pattern of deformable conductive material.Type: ApplicationFiled: February 25, 2022Publication date: April 25, 2024Applicant: Liquid Wire, LLCInventors: Mark S. Kruskopf, Katherine M. Nelson, Jesse Michael Martinez, Michael Austin Clarke, Mark William Ronay
-
Patent number: 11955420Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.Type: GrantFiled: February 27, 2023Date of Patent: April 9, 2024Assignee: Liquid Wire Inc.Inventors: Mark William Ronay, Trevor Antonio Rivera, Michael Adventure Hopkins, Edward Martin Godshalk, Charles J. Kinzel
-
Publication number: 20240047334Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.Type: ApplicationFiled: May 12, 2023Publication date: February 8, 2024Inventors: Mark William Ronay, Jorge E. Carbo, JR., Trevor Antonio Rivera, Charles J. Kinzel, Michael Adventure Hopkins, Sai Srinivas Desabathina
-
Patent number: 11882653Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.Type: GrantFiled: May 17, 2022Date of Patent: January 23, 2024Assignee: Liquid Wire Inc.Inventors: Mark William Ronay, Jorge E. Carbo, Jr., Trevor Antonio Rivera, Charles J. Kinzel, Michael Adventure Hopkins, Sai Srinivas Desabathina
-
Publication number: 20240021337Abstract: Systems, structures, and methods include a structure formed from a plurality of layers of matrix material. A bus is secured between adjacent layers of the plurality of layers of the matrix material. The bus includes a conductive gel configured to propagate an electrical signal through the structure.Type: ApplicationFiled: December 10, 2021Publication date: January 18, 2024Inventors: Jesse Michael Martinez, Micheal Adventure Hopkins, Charles J. Kinzel, Trevor Antonio Rivera, Mark William Ronay, Edward Martin Godshalk
-
Publication number: 20230317314Abstract: Systems, structures, and methods include a structure formed from a plurality of layers of matrix material. A bus is secured between adjacent layers of the plurality of layers of the matrix material. The bus includes a conductive gel configured to propagate an electrical signal through the structure.Type: ApplicationFiled: June 8, 2023Publication date: October 5, 2023Inventors: Jesse Michael Martinez, Michael Adventure Hopkins, Charles J. Kinzel, Trevor Antonio Rivera, Mark William Ronay, Edward Martin Godshalk
-
Publication number: 20230290717Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.Type: ApplicationFiled: February 27, 2023Publication date: September 14, 2023Inventors: Mark William Ronay, Trevor Antonio Rivera, Michael Adventure Hopkins, Edward Martin Godshalk, Charles J. Kinzel
-
Publication number: 20230228634Abstract: A sensor may include a bladder, and a deformable conductor disposed on the bladder such that deformation of the bladder causes deformation of the deformable conductor, wherein the bladder is constrained so as to enhance the deformation of the conductor in response to the deformation of the bladder. A method may include applying a stimulus to a bladder having a deformable conductor attached thereto, detecting a change in an electrical characteristic associated with the deformable conductor in response to the stimulus, and selectively constraining the bladder to amplify the change in electrical characteristic in response to the stimulus.Type: ApplicationFiled: January 30, 2023Publication date: July 20, 2023Applicant: Liquid Wire, LLCInventor: Mark William RONAY
-
Publication number: 20230221105Abstract: A flexible differential strain sensor, system, and method includes a deformable substrate having a first axis and a second axis different than the first axis and a first sensing element and a second sensing element. The first and second sensing elements are comprised of conductive gel. The first sensing element is arranged to sense strain in the deformable substrate along the first axis. The second sensing element has a first portion arranged to sense strain in the deformable substrate along the first axis and a second portion arranged to sense strain in the deformable substrate along the second axis. The second sensing element is arranged to cancel at least a portion of the stimulus sensed by the first sensing element in the along the first axis.Type: ApplicationFiled: June 11, 2021Publication date: July 13, 2023Inventors: Mark William Ronay, Trevor Antonio Rivera, Jorge E. Carbo, JR., Michael Adventure Hopkins
-
Patent number: 11688677Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.Type: GrantFiled: May 18, 2021Date of Patent: June 27, 2023Assignee: Liquid Wire Inc.Inventors: Mark William Ronay, Jorge E. Carbo, Jr., Trevor Antonio Rivera, Charles J. Kinzel, Michael Adventure Hopkins, Sai Srinivas Desabathina
-
Patent number: 11682615Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.Type: GrantFiled: May 28, 2020Date of Patent: June 20, 2023Assignee: Liquid Wire Inc.Inventors: Mark William Ronay, Jorge E. Carbo, Jr., Trevor Antonio Rivera, Charles J. Kinzel, Michael Adventure Hopkins, Sai Srinivas Desabathina
-
Patent number: 11594480Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.Type: GrantFiled: August 5, 2021Date of Patent: February 28, 2023Assignee: Liquid Wire Inc.Inventors: Mark William Ronay, Trevor Antonio Rivera, Michael Adventure Hopkins, Edward Martin Godshalk, Charles J. Kinzel
-
Publication number: 20220377885Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.Type: ApplicationFiled: May 17, 2022Publication date: November 24, 2022Inventors: Mark William Ronay, Jorge E. Carbo, JR., Trevor Antonio Rivera, Charles J. Kinzel, Michael Adventure Hopkins, Sai Srinivas Desabathina
-
Publication number: 20220270961Abstract: A method includes stacking a first layer of insulating material having one or more passages on a substrate. A deformable conductive material is deposited in at least one of the passages in the first insulating layer. A second layer of insulating material is stacked on the first layer of insulating material.Type: ApplicationFiled: February 18, 2022Publication date: August 25, 2022Inventors: Mark William Ronay, Trevor Antonio Rivera, Michael Adventure Hopkins, Edward Martin Godshalk, Charles J. Kinzel
-
Publication number: 20220155162Abstract: A sensor may include a bladder, and a deformable conductor disposed on the bladder such that deformation of the bladder causes deformation of the deformable conductor, wherein the bladder is constrained so as to enhance the deformation of the conductor in response to the deformation of the bladder. A method may include applying a stimulus to a bladder having a deformable conductor attached thereto, detecting a change in an electrical characteristic associated with the deformable conductor in response to the stimulus, and selectively constraining the bladder to amplify the change in electrical characteristic in response to the stimulus.Type: ApplicationFiled: October 25, 2021Publication date: May 19, 2022Inventor: Mark William Ronay
-
Publication number: 20220071014Abstract: A flexible hybrid electronic system and method includes a first structure and a second structure. The first structure includes a first flexible substrate, a first electronic component secured to the first flexible substrate, and a first flexible conductive trace formed in part from conductive gel. The second structure includes a second flexible substrate, a second electronic component secured to the second flexible substrate, and a second flexible conductive trace formed in part from conductive gel. The first structure is bonded to the second structure at an interconnect region, the first conductive trace is electrically coupled to the second conductive trace within the interconnect region, and the first electronic component is operatively coupled to the second electronic component.Type: ApplicationFiled: August 31, 2021Publication date: March 3, 2022Inventors: Mark William Ronay, Trevor Antonio Rivera, Michael Adventure Hopkins, Katherine M. Nelson, Charles J. Kinzel
-
Publication number: 20220068787Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.Type: ApplicationFiled: August 5, 2021Publication date: March 3, 2022Inventors: Mark William Ronay, Trevor Antonio Rivera, Michael Adventure Hopkins, Edward Martin Godshalk, Charles J. Kinzel
-
Publication number: 20210280482Abstract: A circuit assembly may include a first layer arranged as a substrate, a second layer having a spiral pattern attached to the substrate, wherein the spiral pattern contains a deformable conductor. A circuit assembly may include a first portion of a deformable inductor fabricated on a first layer of the circuit assembly; and a second portion of the deformable inductor fabricated on a second layer of the circuit assembly and electrically connected to the first portion of the deformable inductor. A method may include sensing an interaction with a deformable inductor, wherein the deformable inductor may include an inductive pattern of deformable conductor, and a deformable substrate arranged to support the inductive pattern of deformable conductor. An article of manufacture may include an inductive pattern of deformable conductor, and a deformable substrate arranged to support the inductive pattern of deformable conductor.Type: ApplicationFiled: March 4, 2021Publication date: September 9, 2021Applicant: Liquid Wire Inc.Inventors: Mark William Ronay, Trevor Antonio Rivera, Jorge E. Carbo, JR.
-
Patent number: 11088063Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.Type: GrantFiled: August 22, 2019Date of Patent: August 10, 2021Assignee: Liquid Wire Inc.Inventors: Mark William Ronay, Trevor Antonio Rivera, Michael Adventure Hopkins, Edward Martin Godshalk, Charles J. Kinzel