Abstract: A stack assembly comprising a housing into which an alternating sequence of elements such as heat sinks and printed circuit boards (PCBs) carrying press-packaged semiconductor devices may be mounted and placed under pressure by a clamping device for use in a variety of power system applications. The PCBs are mounted to the heat sinks by a bracket which axially aligns the press-packaged devices with a longitudinal axis defined by the clamping device. Heat sink compartments in the housing are sized slightly larger than the heat sinks to allow the heat sinks some horizontal play within the compartment when the clamping device is loosened. This is further achieved by using floating anchors to connect the heat sinks to the housing and a flexible connector to connect the heat sinks to a power source. The heat sinks may thus be easily shifted to remove a malfunctioning PCB whilst the bulk of the stack remains in the assembled state, thereby facilitating the rapid re-assembly of the stack.

Abstract: A stack assembly comprising a housing into which an alternating sequence of elements such as heat sinks and printed circuit boards (PCBs) carrying press-packaged semiconductor devices may be mounted and placed under pressure by a clamping device for use in a variety of power system applications. The PCBs are mounted to the heat sinks by a bracket which axially aligns the press-packaged devices with a longitudinal axis defined by the clamping device. Heat sink compartments in the housing are sized slightly larger than the heat sinks to allow the heat sinks some horizontal play within the compartment when the clamping device is loosened. This is further achieved by using floating anchors to connect the heat sinks to the housing and a flexible connector to connect the heat sinks to a power source. The heat sinks may thus be easily shifted to remove a malfunctioning PCB whilst the bulk of the stack remains in the assembled state, thereby facilitating the rapid re-assembly of the stack.