Patents by Inventor Mark Wisniewski
Mark Wisniewski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 9795059Abstract: According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0001 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.Type: GrantFiled: May 20, 2013Date of Patent: October 17, 2017Assignee: Laird Technologies, Inc.Inventors: Jason L. Strader, Mark Wisniewski, Karen Bruzda, Michael D. Craig
-
Publication number: 20150334871Abstract: According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In an exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side. A dry material is along at least a portion of the first side of the thermal interface material. The dry material has a thickness less than 0.005 millimeters. At least one edge of the thermal interface material is sealed at least partially by the dry material.Type: ApplicationFiled: June 24, 2014Publication date: November 19, 2015Inventors: Richard F. Hill, Mark Wisniewski, Karen Bruzda
-
Publication number: 20130265721Abstract: According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0005 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.Type: ApplicationFiled: May 20, 2013Publication date: October 10, 2013Inventors: Jason L. Strader, Mark Wisniewski, Karen Bruzda, Michael D. Craig
-
Patent number: 8551391Abstract: A method of making a microneedle array structure (20) comprising a plurality of simultaneously formed microneedles (24), each microneedle (24) having a protrusion (32) and a passageway (34) extending therethrough. The method comprises the steps of pressing an embossable sheet material between a complimentary tools and radiantly heating the sheet material using radiant energy from a radiant energy source. One tool is relatively-radiantly-transparent, and another tool and/or the sheet material is relatively-radiantly-absorptive.Type: GrantFiled: February 3, 2005Date of Patent: October 8, 2013Assignee: Avery Dennison CorporationInventors: Eng-Pi Chang, Philip Yi Zhi Chu, Hsiao Ken Chuang, Kejian (Kevin) Huang, Michael Lang, Reza Mehrabi, Ronald F. Sieloff, Karen L. Spilizewski, Mark Wisniewski
-
Patent number: 8545987Abstract: According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a metallization layer having a layer thickness of about 0.0005 inches or less. The metallization layer is disposed along at least a portion of the first side of the thermal interface material.Type: GrantFiled: November 12, 2007Date of Patent: October 1, 2013Assignee: Laird Technologies, Inc.Inventors: Jason Strader, Mark Wisniewski
-
Patent number: 8445102Abstract: According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0005 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.Type: GrantFiled: September 4, 2008Date of Patent: May 21, 2013Assignee: Laird Technologies, Inc.Inventors: Jason L. Strader, Mark Wisniewski, Karen Bruzda, Michael D. Craig
-
Patent number: 7700188Abstract: This invention relates to an in-mold label comprising a core layer with a first and second surface and a heat seal layer on the first surface of the core layer, wherein the heat seal layer comprises a polyolefin, having a peak melt temperature of less than about 110° C. and where less than about 25% of the polyolefin melts at a temperature of less than 50° C. as measured by differential scanning calorimetry. The label may also contain a skin layer on the second surface of the core layer. The invention also relates to plastic substrates bonded to the label. In another aspect, the present invention also relates to a process for in-mold labeling and a process for preparing an in-mold label. The labels and processes provide reduced amounts of one or more of the following: blisters, both before and after bonding, shrinkage, bagginess and gage bands.Type: GrantFiled: November 14, 2003Date of Patent: April 20, 2010Assignee: Avery Dennison CorporationInventors: Ramabhadran Balaji, Mark Wisniewski
-
Publication number: 20090117373Abstract: According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a metallization layer having a layer thickness of about 0.0005 inches or less. The metallization layer is disposed along at least a portion of the first side of the thermal interface material.Type: ApplicationFiled: November 12, 2007Publication date: May 7, 2009Applicant: LAIRD TECHNOLOGIES, INC.Inventors: Mark Wisniewski, Jason Strader
-
Publication number: 20090117345Abstract: According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0005 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.Type: ApplicationFiled: September 4, 2008Publication date: May 7, 2009Applicant: Laird Technologies, Inc.Inventors: Jason L. Strader, Mark Wisniewski, Karen Bruzda, Michael Craig
-
Publication number: 20080312967Abstract: A system and method for providing health care services, such as medical intake screening and follow-up patient care, including management of medical records and access to patient information for incarcerated individuals. Data regarding medical information collected during an initial intake and screening process and subsequent physical examination may be inputted into a data repository. Triggers based upon the specific data entered may generate alerts for follow up medical care.Type: ApplicationFiled: May 30, 2008Publication date: December 18, 2008Applicant: AMERICA SERVICE GROUP, INC.Inventors: Jennifer Piper, Eric Thrailkill, Mark Wisniewski
-
Publication number: 20050178760Abstract: A method of making a microneedle array structure (20) comprising a plurality of simultaneously formed microneedles (24), each microneedle (24) having a protrusion (32) and a passageway (34) extending therethrough. The method comprises the steps of pressing an embossable sheet material between a complimentary tools and radiantly heating the sheet material using radiant energy from a radiant energy source. One tool is relatively-radiantly-transparent, and another tool and/or the sheet material is relatively-radiantly-absorptive.Type: ApplicationFiled: February 3, 2005Publication date: August 18, 2005Inventors: Eng-Pi Chang, Philip Chu, Hsiao Chuang, Kejian Huang, Michael Lang, Reza Mehrabi, Ronald Sieloff, Karen Spilizewski, Mark Wisniewski
-
Publication number: 20040213944Abstract: This invention relates to a multilayered thermoplastic film, comprising: a thermoplastic core layer having a first side and a second side, the core layer comprising: a polyolefin having a density in the range of about 0.89 to about 0.Type: ApplicationFiled: May 24, 2004Publication date: October 28, 2004Inventors: Bernard S. Mientus, Kushalkumar M. Baid, Mark Wisniewski, Wayne L. Bilodeau
-
Patent number: 6770360Abstract: This invention relates to a multilayered thermoplastic film comprising: a thermoplastic core layer having a first side and a second side, the core layer comprising: a polyolefin having a density in the range of about 0.89 to about 0.97 grams per cubic centimeter; a second polymeric material selected from ionomers derived from sodium, lithium or zinc and an ethylene/methacrylic acid copolymer, and a combination thereof, and a light stabilizer; an abrasion and scuff resistant clear first thermoplastic skin layer overlying the first side of the core layer, and a clear second thermoplastic skin layer overlying the second side of the core layer, both skins containing light stabilizer. The composition of the core layer is different from the composition of the skin layers, and the core layer and the skin layers are characterized by the absence of PVC.Type: GrantFiled: June 11, 1999Date of Patent: August 3, 2004Assignee: Avery Dennison CorporationInventors: Bernard S. Mientus, Kushalkumar M. Baid, Mark Wisniewski, Wayne L. Bilodeau
-
Publication number: 20040130057Abstract: A method of embossing a sheet material includes: heating at least a portion of the sheet directly or indirectly with radiant energy from a radiant energy source; pressing a tool against the heated portion of the sheet, thereby patterning a surface of the sheet; and separating the sheet and the tool. The radiant energy may travel through a solid material that is relatively transparent to radiation, on its way to being absorbed by a relatively-absorptive material. The relatively-transparent material may be an unheated portion of the sheet, and the relatively-absorptive material may be either the tool or the heated portion of the sheet. Alternatively, the relatively-transparent material may be the tool, and the relatively-absorptive material may be all or part of the sheet. The method may be performed as one or more roll-to-roll operations.Type: ApplicationFiled: August 4, 2003Publication date: July 8, 2004Inventors: Reza Mehrabi, David N. Edwards, Robert J. Fermin, Ali R. Mehrabi, Chunhwa Wang, Rishikesh K. Bharadwaj, Ronald F. Sieloff, Hsiao Ken Chuang, Dennis I. Couzin, Karen L. Spilizewski, William J. Buttermore, Donald J. Davis, Christopher P. Frank, Barbara B. Hyde, Michael F. Lang, Keith A. Lutz, Austin E. Short, Mark Wisniewski
-
Publication number: 20040096612Abstract: This invention relates to an in-mold label comprising a core layer with a first and second surface and a heat seal layer on the first surface of the core layer, wherein the heat seal layer comprises a polyolefin, having a peak melt temperature of less than about 110° C. and where less than about 25% of the polyolefin melts at a temperature of less than 50° C. as measured by differential scanning calorimetry. The label may also contain a skin layer on the second surface of the core layer. The invention also relates to plastic substrates bonded to the label. In another aspect, the present invention also relates to a process for in-mold labeling and a process for preparing an in-mold label.Type: ApplicationFiled: November 14, 2003Publication date: May 20, 2004Inventors: Ramabhadran Balaji, Mark Wisniewski
-
Patent number: 6726969Abstract: This invention relates to an in-mold label comprising a core layer with a first and second surface and a heat seal layer on the first surface of the core layer, wherein the heat seal layer comprises a polyolefin, having a peak melt temperature of less than about 110° C. and where less than about 25% of the polyolefin melts at a temperature of less than 50° C. as measured by differential scanning calorimetry. The label may also contain a skin layer on the second surface of the core layer. The invention also relates to plastic substrates bonded to the label. In another aspect, the present invention also relates to a process for in-mold labeling and a process for preparing an in-mold label. The labels and processes provide reduced amounts of one or more of the following: blisters, both before and after bonding, shrinkage, bagginess and gage bands.Type: GrantFiled: January 28, 1997Date of Patent: April 27, 2004Assignee: Avery Dennison CorporationInventors: Ramabhadran Balaji, Mark Wisniewski
-
Publication number: 20030021930Abstract: This invention relates to a multilayered thermoplastic film, comprising: a thermoplastic core layer having a first side and a second side, the core layer comprising: a polyolefin having a density in the range of about 0.89 to about 0.Type: ApplicationFiled: June 11, 1999Publication date: January 30, 2003Inventors: BERNARD S. MIENTUS, KUSHALKUMAR M. BAID, MARK WISNIEWSKI, WAYNE L. BILODEAU
-
Patent number: 6461722Abstract: This invention relates to a thermal transfer laminate, comprising: a facestock comprising a first layer having an upper surface and a lower surface, and a heat-activatable adhesive layer underlying the lower surface of said first layer; an adhesion-promoting layer overlying the upper surface of said first layer; an abrasion-resistant transparent coating layer overlying said adhesion-promoting layer; and another adhesive layer overlying said abrasion-resistant coating layer. In one embodiment, an ink or graphics layer overlies the upper surface of the first layer of the facestock and provides a pictorial design and/or print message. In one embodiment, the laminate is adhered to a carrier sheet. In one embodiment, the laminate is adhered to a substrate such as an automotive interior surface.Type: GrantFiled: October 30, 2000Date of Patent: October 8, 2002Assignee: Avery Dennnison CorporationInventors: Mark D. Kittel, Richard L. Sandt, Charles K. Herrmann, Mark Wisniewski
-
Publication number: 20020023924Abstract: This invention relates a closure with a directionally peelable opening feature for articles comprising first and second layer of different polymeric films, wherein each layer has an upper and lower surface, the upper surface of the first layer is peelably attached to the lower surface of the second layer at a separation interface, provided that when the closure is used to secure an article, at least one portion of the surface and of the upper surface of the first layer or the lower surface of the second layer is not attached to the container. The invention also relates to a container sealed with the directionally peelable closure. The closure provides a means for providing a strong sealing closure that is directionally peelable requiring little effort. In another aspect the invention provides a means for using a container more than once.Type: ApplicationFiled: September 30, 1999Publication date: February 28, 2002Inventors: MARK WISNIEWSKI, MELVIN S. FREEDMAN
-
Patent number: 6311343Abstract: A swimming pool lounge chair is provided for use in an above ground or in-ground swimming pool to provide stationary seating for the occupant. The swimming pool lounge chair has a reclining back portion, telescopically adjustable legs to rest on the bottom of the pool at the option of the user, and a pool perimeter mounting portion that is also telescopically adjustable to permit the user to adjust his or her level of submersion in the pool. The chair is collapsible, portable, and is not permanently affixed to or within the swimming pool.Type: GrantFiled: September 29, 2000Date of Patent: November 6, 2001Inventor: Mark Wisniewski