Abstract: Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. The populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally-conductive materials and one or more thermal spreaders are disposed in thermal contact with at least some of the constituent integrated circuitry of the module. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices.

Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs.

Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs.

Abstract: Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. A rigid substrate configured with wings diverging from a central axis to create, preferably, a ‘V’-shaped structure provide supportive structure for the populated flex circuitry that is wrapped about an edge of the substrate.

Abstract: This invention relates to a rotary valve device for controlling and distributing flow of a fluid medium directly in response to the rotary motion of a motor shaft. Fluid medium is continuously supplied to a cavitated disk through a manifold by a pump source where the cavitated disk rotates at the same rotational speed as the motor shaft. The cavitated disk has a first void region in continuous fluid communication with the pump source and alternately communicates with cylinder conduits to drive a piston. A second void region in the cavitated disk is so dimensioned and proportioned to permit fluid medium to be alternately exhausted from the cylinder and to be distributed to exhaust conduits and then to the atmosphere.

Abstract: An instrument panel having a hidden airbag module door opening, the instrument panel comprising: an outer layer having a show surface and an inner surface; an inner layer having a deployment opening disposed therein; an intermediary layer disposed between the outer layer and the inner layer; and a door member secured about the deployment opening via a mounting bracket, wherein a flange portion comprising a hinge is secured between a peripheral edge portion of the deployment opening and the mounting bracket and a separable flange portion of the door member is secured between another peripheral edge portion of the deployment opening and the mounting bracket, wherein the separable flange portion removably secures a portion of the door member to the inner layer, wherein the door member and the bracket are secured to the inner layer prior to the application of the intermediary layer and the intermediary layer covers the door member and the bracket and wherein the periphery of the door member is not visually percei

Abstract: The invention relates to a novel methods for measuring ion channel transmission and methods and compositions useful in the indentification of ligand gated channel agonists and modulators.

Abstract: In an information retrieval system, a system and method for presentation of information and/or resources that are pertinent to an individual's interests or task. Guiding individuals to places of interest on a network where information is stored. Displaying or otherwise presenting useful information to the user.

Abstract: An improved document retrieval system. In response to detecting that the user has moved a pointing device cursor over a display element in a first web page within a web browser window, retrieving information from a second web page before the user requests that the second web page be displayed within the web browser window.

Abstract: An improved document retrieval system. In response to detecting that the user has moved a pointing device cursor over a display element in a first web page within a web browser window, retrieving information from a second web page before the user requests that the second web page be displayed within the web browser window.

Abstract: A biasing scheme is disclosed that helps reduce current noise in an associated device, such as, for example, a magneto-resistive device. The biasing scheme provides for setting a resistance path in a preamplifier, which is operative to energize the associated device, based on a biasing current that is to be used with associated device. Alternatively or additionally, the resistance path can be set based on a resistance of the associated device. As a result of setting the resistance path in this manner, noise through the associated device can be mitigated during its energization.

Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs.

Abstract: Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. The populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally-conductive materials and one or more thermal spreaders are disposed in thermal contact with at least some of the constituent integrated circuitry of the module. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to, higher thermal energy IC devices.

Abstract: A flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of its major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. A rigid substrate is configured to provide space on one side where the populated flex is disposed while in some embodiments, heat management or cooling structures are arranged on one side of the module to mitigate thermal accumulation in the module.

Abstract: A biasing scheme is disclosed that helps reduce current noise in an associated device, such as, for example, a magneto-resistive device. The biasing scheme provides for setting a resistance path in a preamplifier, which is operative to energize the associated device, based on a biasing current that is to be used with associated device. Alternatively or additionally, the resistance path can be set based on a resistance of the associated device. As a result of setting the resistance path in this manner, noise through the associated device can be mitigated during its energization.

Abstract: A semiconductor lead frame, and a semiconductor package fabricated using the lead frame, are provided. The lead frame includes side rails; patterns of lead fingers; and multiple die mounting paddles. Each die mounting paddle is configured to mount a semiconductor die for wire bonding to an associated pattern of lead fingers. In addition, each die mounting paddle includes support members on opposing sides, each having at least two downset segments. The downset segments of the support members offset the die mounting paddles from the lead fingers. In a first lead frame embodiment, the support members include downset segments oriented at opposing angles with respect to a longitudinal axes of the mounting paddles. In a second embodiment, the support members include two or more downset segments oriented along axes that are generally parallel to the die mounting paddles.

Abstract: A semiconductor lead frame, and a semiconductor package fabricated using the lead frame, are provided. The lead frame includes side rails; patterns of lead fingers; and multiple die mounting paddles. Each die mounting paddle is configured to mount a semiconductor die for wire bonding to an associated pattern of lead fingers. In addition, each die mounting paddle includes support members on opposing sides, each having at least two downset segments. The downset segments of the support members offset the die mounting paddles from the lead fingers. In a first lead frame embodiment, the support members include downset segments oriented at opposing angles with respect to a longitudinal axes of the mounting paddles. In a second embodiment, the support members include two or more downset segments oriented along axes that are generally parallel to the die mounting paddles.

Abstract: In a high-frequency communication cable with foam plastic insulation and an outer conducting tape having a bonded longitudinal overlapped seam, a separate metal bridging strip is inserted under the seam.