Abstract: A coaxial-to-microstrip vertical transition includes a dielectric substrate having formed on a first surface thereof a primary microstrip conductor trace, and on a second surface a secondary microstrip conductor trace. A first conductive via extends through the dielectric substrate and electrically connects the primary conductor trace to the secondary conductor trace. A second conductive via is spaced from the first conductive via and extends through the dielectric substrate to electrically connect the secondary conductor trace to the coaxial center conductor. A bottom microstrip ground plane layer is defined on the second substrate surface. A conductive base plate structure has a cavity formed therein, the substrate positioned such that the base plate structure is in contact with the bottom ground plane layer, and the secondary conductor trace is positioned over the cavity.

Abstract: Coax to microstrip orthogonal launchers that use a compressible fuzz button center conductor as a solderless interconnect. The launcher comprises a coaxial connector having a center conductor that contacts a compressible fuzz button interconnect. In certain embodiments, the fuzz button interconnect directly contacts one end of a microstrip line. In another embodiment, the microstrip line is formed on a curved microstrip circuit board, and the fuzz button interconnect contacts a pin that has a thin metal tab that is adhesively secured to the one end of the microstrip line. In all embodiments, a second coaxial connector has a center conductor that contacts the opposite end of the microstrip conductor line. The present invention eliminates need for precise soldering by using the fuzz button interconnect to create a solderless compression contact between the coaxial connector and the microstrip line.

Abstract: A coaxial IF interconnect structure that is compressible in the z-axis and provides its own environmental seal against moisture and coolant. The structure (50) includes three components, a center conductor (60), dielectric spacer structure (70), and outer conductor shield (80), all fabricated of compressible materials. The center conductor is a compressible metal interconnection element formed by die compressing 1 mil diameter fine wire to a desired shape and density. The coaxial dielectric structure supports the compressible center conductor, and is fabricated from a fluorinated elastomer (FM) known as fluorosilicone. The compressible coaxial outer conductor shield functions as an IF gasket in the form of an round flat washer surrounding the dielectric structure and center conductor.

Abstract: An array system with radiating elements and a wideband monopulse power divider network with dual channel input ports and multiple output ports. Each input channel of the network excites a uniquely different RF amplitude and phase distribution out of each of the corresponding "n" output ports. All ports are matched and isolated from each other across a wide instantaneous frequency. Also the RF power distribution will track in amplitude and phase across a wide frequency band. This is achieved through a special arrangement of air-stripline matched power dividers, attenuator, phase shifters, and Magic-Tee couplers. The output ports of the network can be connected directly to the radiating elements or to partitioned feed circuits which are in turn connected to sub-sets of the radiating elements.