Abstract: The present invention relates to a method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer, the method comprising in this order the steps: (i) providing a non-conductive substrate comprising on at least one side said surface, said surface having a total surface area of copper or copper alloy, (ii) contacting said substrate comprising said surface with an acidic aqueous non-etching protector solution comprising (ii-a) one or more than one amino azole, (ii-b) one or more than one organic acid and/or salts thereof, (ii-c) one or more than one peroxide in a total amount of 0.4 wt-% or less, based on the total weight of the protector solution, and (ii-d) inorganic acids in a total amount of 0 to 0.01 wt-%, based on the total weight of the protector solution, wherein during step (ii) the total surface area of said surface is not increased upon contacting with the protector solution.

Abstract: The present invention relates to a specific azole silane compound, an oligomer thereof, a mixture comprising said compound and/or said oligomer, as well as a respective storage and working solution. Furthermore, the present invention relates to a synthesis method for said specific azole silane compound, and the use of said working solution as a surface treatment solution.

Abstract: The present invention relates to a specific azole silane compound, an oligomer thereof, a mixture comprising said compound and/or said oligomer, as well as a respective storage and working solution. Furthermore, the present invention relates to a synthesis method for said specific azole silane compound, and the use of said working solution as a surface treatment solution.

Abstract: The present invention relates to a method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer, the method comprising in this order the steps: (i) providing a non-conductive substrate comprising on at least one side said surface, said surface having a total surface area of copper or copper alloy, (ii) contacting said substrate comprising said surface with an acidic aqueous non-etching protector solution comprising (ii-a) one or more than one amino azole, (ii-b) one or more than one organic acid and/or salts thereof, (ii-c) one or more than one peroxide in a total amount of 0.4 wt-% or less, based on the total weight of the protector solution, and (ii-d) inorganic acids in a total amount of 0 to 0.01 wt-%, based on the total weight of the protector solution, wherein during step (ii) the total surface area of said surface is not increased upon contacting with the protector solution.

Abstract: A method for manufacturing a printed circuit board, comprising in order steps (i) providing a non-conductive substrate having on a surface copper circuitry with a copper surface, wherein said surface is chemically treated by (a) oxidation and subsequent reduction reaction and/or (b) organic compound attached to said surface, a permanent, non-conductive, not fully polymerized cover layer covering at least partially said surface, (ii) thermally treating the substrate with the cover layer at temperature from 140° C. to 250° C. in atmosphere containing molecular oxygen at 100000 ppm or less, based on the total volume of the atmosphere, wherein a substrate with a permanent, non-conductive cover layer is obtained, with the provisos that (ii) is after (i) but before any metal or metal alloy is deposited onto the cover layer, and that in (ii) the cover layer is fully polymerized in one thermal treating step, if the cover layer is a solder mask.

Abstract: A method for manufacturing a printed circuit board, comprising in order steps (i) providing a non-conductive substrate having on a surface copper circuitry with a copper surface, wherein said surface is chemically treated by (a) oxidation and subsequent reduction reaction and/or (b) organic compound attached to said surface, a permanent, non-conductive, not fully polymerized cover layer covering at least partially said surface, (ii) thermally treating the substrate with the cover layer at temperature from 140° C. to 250° C. in atmosphere containing molecular oxygen at 100000 ppm or less, based on the total volume of the atmosphere, wherein a substrate with a permanent, non-conductive cover layer is obtained, with the provisos that (ii) is after (i) but before any metal or metal alloy is deposited onto the cover layer, and that in (ii) the cover layer is fully polymerized in one thermal treating step, if the cover layer is a solder mask.

Abstract: The present invention is related to a composition for micro etching of a copper or a copper alloy surface, wherein the composition comprises i) at least a source of Fe3+ ions, ii) at least a source of Br? ions, iii) at least an inorganic acid, and iv) at least one etch refiner according to formula I wherein R1 is selected from the group consisting of hydrogen, C1-C5-alkyl or a substituted aryl or alkaryl group; R2 is selected from the group consisting of hydrogen, C1-C5-alkyl or C1-C5-alkoxy; R3, R4 are selected from the group consisting of hydrogen and C1-C5-alkyl; and X? is a suitable anion. Further, the present invention is directed to a method for micro etching of copper or copper alloy surfaces using such a composition.