Abstract: The present invention relates to a radio frequency identification tag which is adapted to work at a frequency between 850 MHz and 950 MHz. The tag may comprise a planar inverted F antenna, a loop antenna, or a dual patch antenna.

Abstract: This relates to a label to be attached to a surface, the label comprising a transponder. The label comprises a non-adherent flap which contains the transponder. This also relates to a web comprising a backing web and labels, and to a system comprising a surface and a label.

Abstract: The present invention relates to a method for manufacturing products comprising transponders. The method comprises introducing a web comprising on its surface sequential structural modules comprising an impedance matching element and an integrated circuit electrically connected to the impedance matching element, the structural modules having a first distance between each other; cutting the web in such a manner that the sequential structural modules are separated from each other; attaching the structural modules to a product substrate, the sequential structural modules having a second distance between each other, the second distance being longer than the first distance; and attaching the impedance matching elements to antennas, the impedance matching elements and the antennas forming an electrical connection.

Abstract: An RFID tag to be attached to an item, and a method. The tag comprises an antenna and an integrated circuit. The RFID tag further comprises a substrate on which the antenna is attached. The substrate is construed to form a stand-off relation between the item and the antenna when buried inside of the material of the item.

Abstract: The present invention relates to a radio frequency identification tag which is adapted to work at a frequency between 850 MHz and 950 MHz. The tag may comprise a planar inverted F antenna, a loop antenna, or a dual patch antenna.

Abstract: The present invention relates to a method for manufacturing products comprising transponders. The method comprises introducing a web comprising on its surface sequential structural modules comprising an impedance matching element and an integrated circuit electrically connected to the impedance matching element, the structural modules having a first distance between each other; cutting the web in such a manner that the sequential structural modules are separated from each other; attaching the structural modules to a product substrate, the sequential structural modules having a second distance between each other, the second distance being longer than the first distance; and attaching the impedance matching elements to antennas, the impedance matching elements and the antennas forming an electrical connection.

Abstract: The invention relates to a method for manufacturing a product sensor (2), and a product sensor (2). In the manufacturing method, a circuitry pattern is formed in the product sensor (2) for achieving an antenna circuit (L, C1, C2). In addition, the product sensor (2) is provided with at least one measuring means (13), whose at least one electrical property is affected by at least one condition. Product control is performed by measuring the at least one measuring means (13) formed in the product sensor (2), which means is affected by at least one condition, at least one electrical condition. In order to form a product sensor, at least a first (3) and a second module (5) are formed, the first of the modules (3) being provided with at least a part of said antenna circuit, and the second module (5) being provided with said at least one measuring means (13). Said at least two modules (3, 5) are connected to each other.

Abstract: An RFID transponder is disclosed in which predetermined conductive portions will be removed from the transponder should the transponder be removed from a first object to which it is attached. The transponder has a first response to applied RF before the predetermined portions are removed and a second response after such removal. An RF detector can be used to scan objects with transponders to detect the first or the second response and thereby determine when a transponder has been moved.

Abstract: This relates to a label to be attached to a surface, the label comprising a transponder. The label comprises a non-adherent flap which contains the transponder. This also relates to a web comprising a backing web and labels, and to a system comprising a surface and a label.

Abstract: The present invention relates to a method for manufacturing an electrically conductive pattern by printing a layer comprising metal oxide on a carrier substrate (2) and reducing the metal oxide to metal. The reduced layer is transferred to an application substrate (7). The present invention also relates to the use of the method.

Abstract: The Invention relates to a method for the manufacture of a smart label web. The smart label web comprises smart labels placed one after another and/or side by side and comprising a circuitry pattern and an integrated circuit on a chip therein. In the method, an electrical contact is formed between the integrated circuit on a chip and the circuitry pattern of the smart label in the smart label web in such a way that a structural part separated from a separate carrier web and comprising an integrated circuit on a chip is attached to the smart label. The structural part contains a thermoplastic material whereby it is attached to the smart label.

Abstract: A smart label comprises a circuitry pattern on a smart label substrate and a structural part comprises an integrated circuit on a chip on a structural part substrate. The structural part is attached to the smart label substrate and/or the circuitry pattern. The circuitry pattern is electrically connected to the integrated circuit on the chip via at least one capacitor located outside the chip.

Abstract: The present invention relates to a method for manufacturing an electrically conductive pattern by printing a layer comprising metal oxide on a carrier substrate (2) and reducing the metal oxide to metal. The reduced layer is transferred to an application substrate (7). The present invention also relates to the use of the method.

Abstract: The invention relates to a method for manufacturing a product sensor (2), and a product sensor (2). In the manufacturing method, a circuitry pattern is formed in the product sensor (2) for achieving an antenna circuit (L, C1, C2). In addition, the product sensor (2) is provided with at least one measuring means (13), whose at least one electrical property is affected by at least one condition. Product control is performed by measuring the at least one measuring means (13) formed in the product sensor (2), which means is affected by at least one condition, at least one electrical condition. In order to form a product sensor, at least a first (3) and a second module (5) are formed, the first of the modules (3) being provided with at least a part of said antenna circuit, and the second module (5) being provided with said at least one measuring means (13). Said at least two modules (3, 5) are connected to each other.

Abstract: The invention relates to a method for forming a product sensor, and a product sensor. The product sensor is formed on a substrate and provided with at least one electric circuit comprising at least one capacitor and at least one coil. At least part of the electric circuit is formed by evaporating a first metallization layer at least at the electric circuit in the product sensor.

Abstract: An RFID transponder is disclosed in which predetermined conductive portions will be removed from the transponder should the transponder be removed from a first object to which it is attached. The transponder has a first response to applied RF before the predetermined portions are removed and a second response after such removal. An RF detector can be used to scan objects with transponders to detect the first or the second response and thereby determine when a transponder has been moved.

Abstract: A smart label comprises a circuitry pattern on a smart label substrate and a structural part comprises an integrated circuit on a chip on a structural part substrate. The structural part is attached to the smart label substrate and/or the circuitry pattern. The circuitry pattern is electrically connected to the integrated circuit on the chip via at least one capacitor located outside the chip.

Abstract: The invention relates to a method for the manufacture of a smart label web. The smart label web comprises smart labels placed one after another and/or side by side and comprising a circuitry pattern and an integrated circuit on a chip therein. In the method, an electrical contact is formed between the integrated circuit on a chip and the circuitry pattern of the smart label in the smart label web in such a way that a structural part separated from a separate carrier web and comprising an integrated circuit on a chip is attached to the smart label. The structural part contains a thermoplastic material whereby it is attached to the smart label.

Abstract: The invention relates to a method for the manufacture of a smart label. In the method, the smart label is provided with at least one oscillating circuit comprising at least one coil and at least one capacitor. Further in the method, at least one tuning element is formed in the oscillating circuit, for tuning of the oscillating circuit. The tuning of the oscillating circuit is performed, if necessary, by deactivating one or more of said tuning elements.

Abstract: The invention relates to a method for forming a product sensor, and a product sensor. The product sensor is formed on a substrate and provided with at least one electric circuit comprising at least one capacitor and at least one coil. At least part of the electric circuit is formed by evaporating a first metallization layer at least at the electric circuit in the product sensor.