Abstract: A novel power inverter system for transferring electric power between a DC power source and a multi-phase electric machine is described, and includes a power inverter, a Z-source inverter, a first switch, and a second switch. The first switch is arranged between positive and negative conductors of a high-voltage bus that is electrically coupled to the DC power source, and the second switch is arranged in-line on the positive conductor of the high-voltage bus.

Abstract: A novel power inverter system for transferring electric power between a DC power source and a multi-phase electric machine is described, and includes a power inverter, a Z-source inverter, a first switch, and a second switch. The first switch is arranged between positive and negative conductors of a high-voltage bus that is electrically coupled to the DC power source, and the second switch is arranged in-line on the positive conductor of the high-voltage bus.

Abstract: A power inverter module includes a base module having a plurality of electrically conductive layers, including a first conductive layer, a second conductive layer and a third conductive layer. A first terminal is operatively connected to the first conductive layer at a first end and a second terminal is operatively connected to the second conductive layer at the first end. An isolation sheet is sandwiched between the first and second terminals. The first terminal and the second terminal include a respective proximal portion composed of a first material and a respective distal portion composed of a second material. At least one of the first terminal and the second terminal is bent to create an overlap zone such that a gap between the first terminal and the second terminal in the overlap zone is less than a threshold distance. The power inverter module is configured to reduce parasitic inductance.

Abstract: A power inverter module includes a base module having a plurality of electrically conductive layers, including a first conductive layer, a second conductive layer and a third conductive layer. A first terminal is operatively connected to the first conductive layer at a first end and a second terminal is operatively connected to the second conductive layer at the first end. An isolation sheet is sandwiched between the first and second terminals. The first terminal and the second terminal include a respective proximal portion composed of a first material and a respective distal portion composed of a second material. At least one of the first terminal and the second terminal is bent to create an overlap zone such that a gap between the first terminal and the second terminal in the overlap zone is less than a threshold distance. The power inverter module is configured to reduce parasitic inductance.

Abstract: Presented are electrical capacitors with interleaved busbar architectures, methods for making/operating such capacitors, and electric-drive vehicles equipped with such capacitors. A bulk capacitor includes multiple capacitor devices disposed within an outer housing and operable to modify electric current transmitted between a power source and an electrical load. An interleaved busbar package is interposed between the capacitor devices and outer housing. The interleaved busbar package includes a first busbar plate that electrically connects to first terminals of the capacitor devices and defines a busbar pocket. A second busbar plate is seated within the busbar pocket and electrically connects to second terminals of the capacitor devices. The second busbar plate includes a capacitor basin that seats therein the capacitor devices. An isolator sheet is interleaved between and electrically insulates the first and second busbar plates.

Abstract: An electrical device includes an electrical conductor and a printed circuit board assembly (PCBA). The PCBA includes a planar substrate having first and second primary surfaces. The second primary surface is adjacent to the electrical conductor. A point field detector is mounted to the first primary surface. A magnetic shielding array is constructed of a magnetic material, e.g., having a relative magnetic permeability of about 100-1000. The magnetic shielding array is mounted to or situated on the first and/or second primary surface of the planar substrate, and includes first and second flux shield portions flanking the point field detector. The point field detector and the magnetic shielding array are both located on the same side of the electrical conductor with respect to each other.

Abstract: A power module includes a first circuit structure having a first bus substrate. The first bus structure has a first side on which is disposed a first circuit element. A second circuit structure has a second bus substrate and a second side on which is disposed a second circuit element. The first circuit structure and the second circuit structure are oriented in a stacked configuration such that the first side is disposed facing the second side, and the first circuit element partially overlaps the second circuit element. An output bus is disposed between the first circuit structure and the second circuit structure.

Abstract: A power module assembly has a first substrate including a first layer, second layer and a third layer. The first layer is configured to carry a switch current flowing in a first direction. A second substrate is operatively connected to the first substrate and includes a fourth layer, fifth layer and a sixth layer. A conductive joining layer connects the third layer of the first substrate and the fourth layer of the second substrate. The conductive joining layer may be a first sintered layer. The third layer of the first substrate, the first sintered layer and the fourth layer of the second substrate are configured to function together as a unitary conducting layer carrying the switch current in a second direction substantially opposite to the first direction. The net inductance is reduced by a cancellation effect of the switch current going in opposite directions.

Abstract: An electric vehicle includes a direct current (DC) power source with a DC electric power output. An inverter is coupled to receive the DC electric power output of the DC power source, and the inverter has an alternating current (AC) electric power output. An electric motor is coupled to receive the AC electric power output. The electric motor has a driving torque output that is coupled to drive at least one wheel of the vehicle. The inverter further includes a power semiconductor switch, such as an insulated-gate bipolar transistor (IGBT). A protection circuit is coupled to the power semiconductor switch, and the protection circuit has an adjustable protection detection level circuit.

Abstract: A power module includes a first circuit structure having a first bus substrate. The first bus structure has a first side on which is disposed a first circuit element. A second circuit structure has a second bus substrate and a second side on which is disposed a second circuit element. The first circuit structure and the second circuit structure are oriented in a stacked configuration such that the first side is disposed facing the second side, and the first circuit element partially overlaps the second circuit element. An output bus is disposed between the first circuit structure and the second circuit structure.

Abstract: An electric vehicle includes a direct current (DC) power source with a DC electric power output. An inverter is coupled to receive the DC electric power output of the DC power source, and the inverter has an alternating current (AC) electric power output. An electric motor is coupled to receive the AC electric power output. The electric motor has a driving torque output that is coupled to drive at least one wheel of the vehicle. The inverter further includes a power semiconductor switch, such as an insulated-gate bipolar transistor (IGBT). A protection circuit is coupled to the power semiconductor switch, and the protection circuit has an adjustable protection detection level circuit.

Abstract: A power module assembly has a first substrate including a first layer, second layer and a third layer. The first layer is configured to carry a switch current flowing in a first direction. A second substrate is operatively connected to the first substrate and includes a fourth layer, fifth layer and a sixth layer. A conductive joining layer connects the third layer of the first substrate and the fourth layer of the second substrate. The conductive joining layer may be a first sintered layer. The third layer of the first substrate, the first sintered layer and the fourth layer of the second substrate are configured to function together as a unitary conducting layer carrying the switch current in a second direction substantially opposite to the first direction. The net inductance is reduced by a cancellation effect of the switch current going in opposite directions.

Abstract: A power module assembly has a plurality of electrically conducting layers, including a first layer and a third layer. One or more electrically insulating layers are operatively connected to each of the plurality of electrically conducting layers. The electrically insulating layers include a second layer positioned between and configured to electrically isolate the first and the third layers. The first layer is configured to carry a first current flowing in a first direction. The third layer is configured to carry a second current flowing in a second direction opposite to the first direction, thereby reducing an inductance of the assembly. The electrically insulating layers may include a fourth layer positioned between and configured to electrically isolate the third layer and a fifth layer. The assembly results in a combined substrate and heat sink structure. The assembly eliminates the requirements for connections between separate substrate and heat sink structures.

Abstract: A power module assembly has a plurality of electrically conducting layers, including a first layer and a third layer. One or more electrically insulating layers are operatively connected to each of the plurality of electrically conducting layers. The electrically insulating layers include a second layer positioned between and configured to electrically isolate the first and the third layers. The first layer is configured to carry a first current flowing in a first direction. The third layer is configured to carry a second current flowing in a second direction opposite to the first direction, thereby reducing an inductance of the assembly. The electrically insulating layers may include a fourth layer positioned between and configured to electrically isolate the third layer and a fifth layer. The assembly results in a combined substrate and heat sink structure. The assembly eliminates the requirements for connections between separate substrate and heat sink structures.

Abstract: A method for impedance measurement using chirp signal injection is provided. The method includes injecting at least one chirp signal into the three-phase AC system, and collecting at least one response to the at least one chirp signal. The method further includes transferring the at least one response from abc coordinates to dq coordinates. At least one impedance is calculated based on the at least one response to the at least one chirp signal.

Abstract: A method for impedance measurement in a three-phase AC system is provided. The method includes injecting a shunt perturbation signal into the three-phase AC system and collecting a response to the shunt perturbation signal, and injecting a series perturbation signal into the three-phase AC system and collecting a response to the series perturbation signal. The response to the shunt perturbation signal and the response to the series perturbation signal are then transferred from abc coordinate to dq coordinates. At least one impedance of the three-phase AC system is calculated based on the response to the shunt perturbation signal and the response to the series perturbation signal.

Abstract: A method for impedance measurement in a three-phase AC system is provided. The method includes injecting a shunt perturbation signal into the three-phase AC system and collecting a response to the shunt perturbation signal, and injecting a series perturbation signal into the three-phase AC system and collecting a response to the series perturbation signal. The response to the shunt perturbation signal and the response to the series perturbation signal are then transferred from abc coordinate to dq coordinates. At least one impedance of the three-phase AC system is calculated based on the response to the shunt perturbation signal and the response to the series perturbation signal.

Abstract: A method for impedance measurement using chirp signal injection is provided. The method includes injecting at least one chirp signal into the three-phase AC system, and collecting at least one response to the at least one chirp signal. The method further includes transferring the at least one response from abc coordinates to dq coordinates. At least one impedance is calculated based on the at least one response to the at least one chirp signal.