Patents by Inventor Marko Magerl

Marko Magerl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11887937
    Abstract: An apparatus comprises a ground plane (2), an integrated circuit chip (1) disposed on the ground plane (2), the integrated circuit chip (1) comprising one or more electrically conductive layers (10) encircling a periphery of the integrated circuit chip (1), and a plurality of bondwires (9) electrically coupling the one or more electrically conductive layers (10) to the ground plane (2).
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: January 30, 2024
    Assignee: ams International AG
    Inventors: Benjamin Joseph Sheahan, Richard Jennings, Robert Allen Helmick, Marko Magerl, Christian Stockreiter
  • Publication number: 20220254729
    Abstract: An apparatus comprises a ground plane (2), an integrated circuit chip (1) disposed on the ground plane (2), the integrated circuit chip (1) comprising one or more electrically conductive layers (10) encircling a periphery of the integrated circuit chip (1), and a plurality of bondwires (9) electrically coupling the one or more electrically conductive layers (10) to the ground plane (2).
    Type: Application
    Filed: February 3, 2020
    Publication date: August 11, 2022
    Inventors: Benjamin Joseph Sheahan, Richard Jennings, Robert Allen Helmick, Marko Magerl, Christian Stockreiter