Abstract: A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.

Abstract: A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.

Abstract: An outdoor, hardened telecommunications clamshell platform includes a base half and a top cover half. The platform also includes a Printed Circuit Board (PCB) disposed between two cooling plates within the platform, and a heat distributing mechanism surrounding the PCB within the platform and configured to distribute heat substantially evenly between the base half and the top cover half.

Abstract: A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.

Abstract: An outdoor, hardened telecommunications clamshell platform includes a base half and a top cover half. The platform also includes a Printed Circuit Board (PCB) disposed between two cooling plates within the platform, and a heat distributing mechanism surrounding the PCB within the platform and configured to distribute heat substantially evenly between the base half and the top cover half.

Abstract: A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.

Abstract: Disclosed is an apparatus and method for connecting a power feeder cable at a point for convenient operator access to an electrical subsystem located inside of a telecom equipment assembly. According to one embodiment, the terminal connection of the power feeder cable to the power entry point is positioned so as to be conveniently accessible to an operator from the telecom equipment aisle. According to another embodiment, a linking bus structure comprising, a first connector, a conducting path and a second connector, is mounted inside the telecom equipment assembly with the first connector positioned at the front panel of the telecom equipment assembly and conveniently accessible to an operator from the telecom equipment aisle. The apparatus and method are useful for overcoming difficulties normally encountered during inspection and maintenance of the connection of the power feeder cable at its terminal connection in a telecom equipment assembly.

Abstract: A method and apparatus is disclosed for acoustic noise reduction using fan speed control. The acoustic noise reduction using fan speed control includes a plurality of temperature detectors disposed at a plurality of locations within an electronics equipment enclosure, each detector having an associated setpoint temperature. An error value is determined for each temperature detector, the error consisting of the difference between the detected temperature and the associated setpoint temperature. The maximum error among all error values is then identified and the operating speed of a cooling fan in is set in response to this maximum error. Advantages include providing a fan speed directly related to electronics temperature which inherently accounts for higher ambient temperatures, enclosure altitude, electronics power consumption, and air filter clogging.

Abstract: A method of electrical isolation for printed circuit board gasketing is disclosed for enabling gasketing to overlay plated through holes without shorting out thereto. The method of electrical isolation for printed circuit board gasketing includes counterboring at a controlled width to a controlled depth those plated through holes underlying the gasketing. The method provides the advantage of being able to overlay gasketing on both surfaces of a printed circuit board mid-plane. The method of electrical isolation for printed circuit board gasketing is particularly useful for overcoming the additional material requirements and processing steps of electrical isolation known in the art.

Abstract: An air flow distribution system for a telecommunication equipment assembly is disclosed. The telecommunications equipment assembly includes a chassis. The chassis is formed by wall panels and includes a first side, a second side, a bottom end section, a top end section, electronic apparatuses regions and a plenum region having plenum region boundaries. The telecommunication equipment assembly also includes a first side air input port and a second side air input port in the bottom end section of the chassis. The input ports permit cooling air to be drawn into the chassis. An output port is provided in the top end section of the chassis. A fan holder is located along one of the plenum region boundaries. The fan holder receives a fan to facilitate air movement in conjunction with the plenum region. The air movement includes movement along air flow paths through the electronic apparatuses regions. The electronic apparatuses and plenum regions are located above the input ports and below the output port.

Abstract: A method and apparatus is disclosed for acoustic noise reduction using fan speed control. The acoustic noise reduction using fan speed control includes a plurality of temperature detectors disposed at a plurality of locations within an electronics equipment enclosure, each detector having an associated setpoint temperature. An error value is determined for each temperature detector, the error consisting of the difference between the detected temperature and the associated setpoint temperature. The maximum error among all error values is then identified and the operating speed of a cooling fan in is set in response to this maximum error. Advantages include providing a fan speed directly related to electronics temperature which inherently accounts for higher ambient temperatures, enclosure altitude, electronics power consumption, and air filter clogging.

Abstract: A method of electrical isolation for printed circuit board gasketing is disclosed for enabling gasketing to overlay plated through holes without shorting out thereto. The method of electrical isolation for printed circuit board gasketing includes counterboring at a controlled width to a controlled depth those plated through holes underlying the gasketing. The method provides the advantage of being able to overlay gasketing on both surfaces of a printed circuit board mid-plane. The method of electrical isolation for printed circuit board gasketing is particularly useful for overcoming the additional material requirements and processing steps of electrical isolation known in the art.

Abstract: The invention refers to a telecommunications system comprising a module rack that defines a core bay, a service plane and a rack interface plane where the service plane is transverse to the rack interface plane. The core bay is in part bounded by the service plane and the rack interface plane. The telecommunications system also comprises a series of electronics modules each defining an electronics orientation plane where each of the modules includes two opposed cooling surfaces oriented substantially parallel to the electronics orientation plane. Each of the electronics modules is removably secured within the core bay. The series of the electronics modules forms an array such that their electronics orientation planes are substantially perpendicular to both the rack interface plane and the service plane. The array also defines at least one coolant stream passage across each cooling surface.

Abstract: The invention refers to a telecommunications system comprising a module rack that defines a core bay, a service plane and a rack interface plane where the service plane is transverse to the rack interface plane. The core bay is in part bounded by the service plane and the rack interface plane. The telecommunications system also comprises a series of electronics modules each defining an electronics orientation plane where each of the modules includes two opposed cooling surfaces oriented substantially parallel to the electronics orientation plane. Each of the electronics modules is removably secured within the core bay. The series of the electronics modules forms an array such that their electronics orientation planes are substantially perpendicular to both the rack interface plane and the service plane. The array also defines at least one coolant stream passage across each cooling surface.

Abstract: A filler module is slidably mountable in an otherwise unused slot of a multi-slot, multi-module electronic system housed in a casing. The filler module includes a relatively compact housing which engages an EMI gasket and an electric connector in an unused slot at the backplane of a shelf in the casing. The module also includes a non-conductive, rigid extension element which facilitates air flow between adjacent modules within the rack. The extension element may include electrically conductive strips which provide ESD protection during the insertion of the module through intimate contact with a grounded, resilient contacting surface. The module may also comprise a non-conductive bulkhead with pivoted latches which engage the casing to secure the housing to the backplane. In this way, a filler module is achieved in which EMI containment is accomplished in a modular fashion and air flow is maintained in the shelf independent of the number or position of used and unused slots.

Abstract: An electronic assembly of two planar electronic devices for insertion into a shelf for back plane connection. Each device may be a printed circuit board or a circuit pack incorporating such a board. A flexible flat cable extends between front ends of the devices to interconnect their circuitry. This cable is torsionally flexible to allow relative pivoting movement of the electronic devices in their respective planes. The cable is also bendably flexible to allow movement towards each other or apart of the rears of the electronic devices. A movement limiting device restricts the degree of relative movement of the electronic devices. The relative movement overcomes tolerance issues between terminal positions of one device relative to the other during connection into the back plane and damage to terminals and connectors is avoided.