Patents by Inventor Marko Nivala

Marko Nivala has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High power light-emitting diode package and methods for making same
    Patent number: 7202505
    Abstract: In a light-emitting diode package made in accordance with the present invention, a light-emitting diode assembly is positioned above a spacer assembly. In the light-emitting diode assembly, a die containing a light-emitting diode is positioned above a substrate. During operation, both the combination of at least one conductive plate adjacent to the die and a plurality of castellated side holes positioned on sides of the substrate, and a substrate thermal via positioned beneath the die, conduct thermal energy from the die to a light-emitting diode assembly pad on which the substrate is mounted. The light-emitting diode assembly pad conducts thermal energy to a top pad of the spacer assembly. A plurality of castellated side holes formed in sides of a spacer of the spacer assembly and a plurality of thermal vias positioned within the spacer conduct thermal energy from the top pad of the spacer assembly to a base pad of the spacer assembly.
    Type: Grant
    Filed: April 29, 2005
    Date of Patent: April 10, 2007
    Assignee: Nokia Corporation
    Inventors: Janne Nurminen, Marko Nivala, Jarkko Kivelä
  • High power light-emitting diode package and methods for making same
    Publication number: 20060243998
    Abstract: In a light-emitting diode package made in accordance with the present invention, a light-emitting diode assembly is positioned above a spacer assembly. In the light-emitting diode assembly, a die containing a light-emitting diode is positioned above a substrate. During operation, both the combination of at least one conductive plate adjacent to the die and a plurality of castellated side holes positioned on sides of the substrate, and a substrate thermal via positioned beneath the die, conduct thermal energy from the die to a light-emitting diode assembly pad on which the substrate is mounted. The light-emitting diode assembly pad conducts thermal energy to a top pad of the spacer assembly. A plurality of castellated side holes formed in sides of a spacer of the spacer assembly and a plurality of thermal vias positioned within the spacer conduct thermal energy from the top pad of the spacer assembly to a base pad of the spacer assembly.
    Type: Application
    Filed: April 29, 2005
    Publication date: November 2, 2006
    Inventors: Janne Nurminen, Marko Nivala, Jarkko Kivela