Abstract: A group of models are developed to predict printed contour deviations relative to the corresponding layout edges for different classes of layout topologies. A plurality of calibration layouts with topologies belonging to a class of layout topologies are used to generate a model for the class of layout topologies. A standard least square regression is modified for model creation. The model error may be monitored dynamically.

Abstract: Shapes neighboring a potential manufacturing fault within a microdevice design layout are identified. Models are employed to determine the affect of the shapes upon the potential manufacturing fault. Possible adjustments to the shapes are modeled. The possible adjustments facilitating resolution of the potential manufacturing fault.

Abstract: A group of models are developed to predict printed contour deviations relative to the corresponding layout edges for different classes of layout topologies. A plurality of calibration layouts with topologies belonging to a class of layout topologies are used to generate a model for the class of layout topologies. A standard least square regression is modified for model creation. The model error may be monitored dynamically.

Abstract: A system and a method of maximizing the manufacturing yield of integrated circuit (“IC”) design using IC fabrication process simulation driven layout optimization is described. An IC design layout is automatically modified through formulation of a layout optimization problem utilizing the results of layout fabrication process compliance analysis tools. The modification of layout is performed adaptively and iteratively to make an IC layout less susceptible to yield issues while maintaining design rule correctness and minimal circuit performance impact.

Abstract: Some embodiments of the invention provide a system and method where a physical design (“PD”) process can use simplified manufacturing rules to generate an integrated circuit (“IC”) layout. A layout optimization process transforms the PD generated layout to become more manufacturing rule compliant layout using a full set of manufacturing rules. The invention increases the probability of the PD process successfully generates an IC layout since the PD is not burdened with having to consider the full complexity of the manufacturing rules.

Abstract: Integrated circuit mask layouts are modified for the purpose of migration to abide a new set of design rules, or for the purpose of optimization for timing, power, signal integrity and manufacturability, among other purposes. The modified layout is required to satisfy a set of constraints generated from design rules, electrical specifications, user specifications among other requirements. The present invention provides a system and a method of representing constraint sets, each of which consists of two or more sets of constraints that are mutually exclusive to each other. In the preferred embodiment, one method of formulation is presented, and a method of solving the layout modification problem under the constraint sets is presented.

Abstract: A system and a method of creating context dependent yield variants of integrated circuit (“IC”) design components and using these variants during a physical design of an IC block to maximize manufacturing yield are described. A plurality of variants of each design component is generated and characterized with manufacturing yield as a function of neighboring context (“context”) that includes, but is not limited to, neighboring design components and other layout objects and shapes. The present invention describes a system and method where a physical design process, in addition to satisfying design and performance requirements such as, but not limited to, power, timing, signal integrity and minimal layout area, selects context dependent yield variants to maximize manufacturing yield.

Abstract: In various implementations of the invention, a model of an optical proximity correction process is employed to determine potential adjustments to a layout design for a mask that might resolve potential errors an image resulting from application of the mask in an optical lithographic process. In various implementations of the invention, corrected mask shapes, such as for example optical proximity corrected mask shapes, and associated printed image contours are generated through use of a model. Subsequently, the associated printed image contour and a desired printed image contour may be used to determine various edge segment adjustments to the corrected mask shapes that would realize the desired printed image contour. In various implementations of the present invention, the model for generation of the corrected mask shapes and the associated printed image contour is a square kernel model.

Abstract: Shapes neighboring a potential manufacturing fault within a microdevice design layout are identified. Models are employed to determine the affect of the shapes upon the potential manufacturing fault. Possible adjustments to the shapes are modeled. The possible adjustments facilitating resolution of the potential manufacturing fault.

Abstract: A system and a method of maximizing the manufacturing yield of integrated circuit (“IC”) design using IC fabrication process simulation driven layout optimization is described. An IC design layout is automatically modified through formulation of a layout optimization problem utilizing the results of layout fabrication process compliance analysis tools. The modification of layout is performed adaptively and iteratively to make an IC layout less susceptible to yield issues while maintaining design rule correctness and minimal circuit performance impact.

Abstract: A system and a method of creating context dependent yield variants of integrated circuit (“IC”) design components and using these variants during a physical design of an IC block to maximize manufacturing yield are described. A plurality of variants of each design component is generated and characterized with manufacturing yield as a function of neighboring context (“context”) that includes, but is not limited to, neighboring design components and other layout objects and shapes. The present invention describes a system and method where a physical design process, in addition to satisfying design and performance requirements such as, but not limited to, power, timing, signal integrity and minimal layout area, selects context dependent yield variants to maximize manufacturing yield.

Abstract: Integrated circuit mask layouts are modified for the purpose of migration to abide a new set of design rules, or for the purpose of optimization for timing, power, signal integrity and manufacturability, among other purposes. The modified layout is required to satisfy a set of constraints generated from design rules, electrical specifications, user specifications among other requirements. The present invention provides a system and a method of representing constraint sets, each of which consists of two or more sets of constraints that are mutually exclusive to each other. In the preferred embodiment, one method of formulation is presented, and a method of solving the layout modification problem under the constraint sets is presented.