Abstract: The invention relates to an LED assembly comprising a carrier (T, T?), at least one LED chip (2, 102) which is arranged on the carrier (T, T?), the LED chip (2, 102) being connected to at least one bonding wire (3, 103), a transparent layer (8, 108) applied over the LED chip (2, 102) and a frame (4, 104) which surrounds the at least one LED chip (2, 102). The frame (4, 104) comprises at least one web (5, 105) so as to divide the frame (4, 104) into at least a first frame region (6, 106), which comprises the at least one LED chip (2, 102), and at least a second frame region (7, 107). The first frame region (6, 106) laterally delimits the layer (8, 108) and the second frame region (7, 107) forms a protective region for the at least one bonding wire (3, 103). By means of the assembly according to the invention, an LED assembly can be achieved which is of simple construction, can be easily assembled and also effectively protects the bonding wires against mechanical influences.

Abstract: The invention relates to an LED assembly comprising a carrier (T, T?), at least one LED chip (2, 102) which is arranged on the carrier (T, T?), the LED chip (2, 102) being connected to at least one bonding wire (3, 103), a transparent layer (8, 108) applied over the LED chip (2, 102) and a frame (4, 104) which surrounds the at least one LED chip (2, 102). The frame (4, 104) comprises at least one web (5, 105) so as to divide the frame (4, 104) into at least a first frame region (6, 106), which comprises the at least one LED chip (2, 102), and at least a second frame region (7, 107). The first frame region (6, 106) laterally delimits the layer (8, 108) and the second frame region (7, 107) forms a protective region for the at least one bonding wire (3, 103). By means of the assembly according to the invention, an LED assembly can be achieved which is of simple construction, can be easily assembled and also effectively protects the bonding wires against mechanical influences.