Patents by Inventor Marko Theodoor Blom

Marko Theodoor Blom has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240123445
    Abstract: The invention relates to a pressure driven microfluidic chip for delivering a first liquid at a determined flow rate, said chip comprising a first inlet, a container connected to the first inlet, a second inlet connected to the container via a first passage, a second passage connecting the container to an outlet, wherein the first passage has a first resistance to liquid flow, and the second passage has a second resistance to liquid flow. The first resistance may be higher than the second resistance. The invention also relates to a pressure driven method of delivering a first liquid at a determined flow rate comprising using a chip first a first and second passage, wherein the first passage has a first resistance to the flow of the first liquid, and the second passage has a second resistance to flow of the second liquid.
    Type: Application
    Filed: February 10, 2022
    Publication date: April 18, 2024
    Applicants: Micronit Holding B.V., Enzyre B.V.
    Inventors: Elwin Xander Vrouwe, Henrieke Anne Meijer, Marko Theodoor Blom
  • Publication number: 20240002763
    Abstract: A microfluidic cell culture device includes a body having a fluid system including a first fluid chamber, a second fluid chamber, a cell culture chamber and a flow channel for allowing a flow of fluid from the first chamber, via the cell culture chamber, towards the said second chamber upon coupling of a pressure pump system to said fluid system. The fluid system also includes a return channel formed in the body allowing a flow of fluid from the second chamber to the first chamber.
    Type: Application
    Filed: October 6, 2021
    Publication date: January 4, 2024
    Applicant: MICRONIT HOLDING B.V.
    Inventors: Sandro MEUCCI, Bianka FABINYI, Jasper Hendrik TEN NAPEL, Marko Theodoor BLOM
  • Patent number: 10493454
    Abstract: The invention relates to a device (20), comprising: a liquid container (21) for containing a liquid; a capillary-stop valve (22) that is in medium through flow connection with said liquid container (21) for stopping said liquid in said container from flowing out of said container via said capillary-stop valve (22); a first electrode (7) being arranged such that in use said first electrode is in contact with said liquid in said liquid container; a second electrode (2) that is spaced apart from said capillary-stop valve by an electrically insulating medium gap (24), and a voltage source (V) connected to said first and second electrode which is activatable for applying an electric potential difference at the first and second electrode such that the liquid in the liquid container is attracted in the direction of said second electrode so as to allow the liquid to overcome the stopping effect of the capillary-stop valve for discharging liquid from said liquid container via said capillary-stop valve.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: December 3, 2019
    Assignee: Micronit Microtechnologies B.V.
    Inventors: Elwin Xander Vrouwe, Manjeet Dhindsa, Marinus Bernardus Olde Riekerink, Ronny Van't Oever, Marko Theodoor Blom
  • Patent number: 10254280
    Abstract: The invention relates to a channel for trapping particles to be fed to the channel with a fluid. The invention further relates to a flow cell comprising such a channel. The invention also relates to an assembly comprising such a flow cell and a detection means. The invention also relates to a method for trapping particles in such a channel. And finally, the invention relates to a method for analyzing a sample using such an assembly.
    Type: Grant
    Filed: August 10, 2016
    Date of Patent: April 9, 2019
    Assignees: Micronit Microtechnologies B.V., Janssen Pharmaceutica NV, NXP B.V.
    Inventors: Marko Theodoor Blom, Monica Brivio, Simone Tanzi, Simon Reuvekamp, Bieke Van Dorst, Lieven Jozef Stuyver, Elfried Van Der Sar
  • Patent number: 9748136
    Abstract: A method for forming an electrically conductive via in a substrate that includes the steps of: forming a through hole in a first substrate; bringing a first surface of a second substrate into contact with the first surface of the first substrate, such that the through hole in the first substrate is covered by the first surface of the second substrate; filling the through hole in the first substrate with an electrically conductive material by electroplating to form the electrically conductive via, and removing the second substrate, wherein the first surface of the first and the second substrate each have a surface roughness Ra of less than 2 nm, preferably less than 1 nm, more preferably less than 0.5 nm, and the first surface of the first and the second substrate are brought in direct contact with each other, such that a direct bond is formed there between.
    Type: Grant
    Filed: November 5, 2013
    Date of Patent: August 29, 2017
    Assignee: Micronit Microfluidics B.V.
    Inventors: Ronny Van 'T Oever, Marko Theodoor Blom, Jeroen Haneveld, Johannes Oonk, Peter Tijssen
  • Publication number: 20170183223
    Abstract: The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.
    Type: Application
    Filed: January 10, 2017
    Publication date: June 29, 2017
    Inventors: Ronny VAN 'T OEVER, Marko Theodoor BLOM, Jeroen HANEVELD, Johannes OONK, Marinus Bernardus OLDE RIEKERINK, Peter TIJSSEN, Hendrik Jan Hildebrand TIGELAAR, Jean-Noël FEHR, Jean-Christophe ROULET, Amitava GUPTA
  • Patent number: 9636673
    Abstract: The invention relates to a method for manufacturing microfluidic chips having at least one capillary for through-flow of a fluid, comprising the steps of: (a) providing a starting material; (b) forming at least one shared capillary in the starting material, said shared capillary comprising an fluidic inlet and an fluidic outlet; (c) functionalizing the chips by supplying a functionalization fluid to the shared capillary; and (d) dividing the starting material into separate chips. The invention further relates to a device for functionalizing microfluidic chips having at least one capillary for through-flow of a fluid, said device comprising a material holder for holding a starting material in a fixed position during functionalization, said material holder comprising at least one inlet connector for connecting at least one shared capillary formed in the starting material to a functionalization fluid supply. The invention further relates to a microfluidic chip and a device for holding a microfluidic chip.
    Type: Grant
    Filed: March 1, 2013
    Date of Patent: May 2, 2017
    Assignee: Micronit Microfluidics B.V.
    Inventors: Marinus Bernardus Olde Riekerink, Wilfred Buesink, Arenda Hendrika Jacoba Koelewijn-Hubers, Marko Theodoor Blom, Ronny van 't Oever
  • Patent number: 9573804
    Abstract: The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: February 21, 2017
    Assignee: Micronit Microfluidics B.V.
    Inventors: Ronny Van 'T Oever, Marko Theodoor Blom, Jeroen Haneveld, Johannes Oonk, Marinus Bernardus Olde Riekerink, Peter Tijssen, Hendrik Jan Hildebrand Tigelaar, Jean-Noël Fehr, Jean-Christophe Roulet, Amitava Gupta
  • Publication number: 20170045504
    Abstract: The invention relates to a channel for trapping particles to be fed to the channel with a fluid. The invention further relates to a flow cell comprising such a channel. The invention also relates to an assembly comprising such a flow cell and a detection means. The invention also relates to a method for trapping particles in such a channel. And finally, the invention relates to a method for analyzing a sample using such an assembly.
    Type: Application
    Filed: August 10, 2016
    Publication date: February 16, 2017
    Inventors: Marko Theodoor BLOM, Monica BRIVIO, Simone TANZI, Simon REUVEKAMP, Bieke VAN DORST, Lieven Jozef STUYVER, Elfried VAN DER SAR
  • Publication number: 20160231163
    Abstract: The invention relates to a device for measuring a volume of a liquid, said device comprising:—a receptacle for receiving said liquid, said receptacle comprising an inlet opening and an outlet opening, and—a capillary channel having capillary action, which capillary channel has a predetermined internal transverse cross-section, wherein an inlet opening of the capillary channel at an first end thereof is in liquid through flow connection with the outlet opening of the receptacle and wherein the other, second end of the capillary channel comprises an opening; wherein:—the inlet opening of the receptacle has a larger transverse cross-section than the inlet opening of said capillary channel, and—a length of a liquid slug in the capillary channel is a measure for said volume.
    Type: Application
    Filed: December 24, 2014
    Publication date: August 11, 2016
    Inventors: Ronny Van 't Oever, Marko Theodoor Blom, Adriaan Johannes Nutma, Herman Jacobus Blok
  • Patent number: 9387475
    Abstract: An assembly comprising at least one microfluidic device and a mounting piece, this microfluidic device comprising at least one material layer and at least one first fluidic port, which first fluidic port it situated at least partially in an end surface of the material layer and which mounting piece comprises at least one fluidic component, wherein the mounting piece is coupled to the microfluidic device by means of first coupling means provided for this purpose such that the fluidic component is connected to the first fluidic port. The invention also relates to such a mounting piece.
    Type: Grant
    Filed: August 31, 2007
    Date of Patent: July 12, 2016
    Assignee: Micronit Microfluidics B.V.
    Inventors: Ronny Van't Oever, Marko Theodoor Blom
  • Publication number: 20150262874
    Abstract: The invention relates to a method for forming an electrically conductive via in a substrate and such a substrate comprising an electrically conductive, said method comprising the steps, to be performed in suitable sequence, of: a) providing a first substrate as said substrate; b) forming a through hole in said first substrate; c) providing a second substrate; d) bringing a first surface of said second substrate into contact with said first surface of said first substrate, such that said through hole in said first substrate is covered by said first surface of said second substrate; e) filling said through hole in said first substrate with an electrically conductive material by means of electroplating for forming said electrically conductive via, and f) removing said second substrate, wherein said first surface of said first substrate and said first surface of said second substrate each have a surface roughness R a of less than 2 nm, preferably less than 1 nm, more preferably less than 0.
    Type: Application
    Filed: November 5, 2013
    Publication date: September 17, 2015
    Inventors: Ronny Van'T Oever, Marko Theodoor Blom, Jeroen Haneveld, Johannes Oonk, Peter Tijssen
  • Publication number: 20150238961
    Abstract: The invention relates to a device (20), comprising: a liquid container (21) for containing a liquid; a capillary-stop valve (22) that is in medium through flow connection with said liquid container (21) for stopping said liquid in said container from flowing out of said container via said capillary-stop valve (22); a first electrode (7) being arranged such that in use said first electrode is in contact with said liquid in said liquid container; a second electrode (2) that is spaced apart from said capillary-stop valve by an electrically insulating medium gap (24), and a voltage source (V) connected to said first and second electrode which is activatable for applying an electric potential difference at the first and second electrode such that the liquid in the liquid container is attracted in the direction of said second electrode so as to allow the liquid to overcome the stopping effect of the capillary-stop valve for discharging liquid from said liquid container via said capillary-stop valve.
    Type: Application
    Filed: September 25, 2013
    Publication date: August 27, 2015
    Inventors: Elwin Xander Vrouwe, Manjeet Dhindsa, Marinus Bernardus Olde Riekerink, Ronny Van 'T Oever, Marko Theodoor Blom
  • Publication number: 20140335301
    Abstract: The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.
    Type: Application
    Filed: December 21, 2012
    Publication date: November 13, 2014
    Inventors: Ronny Van 'T Oever, Marko Theodoor Blom, Jeroen Haneveld, Johannes Oonk, Marinus Bernardus Olde Riekerink, Peter Tijssen, Hendrik Jan Hildebrand Tigelaar, Jean-Noël Fehr, Jean-Christophe Roulet, Amitava Gupta
  • Publication number: 20140246801
    Abstract: The invention relates to a method for manufacturing microfluidic chips having at least one capillary for through-flow of a fluid, comprising the steps of: (a) providing a starting material; (b) forming at least one shared capillary in the starting material, said shared capillary comprising an fluidic inlet and an fluidic outlet; (c) functionalizing the chips by supplying a functionalization fluid to the shared capillary; and (d) dividing the starting material into separate chips. The invention further relates to a device for functionalizing microfluidic chips having at least one capillary for through-flow of a fluid, said device comprising a material holder for holding a starting material in a fixed position during functionalization, said material holder comprising at least one inlet connector for connecting at least one shared capillary formed in the starting material to a functionalization fluid supply. The invention further relates to a microfluidic chip and a device for holding a microfluidic chip.
    Type: Application
    Filed: March 1, 2013
    Publication date: September 4, 2014
    Applicant: MICRONIT MICROFLUIDICS B.V.
    Inventors: Marinus Bernardus OLDE RIEKERINK, Wilfred BUESINK, Arenda Hendrika Jacoba KOELEWIJN-HUBERS, Marko Theodoor BLOM, Ronny VAN 'T OEVER
  • Patent number: 8740448
    Abstract: A micromixing chamber, roughly in the form of an hourglass, having a first outer end with a tangential inflow opening and a second outer end with a tangential outflow opening. The mixing chamber in the overall flow direction first narrows more or less gradually and subsequently widens more or less abruptly. The micromixer may be made at least partially of glass, or at least partially of a plurality of glass plates. A micromixer having a plurality of such micromixing chambers connected fluidically in series is also disclosed. Methods for manufacturing such a micromixing chamber of such a micromixer, as well as method for mixing by means of such a micromixing chamber or by means of such a micromixer, are disclosed.
    Type: Grant
    Filed: November 5, 2007
    Date of Patent: June 3, 2014
    Inventors: Marko Theodoor Blom, Michael Christiaan Mulder, Jordan Macleod Macinnes, Raymond William Kenneth Allen
  • Patent number: 8522413
    Abstract: A system for fluidic coupling and uncoupling of fluidic conduits and a microfluidic chip, wherein the fluidic conduits are connected mechanically to a first structural part and the microfluidic chip is carried by a second structural part. The structural parts are moved perpendicularly toward and away from each other by means of a mechanism provided for this purpose. Outer ends of the fluidic conduits can thus be moved over a determined distance substantially perpendicularly to the outer surface of the microfluidic chip and connecting openings in the outer surface of the microfluidic chip. This enables accurate realization of fluidic coupling and uncoupling without the occurrence of undesirable moments of force and with minimal risk of damage to the fluidic conduits or the connecting openings. With such system requirements which can be set in respect of convenience, speed, temperature resistance, sealing, chemical resistance, reproducibility and so forth, can be fulfilled.
    Type: Grant
    Filed: June 23, 2008
    Date of Patent: September 3, 2013
    Assignee: Micronit Microfluids B.V.
    Inventors: Ronny Van't Oever, Marko Theodoor Blom, Wilfred Buesink
  • Publication number: 20130050639
    Abstract: An ophthalmic lens including an electro-active optical element including a substrate; a liquid crystalline material; and at least one first layer. The at least one first layer can include a layer of silicon oxide (SiOx) disposed between the liquid crystalline material and the substrate, and deposited onto a surface of the substrate at an oblique angle in reference to a plane normal to the mean surface of the substrate facing the liquid crystalline material.
    Type: Application
    Filed: August 20, 2012
    Publication date: February 28, 2013
    Applicant: PixelOptics, Inc.
    Inventors: Anita Trajkovska, Joshua N. Haddock, Ronald Blum, Amitava Gupta, Marko Theodoor Blom, Peter Tijssen
  • Patent number: 8343441
    Abstract: Aspects of the invention include methods and devices for manufacturing and testing microfluidic chips having at least one capillary for through-flow of a fluid.
    Type: Grant
    Filed: June 25, 2010
    Date of Patent: January 1, 2013
    Assignee: Micronit Microfluidics B.V.
    Inventors: Ronny van 't Oever, Marko Theodoor Blom
  • Publication number: 20110000283
    Abstract: Aspects of the invention include methods and devices for manufacturing and testing microfluidic chips having at least one capillary for through-flow of a fluid.
    Type: Application
    Filed: June 25, 2010
    Publication date: January 6, 2011
    Inventors: Ronny van 't Oever, Marko Theodoor Blom