Abstract: An apparatus and method for mounting devices on a substrate. Processing is often interrupted during operation because the components are not provided for assembly parallel to the substrate. Inclination control solutions increase the cost, weight and complexity of the bonding head. By tilting the contact surface using existing drives and/or actuators, simplified tilt correction is made possible, providing high throughput and high reliability. The tilt correction mechanism consists of one or more engagement members, one or more adjustment members and one or more tilt position blocks. In some cases, passive elements and mechanisms may be used.

Abstract: An apparatus and method for mounting devices on a substrate. Processing is often interrupted during operation because the components are not provided for assembly parallel to the substrate. Inclination control solutions increase the cost, weight and complexity of the bonding head. By tilting the contact surface using existing drives and/or actuators, simplified tilt correction is made possible, providing high throughput and high reliability. The tilt correction mechanism consists of one or more engagement members, one or more adjustment members and one or more tilt position blocks. In some cases, passive elements and mechanisms may be used.

Abstract: An apparatus for a forming bundle composed of at least one layer of printed products includes a lift, wherein an area above the lift constitutes a holding space to accommodate the at least one layer. The lift is adapted to lower the at least one layer. A control unit is connected to control movement of the lift. A thickness determining device is coupled to the control unit and arranged to determine a thickness of the at least one layer. The lift is controlled to be lowered corresponding to a previously determined thickness of a layer to accommodate a following layer of a bundle or to accommodate a layer of a following bundle.

Abstract: An apparatus for a forming bundle composed of at least one layer of printed products includes a lift, wherein an area above the lift constitutes a holding space to accommodate the at least one layer. The lift is adapted to lower the at least one layer. A control unit is connected to control movement of the lift. A thickness determining device is coupled to the control unit and arranged to determine a thickness of the at least one layer. The lift is controlled to be lowered corresponding to a previously determined thickness of a layer to accommodate a following layer of a bundle or to accommodate a layer of a following bundle.