Patents by Inventor Markus Bebendorf

Markus Bebendorf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing a circuit board arrangement
    Patent number: 12279380
    Abstract: A method for producing a circuit board arrangement includes: providing a first circuit board substrate, providing a second circuit board substrate, arranged substantially planar-parallel to the first circuit board substrate, the first circuit board substrate having an underside and the second circuit board substrate having an upper face, the upper face and the underside being arranged opposite one another, providing first terminal contacts, applied to the underside of the first circuit board substrate, providing second terminal contacts, applied to the upper face of the second circuit board substrate, applying solder paste cylinders to the first terminal contacts, the solder paste cylinders applied to the first terminal contacts by a solder-paste application process with solder paste, the applied solder paste cylinders having in each case a solder-paste-cylinder upper face, and arranging the second terminal contacts of the second circuit board substrate on the solder-paste-cylinder upper faces of the solder p
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: April 15, 2025
    Assignee: CONTINENTAL AUTOMOTIVE GMBH
    Inventors: Rafael Del Rey, Markus Bebendorf
  • METHOD FOR PRODUCING A CIRCUIT BOARD ARRANGEMENT, AND CIRCUIT BOARD ARRANGEMENT
    Publication number: 20210329793
    Abstract: A method for producing a circuit board arrangement includes: providing a first circuit board substrate, providing a second circuit board substrate, arranged substantially planar-parallel to the first circuit board substrate, the first circuit board substrate having an underside and the second circuit board substrate having an upper face, the upper face and the underside being arranged opposite one another, providing first terminal contacts, applied to the underside of the first circuit board substrate, providing second terminal contacts, applied to the upper face of the second circuit board substrate, applying solder paste cylinders to the first terminal contacts, the solder paste cylinders applied to the first terminal contacts by a solder-paste application process with solder paste, the applied solder paste cylinders having in each case a solder-paste-cylinder upper face, and arranging the second terminal contacts of the second circuit board substrate on the solder-paste-cylinder upper faces of the solder p
    Type: Application
    Filed: September 10, 2019
    Publication date: October 21, 2021
    Inventors: Rafael Del Rey, Markus Bebendorf