Patents by Inventor Markus Bendler

Markus Bendler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250069145
    Abstract: An asset management system or platform which enables stakeholders to monitor, service, and maintain physical assets. The asset management system is comprised of a platform existing on a computer system and a plurality of separate and discrete sub-data structures, there being one sub-data structure for each stakeholder. The data for an asset is distributed among multiple of the sub-data structures. Using the platform, a user can view all necessary information related to an asset even though the particular user does not have direct access to the data. Rather, the platform pulls the relevant data from relevant sub-data structures and provides the user to view and edit the information based on permissions.
    Type: Application
    Filed: November 8, 2024
    Publication date: February 27, 2025
    Inventors: Anne Marie PELLERIN, Florian SCHOLOCHOW, Sonja FIEGL, Markus BÜRGLER, Matthias BENDLER, Ivan LEUZZI
  • Patent number: 9927379
    Abstract: A thermoanalytical sensor has a substrate, a measurement position, a temperature sensor unit, and an electrical contact pad. The temperature sensor unit senses the temperature at the measurement position. It is connected via the electrical contact pad to a metallic wire and thereby tied into an electronic circuit. The substrate is prepared with at least one measurement position, at least one temperature sensor unit and at least one electrical contact pad on a top side of the substrate. A passage in the substrate allows connection to the electrical contact pad. A metallic wire is inserted into the passage from the bottom side of the substrate and melted into a small ball on the upper end of the wire. A materially integral connection as a bonded joint between the upper end of the metallic wire and the electrical contact pad is made by applying pressure and heat to the metal ball.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: March 27, 2018
    Assignee: Mettler-Toledo GmbH
    Inventors: Paul Wettstein, Markus Bendler
  • Publication number: 20150268182
    Abstract: A thermoanalytical sensor has a substrate, a measurement position, a temperature sensor unit, and an electrical contact pad. The temperature sensor unit senses the temperature at the measurement position. It is connected via the electrical contact pad to a metallic wire and thereby tied into an electronic circuit. The substrate is prepared with at least one measurement position, at least one temperature sensor unit and at least one electrical contact pad on a top side of the substrate. A passage in the substrate allows connection to the electrical contact pad. A metallic wire is inserted into the passage from the bottom side of the substrate and melted into a small ball on the upper end of the wire. A materially integral connection as a bonded joint between the upper end of the metallic wire and the electrical contact pad is made by applying pressure and heat to the metal ball.
    Type: Application
    Filed: March 17, 2015
    Publication date: September 24, 2015
    Inventors: Paul Wettstein, Markus Bendler
  • Patent number: 7619170
    Abstract: An electromagnetic force-compensation direct-measuring system is disclosed. Referred to as direct-measuring system, it comprises a parallel-guiding mechanism; and a load receiver connected with the parallel-guiding mechanism and connected to a force-compensation device by a force-transmitting rod. The force-compensation device can include at least one permanent magnet and a coil that is electrically connected to a control circuit. At least one component of the parallel-guiding mechanism is configured to transmit electric signals.
    Type: Grant
    Filed: November 13, 2007
    Date of Patent: November 17, 2009
    Assignee: Mettler-Toledo AG
    Inventors: Hans-Rudolf Burkhard, Markus Bendler
  • Publication number: 20080121048
    Abstract: An electromagnetic force-compensation direct-measuring system is disclosed. Referred to as direct-measuring system, it comprises a parallel-guiding mechanism; and a load receiver connected with the parallel-guiding mechanism and connected to a force-compensation device by a force-transmitting rod. The force-compensation device can include at least one permanent magnet and a coil that is electrically connected to a control circuit. At least one component of the parallel-guiding mechanism is configured to transmit electric signals.
    Type: Application
    Filed: November 13, 2007
    Publication date: May 29, 2008
    Applicant: METTLER-TOLEDO AG
    Inventors: Hans-Rudolf BURKHARD, Markus Bendler