Abstract: A thermoanalytical sensor has a substrate, a measurement position, a temperature sensor unit, and an electrical contact pad. The temperature sensor unit senses the temperature at the measurement position. It is connected via the electrical contact pad to a metallic wire and thereby tied into an electronic circuit. The substrate is prepared with at least one measurement position, at least one temperature sensor unit and at least one electrical contact pad on a top side of the substrate. A passage in the substrate allows connection to the electrical contact pad. A metallic wire is inserted into the passage from the bottom side of the substrate and melted into a small ball on the upper end of the wire. A materially integral connection as a bonded joint between the upper end of the metallic wire and the electrical contact pad is made by applying pressure and heat to the metal ball.

Abstract: A thermoanalytical sensor has a substrate, a measurement position, a temperature sensor unit, and an electrical contact pad. The temperature sensor unit senses the temperature at the measurement position. It is connected via the electrical contact pad to a metallic wire and thereby tied into an electronic circuit. The substrate is prepared with at least one measurement position, at least one temperature sensor unit and at least one electrical contact pad on a top side of the substrate. A passage in the substrate allows connection to the electrical contact pad. A metallic wire is inserted into the passage from the bottom side of the substrate and melted into a small ball on the upper end of the wire. A materially integral connection as a bonded joint between the upper end of the metallic wire and the electrical contact pad is made by applying pressure and heat to the metal ball.

Abstract: An electromagnetic force-compensation direct-measuring system is disclosed. Referred to as direct-measuring system, it comprises a parallel-guiding mechanism; and a load receiver connected with the parallel-guiding mechanism and connected to a force-compensation device by a force-transmitting rod. The force-compensation device can include at least one permanent magnet and a coil that is electrically connected to a control circuit. At least one component of the parallel-guiding mechanism is configured to transmit electric signals.

Abstract: An electromagnetic force-compensation direct-measuring system is disclosed. Referred to as direct-measuring system, it comprises a parallel-guiding mechanism; and a load receiver connected with the parallel-guiding mechanism and connected to a force-compensation device by a force-transmitting rod. The force-compensation device can include at least one permanent magnet and a coil that is electrically connected to a control circuit. At least one component of the parallel-guiding mechanism is configured to transmit electric signals.