Patents by Inventor Markus Björn Erik NOREN

Markus Björn Erik NOREN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadless chip carrier having improved mountability
    Patent number: 9418919
    Abstract: Consistent with an example embodiment, there is surface-mountable non-leaded chip carrier for a semiconductor device. The device comprises a first contact. A second contact is relative to the first contact; the second contact has a split therein to provide first and second portions of the second contact arranged relative to one another to lessen tilting of a soldering condition involving attachment of the chip carrier to a printed circuit board.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: August 16, 2016
    Assignee: NXP B.V.
    Inventors: Roelf Anco Jacob Groenhuis, Markus Björn Erik Noren, Fei-ying Wong, Hei-ming Shiu
  • LEADLESS CHIP CARRIER HAVING IMPROVED MOUNTABILITY
    Publication number: 20160211197
    Abstract: Consistent with an example embodiment, there is surface-mountable non-leaded chip carrier for a semiconductor device. The device comprises a first contact. A second contact is relative to the first contact; the second contact has a split therein to provide first and second portions of the second contact arranged relative to one another to lessen tilting of a soldering condition involving attachment of the chip carrier to a printed circuit board.
    Type: Application
    Filed: January 14, 2011
    Publication date: July 21, 2016
    Applicant: NXP B.V.
    Inventors: Roelf Anco Jacob GROENHUIS, Markus Björn Erik NOREN, Fei-ying WONG, Hei-ming SHIU
  • LEADFRAME AND METHOD FOR PACKAGING SEMICONDUCTOR DIE
    Publication number: 20120286399
    Abstract: In one embodiment, a method is provided for packaging a semiconductor die. A leadframe having a die-pad and one or more lead-pads is placed (502) on an assembly surface. The die-pad has a base portion (202) resting on the assembly surface, an upper portion (204) on the base portion extending laterally from the base portion, and a support arm (208) extending from and supporting the upper portion of die-pad. A semiconductor die (206) is wirebonded (504) to a top surface of the upper portion of the die-pad. The semiconductor die is wirebonded (506) to the one or more lead-pads (210). The semiconductor die and leadframe are encased (508) in a package material (802). The package material fills a space between the upper portion of the die-pad and the assembly surface. A portion of the support arm located in a cutting lane is removed (512).
    Type: Application
    Filed: May 8, 2012
    Publication date: November 15, 2012
    Applicant: NXP B.V.
    Inventors: Tim BOETTCHER, Sven WALCZYK, Fei-Ying WONG, Pompeo UMALI, Roelf Anco Jacob GROENHUIS, Bernd ROHRMOSER, ChiFai LEE, Markus Bjoern Erik NOREN, PaulPangHing TSANG
  • LEADLESS CHIP CARRIER HAVING IMPROVED MOUNTABILITY
    Publication number: 20120181678
    Abstract: Consistent with an example embodiment, there is surface-mountable non-leaded chip carrier for a semiconductor device. The device comprises a first contact. A second contact is relative to the first contact; the second contact has a split therein to provide first and second portions of the second contact arranged relative to one another to lessen tilting of a soldering condition involving attachment of the chip carrier to a printed circuit board.
    Type: Application
    Filed: January 14, 2011
    Publication date: July 19, 2012
    Applicant: NXP B.V.
    Inventors: Roelf Anco Jacob GROENHUIS, Markus Björn Erik NOREN, Fei-ying WONG, Hei-ming SHIU