Abstract: The disclosure relates to methods and systems for piercing, drilling, or cutting metal workpieces in a laser processing operation. The methods include focusing a pulsed laser beam onto a processing location on a workpiece; detecting process radiation emitted from the processing location; determining an intensity of the process radiation at a plurality of temporally sequential times during pulse pauses; determining an intensity gradient of the process radiation; comparing the intensity gradient with a gradient threshold value; and detecting a spontaneous material removal on the workpiece when the number of times the gradient threshold value has been exceeded is above a predetermined limit value. When a spontaneous material removal is detected, the system changes one or both of a laser parameter and a processing parameter of the laser processing operation. The disclosure also relates to processing machines for carrying out the methods.

Abstract: A method for determining a reference focal position of a laser beam for processing a plate-like member, the method comprising producing at least two incisions in the plate-like member with the laser beam set at different focal positions, irradiating the plate-like member with the laser beam, detecting edges of the incisions by measuring one or more parameters relating to the irradiation of the plate-like member, and establishing a width of the at least two incisions using the detected one or more parameters.

Abstract: This disclosure relates to methods and apparatuses for piercing workpieces at a piercing point using a laser beam, which exits from a laser processing nozzle with a process gas, whereby a bulge is formed on the workpiece surface around the piercing point during the piercing. A distance between the laser processing nozzle and the bulge is determined during the piercing and at least one piercing parameter is changed in dependence on the distance determined.

Abstract: The disclosure relates to methods and systems for piercing, drilling, or cutting metal workpieces in a laser processing operation. The methods include focusing a pulsed laser beam onto a processing location on a workpiece; detecting process radiation emitted from the processing location; determining an intensity of the process radiation at a plurality of temporally sequential times during pulse pauses; determining an intensity gradient of the process radiation; comparing the intensity gradient with a gradient threshold value; and detecting a spontaneous material removal on the workpiece when the number of times the gradient threshold value has been exceeded is above a predetermined limit value. When a spontaneous material removal is detected, the system changes one or both of a laser parameter and a processing parameter of the laser processing operation. The disclosure also relates to processing machines for carrying out the methods.

Abstract: A method for determining a reference focal position of a laser beam for processing a plate-like member, the method comprising producing at least two incisions in the plate-like member with the laser beam set at different focal positions, irradiating the plate-like member with the laser beam, detecting edges of the incisions by measuring one or more parameters relating to the irradiation of the plate-like member, and establishing a width of the at least two incisions using the detected one or more parameters.

Abstract: The disclosure relates to methods and systems for piercing, drilling, or cutting metal workpieces in a laser processing operation. The methods include focusing a pulsed laser beam onto a processing location on a workpiece; detecting process radiation emitted from the processing location; determining an intensity of the process radiation at a plurality of temporally sequential times during pulse pauses; determining an intensity gradient of the process radiation; comparing the intensity gradient with a gradient threshold value; and detecting a spontaneous material removal on the workpiece when the number of times the gradient threshold value has been exceeded is above a predetermined limit value. When a spontaneous material removal is detected, the system changes one or both of a laser parameter and a processing parameter of the laser processing operation. The disclosure also relates to processing machines for carrying out the methods.

Abstract: This disclosure relates to methods and apparatuses for piercing workpieces at a piercing point using a laser beam, which exits from a laser processing nozzle with a process gas, whereby a bulge is formed on the workpiece surface around the piercing point during the piercing. A distance between the laser processing nozzle and the bulge is determined during the piercing and at least one piercing parameter is changed in dependence on the distance determined.

Abstract: The disclosure relates to methods and systems for piercing, drilling, or cutting metal workpieces in a laser processing operation. The methods include focusing a pulsed laser beam onto a processing location on a workpiece; detecting process radiation emitted from the processing location; determining an intensity of the process radiation at a plurality of temporally sequential times during pulse pauses; determining an intensity gradient of the process radiation; comparing the intensity gradient with a gradient threshold value; and detecting a spontaneous material removal on the workpiece when the number of times the gradient threshold value has been exceeded is above a predetermined limit value. When a spontaneous material removal is detected, the system changes one or both of a laser parameter and a processing parameter of the laser processing operation. The disclosure also relates to processing machines for carrying out the methods.