Abstract: In an embodiment a method for manufacturing optoelectronic components includes providing a metal sheet, milling the metal sheet, structuring the metal sheet into a lead frame blank with the intermediate pieces, applying a plurality of semiconductor devices to the intermediate pieces and separating to form the components. Each components may include an optoelectronic semiconductor device including at least two electrical contact surfaces on an assembly side, a lead frame base and electrical connection surfaces for external electrical contacting of the semiconductor device, wherein each base comprises at least two metallic intermediate pieces, wherein each of the intermediate pieces is fastened directly to one of the contact surfaces, and wherein the intermediate pieces are each L-shaped or T-shaped.

Abstract: A method of producing optoelectronic semiconductor components includes A) providing a chip carrier with electrical conductor structures on a carrier upper side, B) applying at least one semi-conductor chip configured to produce light on at least one of the electrical conductor structures, C) applying at least one sealing structure to at least one of the electrical conductor structures so that the sealing structure completely surrounds at least one contact area when viewed from the top, and D) producing a mold body directly at the at least one semiconductor chip and directly at the at least one sealing structure by transfer molding or injection molding, wherein, in an injection mold, the at least one sealing structure seals the at least one contact area against a material of the mold body so that the at least one contact area remains free of the mold body.

Abstract: A method of producing optoelectronic semiconductor components includes A) providing a chip carrier with electrical conductor structures on a carrier upper side, B) applying at least one semiconductor chip configured to produce light on at least one of the electrical conductor structures, C) applying at least one sealing structure to at least one of the electrical conductor structures so that the sealing structure completely surrounds at least one contact area when viewed from the top, and D) producing a mold body directly at the at least one semiconductor chip and directly at the at least one sealing structure by injection casting or injection molding, wherein, in an injection mold, the at least one sealing structure seals the at least one contact area against a material of the mold body so that the at least one contact area remains free of the mold body.