Abstract: A method of producing a carrier substrate for an optoelectronic semiconductor component includes: providing a leadframe including a first electrically conductive contact section and a second electrically conductive contact section, and injection molding a housing including a housing frame embedding the leadframe by an injection-molding material free of epoxy such that the leadframe embedded in the housing frame of the injection-molded housing forms a carrier substrate for an optoelectronic semiconductor component.

Abstract: A method of producing an optoelectronic device includes providing an optical element including an optical lens and including a frame, wherein the frame projects with a receptacle section beyond a first side of the lens, the receptacle section of the frame surrounds a receptacle space, and the receptacle section of the frame includes a bearing face at an inner side; inserting an optoelectronic component and a transparent intermediate element into the receptacle space; placing the intermediate element onto the bearing face; and securing the component and the intermediate element to the frame.

Abstract: An optical element for light outcoupling and/or conversion of light includes a light-emitting semiconductor chip with at least one layer selected from a wavelength conversion layer, a scattering layer, a light outcoupling layer and a lens layer, which each includes a plastics material processable in a compression molding method.

Abstract: Optoelectronic semiconductor devices and methods for producing optoelectronic semiconductor devices are disclosed. In an embodiment the method includes applying a plurality of arrangements of electrically conductive first and second contact elements on an auxiliary carrier, applying an optoelectronic semiconductor chip on the second contact element of each arrangement and electrically conductively connecting the optoelectronic semiconductor chip to the first contact element for each arrangement. The method further includes encapsulating the first contact elements and the second contact elements with an encapsulation material to form an encapsulation body and singulating the encapsulation body into a plurality of optoelectronic semiconductor devices, wherein the encapsulation material finishes flush with an underside, facing the auxiliary carrier, of each first contact element, and wherein the encapsulation material finishes flush with an underside, facing the auxiliary carrier, of each second contact element.

Abstract: An electrical component includes a closed lead frame with a passage opening at least one electrical component arranged within the passage opening, the electrical component including a first contact pad on one side of the electrical component and a second contact pad on a second side of the electric component, wherein the second side faces the first side and the second contact pad is electrically coupled to the lead frame; and an encapsulation which mechanically couples the electrical component to the lead frame, wherein the lead frame includes a recess on one side, the recess extending from an edge of the lead frame to the passage opening and connecting at least one electrical connecting element from the edge of the lead frame to the component arranged in the passage opening.

Abstract: Optoelectronic semiconductor devices and methods for producing optoelectronic semiconductor devices are disclosed. In an embodiment the method includes applying a plurality of arrangements of electrically conductive first and second contact elements on an auxiliary carrier, applying an optoelectronic semiconductor chip on the second contact element of each arrangement and electrically conductively connecting the optoelectronic semiconductor chip to the first contact element for each arrangement. The method further includes encapsulating the first contact elements and the second contact elements with an encapsulation material to form an encapsulation body and singulating the encapsulation body into a plurality of optoelectronic semiconductor devices, wherein the encapsulation material finishes flush with an underside, facing the auxiliary carrier, of each first contact element, and wherein the encapsulation material finishes flush with an underside, facing the auxiliary carrier, of each second contact element.

Abstract: An electrical component includes a closed lead frame with a passage opening at least one electrical component arranged within the passage opening, the electrical component including a first contact pad on one side of the electrical component and a second contact pad on a second side of the electric component, wherein the second side faces the first side and the second contact pad is electrically coupled to the lead frame; and an encapsulation which mechanically couples the electrical component to the lead frame, wherein the lead frame includes a recess on one side, the recess extending from an edge of the lead frame to the passage opening and connecting at least one electrical connecting element from the edge of the lead frame to the component arranged in the passage opening.

Abstract: A pressing tool for pressing a silicone element may include: an upper pressing tool half and a lower pressing tool half, which in the closed state of the pressing tool form a cavity for pressing a silicone element, and a carrier foil, which bears on one of the pressing tool halves, for the silicone element to be pressed, wherein at least the upper pressing tool half or the lower pressing tool half has at least one clamping element for aligning the two pressing tool halves with respect to one another, and wherein the clamping element is arranged between the pressing tool halves and outside the region covered by the carrier foil.

Abstract: An optical element for light outcoupling and/or conversion of light includes a light-emitting semiconductor chip with at least one layer selected from a wavelength conversion layer, a scattering layer, a light outcoupling layer and a lens layer, which each includes a plastics material processable in a compression molding method.

Abstract: A vehicle roof is proposed, comprising a roof opening which may be selectively closed or at least partially opened by means of a cover element, which is guided relative to a vehicle longitudinal central plane on both sides via a drive mechanism in a guide rail fixed to the roof, and which is made from a material comprising polycarbonate. The drive mechanism is at least partially an integral component of the cover element.

Abstract: The engine has a rotor rotationally mounted about a rotational axis and is provided with a superconductive winding arranged in a winding support. In order to fix the winding support inside an external rotor housing, a rigid connecting device having a hollow cylindrical connecting element made of fiber reinforced plastic is provided on the torque transmitting side. The connecting element is configured as a single piece and consist of end parts located on the front face and a central part located between the latter, wherein the end parts are corrugated in peripheral direction and are non-corrugated in the central part. The end parts of the connecting element are connected to and engine with one another in a non-positive fit manner in groovelike recesses of flangelike end pieces made of metal.

Abstract: The engine (2) has a rotor (5) rotationally mounted about a rotational axis (A) and is provided with a superconductive winding (10) arranged in a winding support (9). In order to fix the winding support inside an external rotor housing (7), a rigid connecting device (8a) having a hollow cylindrical connecting element (12c) made of fiber reinforced plastic is provided on the torque transmitting side (AS). The connecting element (12c) is configured as a single piece and consists of end parts located on the front face and a central part located between the latter, wherein the end parts are corrugated in peripheral direction and are non-corrugated in the central part. The end parts of the connecting element (12c) are connected to and engage with one another in a non-positive fit manner in groovelike recesses of flangelike end pieces (12a, 12b) made of metal.