Abstract: An electrosurgical instrument configured for connection to a supply apparatus for operation. The instrument has an end opening at the distal end and supports at least one electrode in the area of the end opening to which an alternating voltage potential can be applied. Directly adjoining the end opening, a liner of the electrosurgical instrument limits a flow chamber inside the liner. With distance to the end opening a flushing channel opens out into the flow chamber via an exit opening and a suction channel opens out into the flow chamber via an inlet opening. A flushing fluid can be introduced in the flow chamber via the flushing channel and can be extracted by suction via the suction channel.

Abstract: The invention relates to a polymer obtainable by the radical polymerization of at least one monomer, namely one or more (meth)acrylate monomers and optionally, in addition, vinylic comonomers, wherein the polymer has a molar mass MW of at least 5,000 g/mol and at most 200,000 g/mol and at least one of the monomers is functionalized with at least one epoxy group, wherein the proportion of the epoxide-functionalized monomer(s) (a) is more than 30 wt %.

Abstract: The invention relates to a polymer obtainable by the radical polymerization of at least one monomer, namely one or more (meth)acrylate monomers and optionally, in addition, vinylic comonomers, wherein the polymer has a molar mass MW of at least 5,000 g/mol and at most 200,000 g/mol and at least one of the monomers is functionalized with at least one epoxy group, wherein the proportion of the epoxide-functionalized monomer(s) (a) is more than 30 wt %.

Abstract: The invention relates to a dispersion comprising one or more protic solvents as dispersion medium and also, as base components dispersed therein, one or more matrix polymers, one or more epoxides, at least one kind of a modified compound of the polyamine adduct type which is insoluble in the epoxides, where the at least one modified polyamine adduct is in dispersion in particulate form, with 90% of the particles having a particle size in the range from 0.1 to 10 ?m as determined by laser diffractometry.

Abstract: The invention relates to a thermally curable adhesive compound consisting of the following components: (A) 4.9 to 34.9 wt % (relative to the total amount of the curable adhesive compound) of an epoxide-functionalized (co)polymer having a weight-average molar mass in the range of 5,000 g/mol to 200,000 g/mol, based on more than 30 to 100 wt %, preferably 50 to 100 wt %, (relative to the total amount of the monomers on which the epoxide-functionalized (co)polymer is based) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group, (B) 0.1 to 5 wt % (relative to the total amount of the curable adhesive compound) of at least one thermally activatable curing agent for a cationic curing of epoxides, (C) 65 to 95 wt % (relative to the total amount of the curable adhesive compound) of at least one type of matrix polymer as a film-forming agent, (D) optionally 0 to 30 wt % of additional components.

Abstract: The invention relates to a dispersion comprising one or more protic solvents as dispersion medium and also, as base components dispersed therein, one or more matrix polymers, one or more epoxides, at least one kind of a modified compound of the polyamine adduct type which is insoluble in the epoxides, where the at least one modified polyamine adduct is in dispersion in particulate form, with 90% of the particles having a particle size in the range from 0.1 to 10 ?m as determined by laser diffractometry.

Abstract: The invention relates to a thermally curable adhesive compound consisting of the following components: (A) 4.9 to 34.9 wt % (relative to the total amount of the curable adhesive compound) of an epoxide-functionalized (co)polymer having a weight-average molar mass in the range of 5,000 g/mol to 200,000 g/mol, based on more than 30 to 100 wt %, preferably 50 to 100 wt %, (relative to the total amount of the monomers on which the epoxide-functionalized (co)polymer is based) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group, (B) 0.1 to 5 wt % (relative to the total amount of the curable adhesive compound) of at least one thermally activatable curing agent for a cationic curing of epoxides, (C) 65 to 95 wt % (relative to the total amount of the curable adhesive compound) of at least one type of matrix polymer as a film-forming agent, (D) optionally 0 to 30 wt % of additional components.

Abstract: A method glues two plastic surfaces together with adhesion produced by a heat-activatable adhesive. The adhesive is a heat-activatable adhesive, which is based on i) at least one elastomer having a weight proportion of 30-70 wt. % ii) at least one reactive resin component having a weight proportion of 30-70 wt. %. At least one of the plastic surfaces that is to be glued is part of a substrate having a heat conductivity that is high enough to transfer the activation energy necessary for the adhesion to the heat-activatable adhesive.

Abstract: A method glues two plastic surfaces together via an adhesion produced by a heat-activatable adhesive. An adhesive, which is used as a heat-activatable adhesive, is based on i) at least one thermoplastic having a softening temperature or melting temperature in the region of between 90 and 120° C.

Abstract: A method for producing circuit boards, comprising a process for modifying a flexible circuit board, in particular for the stabilization thereof, characterized by at least the following method steps: a) providing a planar formation (“reinforcement plate”) having lower flexibility than that of the flexible circuit board, b) hot laminating an adhesive film, which can be activated by heat, on the reinforcement plate, c) placing the laminate made of adhesive film and reinforcement plate with the adhesive film side on the flexible circuit board, d) introducing the component made of reinforcement plate, adhesive film, and flexible circuit board into a partial vacuum atmosphere, e) hot laminating the component with application of pressure and heat.