Patents by Inventor Markus Eigner

Markus Eigner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor chip arrangement
    Patent number: 7714447
    Abstract: A patterned connection plane between two semiconductor chips which are connected using face-to-face technology is patterned into first pads, second pads, and conductor strips which are alternatively connected to one of these pads. The conductor strips are connected to a read-out circuit in one of the semiconductor chips via connections.
    Type: Grant
    Filed: August 25, 2005
    Date of Patent: May 11, 2010
    Assignee: Infineon Technologies AG
    Inventors: Markus Eigner, Wolfgang Gruber, Manfred Roth, Stefan Ruping
  • Semiconductor chip arrangement
    Publication number: 20060038263
    Abstract: A patterned connection plane between two semiconductor chips which are connected using face-to-face technology is patterned into first pads, second pads, and conductor strips which are alternatively connected to one of these pads. The conductor strips are connected to a read-out circuit in one of the semiconductor chips via connections.
    Type: Application
    Filed: August 25, 2005
    Publication date: February 23, 2006
    Applicant: Infineon Technologies AG
    Inventors: Markus Eigner, Wolfgang Gruber, Manfred Roth, Stefan Ruping