Abstract: An organic light-emitting diode (OLED) display includes an array of OLED pixels and an array of organic photodetector (OPD) pixels. An OLED pixel in the array of OLED pixels includes an OLED hole transport layer (HTL), an OLED electron transport layer (ETL), and an emissive layer positioned between the OLED HTL and the OLED ETL. An OPD pixel in the array of OPD pixels includes the OLED HTL, the OLED ETL, and an electron donor material positioned between the OLED HTL and the OLED ETL, wherein the OLED ETL functions as an electron acceptor material for the OPD pixel. In other embodiments, the OPD pixel may be configured differently.

Abstract: An organic light-emitting diode (OLED) display includes an array of OLED pixels and an array of organic photodetector (OPD) pixels. An OLED pixel in the array of OLED pixels includes an OLED hole transport layer (HTL), an OLED electron transport layer (ETL), and an emissive layer positioned between the OLED HTL and the OLED ETL. An OPD pixel in the array of OPD pixels includes the OLED HTL, the OLED ETL, and an electron donor material positioned between the OLED HTL and the OLED ETL, wherein the OLED ETL functions as an electron acceptor material for the OPD pixel. In other embodiments, the OPD pixel may be configured differently.

Abstract: Embodiments related to interlayers (e.g., interlayers comprising a transition metal oxide, a transition metal oxynitride, and/or a transition metal nitride) and associated systems, devices (e.g., photovoltaic devices), and methods are disclosed. In some embodiments, a system for exciton transfer includes a substrate including an inorganic semiconductor. An interlayer may be disposed on the substrate, and a layer including a material that undergoes singlet exciton fission when exposed to electromagnetic radiation may be disposed on the interlayer. The interlayer may be disposed between the substrate and the layer. In some embodiments, a method for manufacturing a system for exciton transfer involves depositing an interlayer onto a substrate that includes an inorganic semiconductor. The method may also include depositing a layer including a material that undergoes singlet exciton fission when exposed to electromagnetic radiation onto the interlayer.

Abstract: Embodiments related to interlayers (e.g., interlayers comprising a transition metal oxide, a transition metal oxynitride, and/or a transition metal nitride) and associated systems, devices (e.g., photovoltaic devices), and methods are disclosed. In some embodiments, a system for exciton transfer includes a substrate including an inorganic semiconductor. An interlayer may be disposed on the substrate, and a layer including a material that undergoes singlet exciton fission when exposed to electromagnetic radiation may be disposed on the interlayer. The interlayer may be disposed between the substrate and the layer. In some embodiments, a method for manufacturing a system for exciton transfer involves depositing an interlayer onto a substrate that includes an inorganic semiconductor. The method may also include depositing a layer including a material that undergoes singlet exciton fission when exposed to electromagnetic radiation onto the interlayer.