Abstract: An apparatus (1) for cooling electronic components (2, 3, 4) comprises laminated plate-like parts that form a flow duct through which a liquid coolant can flow. At least one plate-like frame element (8) having cutouts (9, 10, 11) is arranged between the plate-like parts, wherein the cutouts (9, 10, 11) form sections of a coolant flow duct for selectively cooling electronic components mounted on mounting areas on one or more surfaces of the apparatus.

Abstract: An apparatus (1) for cooling electronic components comprises plate-shaped elements (2, 8), which enclose between them a cavity in the form of a flow channel, having connections (5, 6) for a liquid coolant flowing through the flow channel. One plate-shaped element comprises a highly thermally conductive, preferably metallic plate (8) connected in a thermally conductive manner to the electronic components.