Patents by Inventor Markus Frewein

Markus Frewein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Expansion coefficient determination with deformation measurement and simulation
    Patent number: 12067709
    Abstract: A method for determining an expansion coefficient of a test material comprises: receiving first image data of a compound material, wherein the compound material comprises a plate and a layer of the test material, which is attached to the plate; receiving second image data of the compound material, which has been exposed to an environmental condition, before the second image data has been recorded; determining a measured deformation of the compound material by comparing the first image data and the second image data; and performing a simulated deformation of a model of the compound material exposed to the environmental condition and determining the expansion coefficient of the test material by varying the expansion coefficient until the simulate deformation conforms to the measured deformation.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: August 20, 2024
    Assignee: AT&S Austria Technologie & Systemtechnik AG
    Inventors: Markus Frewein, Maike Sagerer, Julia Zuendel, Thomas Krivec
  • Component carrier and method of manufacturing the same
    Patent number: 11439018
    Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack and has a non-polygonal outline. A component is in the cavity. A method of manufacturing such a component carrier is also provided.
    Type: Grant
    Filed: December 29, 2020
    Date of Patent: September 6, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Sabine Liebfahrt, Ferdinand Lutschounig, Bernhard Reitmaier, Julia Platzer, Markus Frewein
  • Component carrier and method of manufacturing the same
    Patent number: 11412618
    Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack. A component in the cavity has a stepped profile at at least one of its main surfaces. A resin clamping structure laterally engages the component and extends up to a step of the stepped profile. A method of manufacturing such a component carrier is also provided.
    Type: Grant
    Filed: December 29, 2020
    Date of Patent: August 9, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Sabine Liebfahrt, Ferdinand Lutschounig, Bernhard Reitmaier, Julia Platzer, Markus Frewein
  • COMPONENT CARRIER AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20220210920
    Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack and has a non-polygonal outline. A component is in the cavity. A method of manufacturing such a component carrier is also provided.
    Type: Application
    Filed: December 29, 2020
    Publication date: June 30, 2022
    Inventors: Sabine Liebfahrt, Ferdinand Lutschounig, Bernhard Reitmaier, Julia Platzer, Markus Frewein
  • Component Carrier and Method of Manufacturing the Same
    Publication number: 20220210919
    Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack. A component in the cavity has a stepped profile at at least one of its main surfaces. A resin clamping structure laterally engages the component and extends up to a step of the stepped profile. A method of manufacturing such a component carrier is also provided.
    Type: Application
    Filed: December 29, 2020
    Publication date: June 30, 2022
    Inventors: Sabine Liebfahrt, Ferdinand Lutschounig, Bernhard Reitmaier, Julia Platzer, Markus Frewein
  • Expansion Coefficient Determination with Deformation Measurement and Simulation
    Publication number: 20220067904
    Abstract: A method for determining an expansion coefficient of a test material comprises: receiving first image data of a compound material, wherein the compound material comprises a plate and a layer of the test material, which is attached to the plate; receiving second image data of the compound material, which has been exposed to an environmental condition, before the second image data has been recorded; determining a measured deformation of the compound material by comparing the first image data and the second image data; and performing a simulated deformation of a model of the compound material exposed to the environmental condition and determining the expansion coefficient of the test material by varying the expansion coefficient until the simulate deformation conforms to the measured deformation.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 3, 2022
    Inventors: Markus Frewein, Maike Sagerer, Julia Zuendel, Thomas Krivec