Patents by Inventor Markus Gaertner

Markus Gaertner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260312318
    Abstract: A modular pin block is provided for mounting into a housing of a modular connector. The modular pin block includes a pin block support having a first connection surface and a second connection surface opposite the first connection surface, and at least one pin extending through the pin block support such that the at least one pin protrudes from the first connection surface and from the second connection surface. The pin block support may include latching structure configured to retain the modular pin block within a seat of the connector housing, and orientation features configured to define a mounting orientation of the modular pin block relative to the connector housing. Connector housings including one or more such modular pin blocks, and methods of producing modular pin blocks, are also disclosed.
    Type: Application
    Filed: February 20, 2026
    Publication date: October 8, 2026
    Inventors: Andreas URBANIAK, Markus GAERTNER, Uvaraj GANESAN, Rajan KUMARESH, Vijay Babu MOORTHY
  • Publication number: 20260312330
    Abstract: A connector assembly includes a housing and a plurality of inlays, each inlay configured to receive two terminals of a twisted wire pair cable. The housing has a plurality of inlay reception chambers that receive the inlays, allowing for organized terminal management. This design enables a compact and efficient connector configuration, facilitating reliable connections between terminals.
    Type: Application
    Filed: February 25, 2026
    Publication date: October 8, 2026
    Inventors: Andreas URBANIAK, Markus GAERTNER, Vijay Babu MOORTHY, Uvaraj GANESAN, Rajan KUMARESH, Achim ROSEMANN
  • Publication number: 20260312351
    Abstract: A pin block module for a modular connector includes a pin block support with opposing connection surfaces and pins extending through the support, protruding from both surfaces. The module also includes at least one conductive splice element that electrically connects two or more of the pins together, enabling customized connectivity within the modular connector. The pin block module is designed for insertion into a housing of the modular connector, thereby providing a flexible and adaptable solution for various connection configurations.
    Type: Application
    Filed: March 4, 2026
    Publication date: October 8, 2026
    Inventors: Andreas URBANIAK, Markus GAERTNER, Uvaraj GANESAN, Rajan KUMARESH, Benjamin SCHWARZ
  • Patent number: 9915003
    Abstract: An electrical contact element formed of sheet metal having a first region and a second region. Each one of the first and second regions is coated with a coating including a first layer containing a first material having a lower standard electrode potential than the sheet metal material. The coating includes a second layer in the first region which is absent in the second region. The second layer is arranged underneath the first layer and contains a second material that has a lower standard electrode potential than the first material.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: March 13, 2018
    Assignee: DELPHI TECHNOLOGIES, INC.
    Inventor: Markus Gaertner
  • Publication number: 20170342571
    Abstract: An electrical contact element formed of sheet metal having a first region and a second region. Each one of the first and second regions is coated with a coating including a first layer containing a first material having a lower standard electrode potential than the sheet metal material. The coating includes a second layer in the first region which is absent in the second region. The second layer is arranged underneath the first layer and contains a second material that has a lower standard electrode potential than the first material.
    Type: Application
    Filed: March 27, 2017
    Publication date: November 30, 2017
    Inventor: Markus Gaertner
  • Patent number: 9537243
    Abstract: An electrical contact element and a method of manufacturing an electrical contact element having a connecting segment which is formed of a copper sheet and comprising a coating overlaying the copper sheet having at least two layers. A first layer contains at least 60% by weight of tin. A second layer is disposed between the first layer and the copper sheet. The second layer contains a copper-containing alloy. The copper-containing alloy contains 40 to 80% by weight of copper and 20 to 60% by weight of zinc. The combined percentage by weight of copper and zinc in the second layer is at least 90%. A third layer containing tin may be disposed between the second layer and the copper sheet. A fourth layer containing zinc may be disposed on a side of the first layer opposite the second layer.
    Type: Grant
    Filed: April 29, 2014
    Date of Patent: January 3, 2017
    Assignee: Delphi Technologies, Inc.
    Inventor: Markus Gaertner
  • Publication number: 20160064847
    Abstract: An electrical contact element and a method of manufacturing an electrical contact element having a connecting segment which is formed of a copper sheet and comprising a coating overlaying the copper sheet having at least two layers. A first layer contains at least 60% by weight of tin. A second layer is disposed between the first layer and the copper sheet. The second layer contains a copper-containing alloy. The copper-containing alloy contains 40 to 80% by weight of copper and 20 to 60% by weight of zinc. The combined percentage by weight of copper and zinc in the second layer is at least 90%. A third layer containing tin may be disposed between the second layer and the copper sheet. A fourth layer containing zinc may be disposed on a side of the first layer opposite the second layer.
    Type: Application
    Filed: April 29, 2014
    Publication date: March 3, 2016
    Inventor: MARKUS GAERTNER
  • Publication number: 20080083553
    Abstract: The invention relates to a current conductor, in particular for motor vehicles, to which at least one electrically conductive connector element can be fastened to make an electrical contact, with the current conductor having a recess which includes a wall section which is pierced by at least one plug opening for the connector element.
    Type: Application
    Filed: October 9, 2007
    Publication date: April 10, 2008
    Inventor: Markus Gaertner
  • Patent number: 7090410
    Abstract: An optical receptacle with low transmission loss, which is connectable with an optical plug, is provided. The optical receptacle includes a photoelectric conversion module having the capability of making photoelectric conversion between light signals and electrical signals, and a module housing. The photoelectric conversion module is a molded interconnect device (MID), which is provided with a module body having a post, an optical device mounted on the post, and an electrical circuit mounted on the module body. The module housing has a tubular projection, into which an end of the optical fiber supported by the optical plug can be inserted. When the optical plug is connected with an optical receptacle, the end of the optical fiber is positioned in the tubular projection so as to be in a closely opposing relation to the optical device mounted on the post.
    Type: Grant
    Filed: September 29, 2003
    Date of Patent: August 15, 2006
    Assignees: Matsushita Electric Works, Ltd., Delphi Technologies Inc.
    Inventors: Yoshiaki Kambe, Kenichi Shimaya, Tsutomu Shimomura, Albrecht Haack, Paul Gerhard Halbach, Markus Gaertner
  • Publication number: 20060045435
    Abstract: An optical receptacle with low transmission loss, which is connectable with an optical plug, is provided. The optical receptacle includes a photoelectric conversion module having the capability of making photoelectric conversion between light signals and electrical signals, and a module housing. The photoelectric conversion module is a molded interconnect device (MID), which is provided with a module body having a post, an optical device mounted on the post, and an electrical circuit mounted on the module body. The module housing has a tubular projection, into which an end of the optical fiber supported by the optical plug can be inserted. When the optical plug is connected with an optical receptacle, the end of the optical fiber is positioned in the tubular projection so as to be in a closely opposing relation to the optical device mounted on the post.
    Type: Application
    Filed: September 29, 2003
    Publication date: March 2, 2006
    Inventors: Yoshiaki Kambe, Kenichi Shimaya, Tsutomu Shimomura, Albrecht Haack, Paul Halbach, Markus Gaertner