Abstract: The invention relates to a method for processing material, in particular for modifying material and/or material properties, by means of laser radiation, comprising the following steps: a) generating a multiplicity of laser pulses (L); b) controlling the point of impact of the laser pulses (L) on a workpiece (100) to be processed, in particular deflecting the laser pulses (L) and/or moving the workpiece (100) to be processed, such that the laser pulses (L) are guided along a predetermined trajectory (Z) on the workpiece (100) to be processed. According to the invention, —a pulse-to-pulse time interval (?t) between the individual laser pulses (L) generated and/or—a pulse energy (Pi) of the laser pulses (L) and/or—a beam diameter (D) of the laser pulses (D) and/or—the predetermined trajectory (Z) is/are specifically subjected to noise.

Abstract: The present invention is directed to an optical system for measuring the rotation angle of rotatable object having a rotation shaft (2), which system comprises a reflective diffraction element (6) mounted on said shaft and a module that includes a radiation source (8) emitting a monochromatic beam (bo) towards this element and a radiation-sensitive detection structure (14, 16), the diffraction element is configured to project diffraction order images (18) of its pattern onto associated sections (50(1)-54(2)) of an annular grating structure forming part of the detection structure and the surface size of the diffraction element is smaller than 20% of the surface size of the annular grating structure.

Abstract: The present invention is directed to an optical system for measuring the rotation angle of rotatable object having a rotation shaft (2), which system comprises a reflective diffraction element (6) mounted on said shaft and a module that includes a radiation source (8) emitting a monochromatic beam (bo) towards this element and a radiation-sensitive detection structure (14, 16), the diffraction element is configured to project diffraction order images (18) of its pattern onto associated sections (50(1)-54(2)) of an annular grating structure forming part of the detection structure and the surface size of the diffraction element is smaller than 20% of the surface size of the annular grating structure.

Abstract: The invention relates to a method for the highly precise regulation of load-variable heat sources or heat sinks, and to a device for controlling the temperature of a dynamic heat source, especially of pump diodes for solid-state lasers. According to said method, the calculated mean value of the forward flow temperature and the return flow temperature is preset as an actual value for regulating the power, in order to ensure a stabilization of the heat source even without any information on the type of thermal load and the heat quantity to be dissipated, by the mean reference temperature for the heat flow to or from the temperature-controlling medium being maintained at a constant value irrespective of the heat quantity to be dissipated.

Abstract: The invention relates to a method for the highly precise regulation of load-variable heat sources or heat sinks, and to a device for controlling the temperature of a dynamic heat source, especially of pump diodes for solid-state lasers. According to said method, the calculated mean value of the forward flow temperature and the return flow temperature is preset as an actual value for regulating the power, in order to ensure a stabilisation of the heat source even without any information on the type of thermal load and the heat quantity to be dissipated, by the mean reference temperature for the heat flow to or from the temperature-controlling medium being maintained at a constant value irrespective of the heat quantity to be dissipated.

Abstract: A method for removing residues of molding material from metal parts of plastic packages of semiconductor devices includes applying first and second pulsed laser radiations to at least one surface region of a metal part covered with residues of molding material. The first pulsed laser radiation has a first wavelength that is absorbed by residues of molding material having a thickness greater than a prescribed thickness. The intensity and the duration of the first pulsed laser radiation causes the residues to be directly attacked. The second pulsed laser radiation has a second wavelength so that residues of molding material having a thickness less than the prescribed value are at least partially transparent and the metal parts are at least partially absorbent. The intensity and the duration of the second pulsed laser radiation causes the formation of plasma at the point of impact with the metal part.