Abstract: An actuatable mirror assembly has an actuator apparatus with a main actuator unit fixed to the frame and an actuator mirror carrier unit that is displaceable by actuator vis-à-vis the main actuator unit. The mirror assembly has at least one mirror with a reflection surface secured to the actuator mirror carrier unit. A bearing device secures the mirror to the actuator mirror carrier unit. The bearing device is embodied such that an enclosed securing region of the mirror, provided by the bearing device, has an extent between maximally spaced-apart securing points of the bearing device in the direction of a maximal securing distance on the actuator mirror carrier unit, the extent being at least 15% of a typical extent of the reflection surface of the mirror. This can result in an improved actuatable mirror assembly, such as for use in projection lithography.

Abstract: A method for producing a MEMS mirror array such as can be used, e.g. in photolithography, and a corresponding MEMS mirror array, can reduce issues possibly resulting from environmental influences.

Abstract: An apparatus for stress-reduced mounting of MEMS-based micromirrors on a metallic support structure comprises a plate extending in a main plane of extent and a plurality of compensation elements which are connected to the plate and have connecting elements which extend across the main plane of extent and a plurality of base elements. A respective group with a plurality of connecting elements is connected to a common base element. The apparatus is produced using MEMS technology.

Abstract: An individual mirror of a pupil facet mirror of an illumination optical unit of a projection exposure apparatus is mounted so as to be pivotable about two pivot axes. A ratio of the pivotability of the individual mirror about the two pivot axes is at least 2:1.

Abstract: An actuator device for a tiltable micro-optical element comprises a plurality of stacked comb drives.

Abstract: An actuator for semiconductor lithography comprises an actuator element, a compensation element and a connection element. The actuator element has a first coefficient of thermal expansion and a connection site at its first end for the active adjustment of an optical element along at least one adjustment axis. The compensation element has a second coefficient of thermal expansion. The sign of the second coefficient of thermal expansion corresponds to the sign of the first coefficient of thermal expansion. The compensation element is oriented coaxially in relation to the adjustment axis. The compensation element has a coupling site held stationary in space or stationary in relation to the optical element. The connection element connects the actuator element and the compensation element at positions located remote from the connection site and from the coupling site. A deformation mirror includes a mirror substrate and an actuator.

Abstract: An arrangement (100), a method and a computer program product for system-integrated calibration of facet mirrors (18, 19) of a microlithographic illumination system (20). Beam paths (103) between a radiation source (101) and a radiation detector (102) are created by the facet mirrors (18, 19), with respectively only one pivotable micromirror (18?, 19?) of each facet mirror (18, 19) affecting said beam path. By methodically pivoting one of the micromirrors (18?, 19?) affecting the beam path (10), it is possible, based on the radiation detector (102), to find a specific optimal pivot position, the underlying orientation of the micromirror (18?, 19?) of which can also be calculated geometrically. By comparing the calculated orientation with the orientation ascertained by a tilt sensor on the micromirror (18?, 19?), it is possible to calibrate the tilt sensor or micromirror (18?, 19?) of the facet mirror (18, 19).

Abstract: A method and an apparatus for determining the heating state of an optical element in a microlithographic optical system involves at least one contactless sensor which is based on the reception of electromagnetic radiation from the optical element. The radiation range captured by the sensor is varied for the purposes of ascertaining a temperature distribution in the optical element.

Abstract: The disclosure provides a method for determining at least one property of an EUV source in a projection exposure apparatus for semiconductor lithography, wherein the property is determined on the basis of the electromagnetic radiation emanating from the EUV source, and wherein a thermal load for a component of the projection exposure apparatus is determined and the property is deduced on the basis of the thermal load determined.

Abstract: A method and an apparatus for determining the heating state of an optical element in a microlithographic optical system involves at least one contactless sensor which is based on the reception of electromagnetic radiation from the optical element. The radiation range captured by the sensor is varied for the purposes of ascertaining a temperature distribution in the optical element.

Abstract: A displacement device for pivoting a mirror element with two degrees of freedom of pivoting includes an electrode structure including actuator electrodes. The actuator electrodes are comb electrodes. All actuator electrodes are arranged in a single plane. The actuator electrodes form a direct drive for pivoting the mirror element.

Abstract: The disclosure provides a method for determining at least one property of an EUV source in a projection exposure apparatus for semiconductor lithography, wherein the property is determined on the basis of the electromagnetic radiation emanating from the EUV source, and wherein a thermal load for a component of the projection exposure apparatus is determined and the property is deduced on the basis of the thermal load determined.

Abstract: A projection lens of an EUV-lithographic projection exposure system with at least two reflective optical elements each comprising a body and a reflective surface for projecting an object field on a reticle onto an image field on a substrate if the projection lens is exposed with an exposure power of EUV light, wherein the bodies of at least two reflective optical elements comprise a material with a temperature dependent coefficient of thermal expansion which is zero at respective zero cross temperatures, and wherein the absolute value of the difference between the zero cross temperatures is more than 6K.

Abstract: A sensor device for capturing the displacement position of an optical component includes a plurality of stator electrodes and a mechanism or restricting the electric field that is relevant to the measurement of the displacement position to the region of the stator electrodes.

Abstract: The disclosure relates to a device for transmitting electrical signals between a first interface element, arranged at a first structure of a lithography system, and a second interface element, arranged at a second structure of the lithography system. An electrical conductor connects the first interface element and the second interface element. The device has a hollow body which surrounds at least sections of the electrical conductor and which is designed to electromagnetically shield the electrical conductor. A gap is provided in the hollow body or between the hollow body and one of the structures and allows a relative movement of the first structure and the second structure to mechanically decouple the first structure from the second structure.

Abstract: A projection lens of an EUV-lithographic projection exposure system with at least two reflective optical elements each comprising a body and a reflective surface for projecting an object field on a reticle onto an image field on a substrate if the projection lens is exposed with an exposure power of EUV light, wherein the bodies of at least two reflective optical elements comprise a material with a temperature dependent coefficient of thermal expansion which is zero at respective zero cross temperatures, and wherein the absolute value of the difference between the zero cross temperatures is more than 6K.

Abstract: A method for illuminating an object field of a projection exposure apparatus includes providing a subset of first facets to be positioned in park positions, which are each spaced apart from an associated target position, but at most by a maximum distance.

Abstract: The disclosure relates to a device for transmitting electrical signals between a first interface element, arranged at a first structure of a lithography system, and a second interface element, arranged at a second structure of the lithography system. An electrical conductor connects the first interface element and the second interface element. The device has a hollow body which surrounds at least sections of the electrical conductor and which is designed to electromagnetically shield the electrical conductor. A gap is provided in the hollow body or between the hollow body and one of the structures and allows a relative movement of the first structure and the second structure to mechanically decouple the first structure from the second structure.

Abstract: A sensor device for capturing the displacement position of an optical component includes a plurality of stator electrodes and a mechanism or restricting the electric field that is relevant to the measurement of the displacement position to the region of the stator electrodes

Abstract: A projection lens of an EUV-lithographic projection exposure system with at least two reflective optical elements each comprising a body and a reflective surface for projecting an object field on a reticle onto an image field on a substrate if the projection lens is exposed with an exposure power of EUV light, wherein the bodies of at least two reflective optical elements comprise a material with a temperature dependent coefficient of thermal expansion which is zero at respective zero cross temperatures, and wherein the absolute value of the difference between the zero cross temperatures is more than 6K.