Patents by Inventor Markus Heckel

Markus Heckel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11224123
    Abstract: The disclosure provides a circuit board that includes: a carrier element having a number of circuit board layers; a number of electronic components; a number of thermal interfaces; and a number of electrical interfaces. The electronic components are arranged directly on at least one of the surface sides on the carrier element. The opposite surface side of the carrier element is of potential-free design. Additionally, the circuit board with the electronic components is overlaid by a covering material in such a way that the electronic components are mechanically stabilized and the thermal and/or electrical interfaces are free of the covering material.
    Type: Grant
    Filed: April 9, 2021
    Date of Patent: January 11, 2022
    Assignee: Vitesco Technologies Germany GmbH
    Inventors: Thomas Rumrich, Markus Heckel, Jürgen Sauerbier, Johannes Bock, Juergen Hornberger
  • Publication number: 20210227686
    Abstract: The disclosure provides a circuit board that includes: a carrier element having a number of circuit board layers; a number of electronic components; a number of thermal interfaces; and a number of electrical interfaces. The electronic components are arranged directly on at least one of the surface sides on the carrier element. The opposite surface side of the carrier element is of potential-free design. Additionally, the circuit board with the electronic components is overlaid by a covering material in such a way that the electronic components are mechanically stabilized and the thermal and/or electrical interfaces are free of the covering material.
    Type: Application
    Filed: April 9, 2021
    Publication date: July 22, 2021
    Applicant: Vitesco Technologies Germany GmbH
    Inventors: Thomas Rumrich, Markus Heckel, Jürgen Sauerbier, Johannes Bock, Juergen Hornberger
  • Publication number: 20210105897
    Abstract: A printed circuit board for transmission control and for arrangement on an interface is disclosed. The printed circuit board includes an upper side of the printed circuit board and an underside of the printed circuit board. A plurality of spaced-apart conductor tracks arranged at a distance from the upper side of the printed circuit board. The conductor tracks are connected to each other in an electrically conductive manner by way of a first plated-through hole. The first plated-through hole is drilled out on the underside of the printed circuit board in such a way that it is arranged so as to be set back in relation to the underside of the printed circuit board. The printed circuit board is arranged on an interface, the underside of the printed circuit board facing the interface.
    Type: Application
    Filed: December 17, 2020
    Publication date: April 8, 2021
    Applicant: Vitesco Technologies Germany GmbH
    Inventors: Johannes Bock, Markus Heckel
  • Publication number: 20060012941
    Abstract: 1. A method for operating an electronic module which is supplied with electrical energy by an operating voltage source with a circuit unit for carrying out at least one system function, wherein in the event of an operating voltage interruption the operating voltage is supplied by a system-autonomous capacitor and wherein the system function can be activated by means of the energy reserve supplied by a function-autonomous capacitor and in which furthermore the system-autonomous capacitor is charged by a voltage converter connected to the operating voltage source. 2.1.
    Type: Application
    Filed: September 25, 2003
    Publication date: January 19, 2006
    Inventors: Markus Heckel, Manfred Kulesch