Abstract: An apparatus for processing wafer-shaped articles comprises a spin chuck for holding a wafer-shaped article in a predetermined orientation, and a rotating shower head for supplying process gas to a surface of a wafer-shaped article when held by the spin chuck. The rotating shower head comprises an outlet plate having plural openings formed in each of a central and a peripheral region thereof. A process gas feed is provided so as to supply process gas to a gas distribution chamber. The gas distribution chamber is in fluid communication with a plurality of openings formed in the shower head.

Abstract: An apparatus for processing wafer-shaped articles, comprises a process chamber, and a spin chuck positioned inside the process chamber. The spin chuck is configured to hold a wafer-shaped article at a predetermined process position. A plate covers the spin chuck and is affixed to or formed integrally with the spin chuck for rotation therewith, the plate having a central opening. A nozzle assembly extends into the process chamber such that a discharge end of the nozzle assembly passes through the central opening of the plate to define a gap between the plate and the nozzle assembly, the gap extending from an upper inlet end to a lower outlet end. The nozzle assembly comprises at least one side nozzle positioned to direct a gas flow adjacent to the gap and upstream of the lower outlet end, and configured to generate a reduced pressure at a position upstream of the lower outlet end of the gap, thereby to control gas flow through the gap from the upper inlet end toward the lower outlet end.

Abstract: An apparatus for processing wafer-shaped articles comprises a spin chuck for holding a wafer-shaped article in a predetermined orientation, and a rotating shower head for supplying process gas to a surface of a wafer-shaped article when held by the spin chuck. The rotating shower head comprises an outlet plate having plural openings formed in each of a central and a peripheral region thereof. A process gas feed is provided so as to supply process gas to a gas distribution chamber. The gas distribution chamber is in fluid communication with a plurality of openings formed in the shower head.

Abstract: A device for liquid treatment of a wafer-shaped article comprises a closed process chamber, and a ring chuck located within the closed process chamber. The ring chuck is adapted to be driven without physical contact through a magnetic bearing. A magnetic stator surrounds the closed process chamber. The closed process chamber has a cylindrical wall positioned between the ring chuck and the magnetic stator during liquid treatment of a wafer-shaped article. Various structures are provided to prevent upward ingress of processing liquid into a gap defined between the ring chuck and the cylindrical wall.