Abstract: A process for the structuring of a substrate with structures in the micrometer to nanometer range that does not involve the provision of gaseous fluoro-organic compounds is described. The process is carried out by means of reactive ion etching using a mask arranged on the substrate and a plasma as well as fluorine-containing organic compounds, which fluorine-containing organic compound(s) is/are provided in the form of solid polymers. A process for the etching of a coating on a substrate or the surface of a substrate is also described.

Abstract: A process for the structuring of a substrate with structures in the micrometer to nanometer range that does not involve the provision of gaseous fluoro-organic compounds is described. The process is carried out by means of reactive ion etching using a mask arranged on the substrate and a plasma as well as fluorine-containing organic compounds, which fluorine-containing organic compound(s) is/are provided in the form of solid polymers. A process for the etching of a coating on a substrate or the surface of a substrate is also described.

Abstract: A device for the low-deformation support of an optical element (2), in particular of an end plate of a lens in a projection printing system for semiconductor elements, is provided with a mount (1), the optical element (2) being connected to the mount (1) at least partly via a bonding layer which is located between the adjacent circumferential walls (4, 5) of mount (1) and optical element (2). The mount (1) is provided with at least three bearing feet (3) which are distributed over the circumference and on which the optical element (2) rests. The bonding layer is located in an annular gap (6) between the adjacent circumferential walls (4, 5) of mount (1) and optical element (2) over at least one section thereof.