Patents by Inventor Markus Leitgeb

Markus Leitgeb has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11864319
    Abstract: A component carrier includes a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure and a through hole. An interposer is located in the through hole and has a higher density of connection elements than the stack. A first component is mounted on a first main surface of the interposer and a second component is mounted on a second main surface of the interposer. The first component and the second component are connected via the interposer.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: January 2, 2024
    Assignee: AT&SAustria Technologie &Systemtechnik AG
    Inventors: Mario Schober, Markus Leitgeb
  • Publication number: 20230413421
    Abstract: A component carrier which includes a stack having at least one electrically conductive layer structure, at least one electrically insulating layer structure, and a recess being at least partially formed in the stack, optionally having an electrically conductive coating, and being configured as waveguide, wherein a plurality of edges delimiting the recess are formed by electrically conductive material of the at least one electrically conductive layer structure and/or of the optional electrically conductive coating.
    Type: Application
    Filed: November 11, 2021
    Publication date: December 21, 2023
    Inventors: Heinrich Trischler, Erich Schlaffer, Markus Leitgeb, Sebastian Sattler, Simon Pressler
  • Patent number: 11784132
    Abstract: An interposer-type component carrier includes a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure; a cavity formed in an upper portion of the stack; an active component embedded in the cavity and having at least one terminal facing upwards; and a redistribution structure having only one electrically insulating layer structure above the component. A method of manufacturing an interposer-type component carrier is also disclosed.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: October 10, 2023
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Markus Leitgeb, Gerhard Freydl
  • Patent number: 11778751
    Abstract: A method of compensating misalignment during manufacturing laminate-type component carriers is disclosed. The method includes detecting an image of a region of interest of a component carrier structure during manufacturing the component carriers based on the component carrier structure, identifying a structural feature in the image of the region of interest showing misalignment with respect to a target design, and at least partially compensating the identified misalignment of the structural feature by modifying the target design of at least one correlated structural feature to be manufactured subsequently, wherein the at least one correlated structural feature is correlated to said structural feature showing misalignment.
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: October 3, 2023
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Abderrazzaq Ifis, Markus Leitgeb
  • Publication number: 20230298987
    Abstract: A component carrier includes a stack with electrically conductive layer structures and at least one electrically insulating layer structure. The electrically conductive layer structures have a higher density connection region and a lower density connection region, and a first component and a second component which are surface-mounted on the stack. The first component and the second component are electrically coupled with each other by the higher density connection region.
    Type: Application
    Filed: March 16, 2022
    Publication date: September 21, 2023
    Inventors: Markus Leitgeb, Gerhard Freydl
  • Publication number: 20230300982
    Abstract: A component carrier includes a stack with at least one electrically insulating layer structure and electrically conductive layer structures some of which have a first density of trace structures and a second density of connection structures, and a further stack with at least one further electrically insulating layer structure and further electrically conductive layer structures some of which have a third density of further trace structures and a fourth density of further connection structures. A first component is applied to the stack and a second component is embedded in the further stack. The connection structures are respectively connected to the further connection structures. The first density of trace structures is lower than the third density of further trace structures. The stack and the further stack are connected with each other by the connection structures and by the further connection structures. The first component is connected to the second component.
    Type: Application
    Filed: March 16, 2022
    Publication date: September 21, 2023
    Inventors: Markus Leitgeb, Gernot Grober
  • Patent number: 11682600
    Abstract: An arrangement includes a panel configured as a pre-form for manufacturing a plurality of component carriers; a protection layer covering a surface portion of a main surface of the panel, wherein the protection layer is detachable from the surface portion without leaving residues on the panel. A handling tool for handling the panel includes a surface onto which the panel is arrangeable. The panel includes a handling surface, with which the panel is arrangeable onto the handling tool, wherein the handling surface comprises at least part of the surface portion covered by the protection layer.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: June 20, 2023
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Markus Leitgeb, Marco Gavagnin, Heinz Habenbacher
  • Publication number: 20230135105
    Abstract: A method for manufacturing a component carrier includes i) providing a metal layer, in particular a copper layer; ii) forming a film on the metal layer; iii) patterning the film in order to expose a part of the metal layer; iv) carrying out a first etch, thereby thinning the film and removing a further part of the exposed metal layer; and thereafter v) carrying out a second etch, thereby forming at least one metal trace that is spatially separated from the metal layer. A component carrier made by the method is further described.
    Type: Application
    Filed: December 28, 2022
    Publication date: May 4, 2023
    Inventors: Bettina Schuster, Jonathan Silvano de Sousa, Andreas Zluc, Markus Leitgeb, Hannes Stahr
  • Publication number: 20230092954
    Abstract: A method includes forming a layer stack with at least one electrically insulating layer structure and at least one patterned electrically conductive layer structure on a temporary carrier, the layer stack includes a lower surface adjoining the temporary carrier and an upper surface opposite to the lower surface; mounting a first component at the upper surface; placing a first frame structure at the upper surface, the first frame structure surrounding at least partially the first component; covering the first component with a first coating material, the first coating material spatially extending at least partially into voids at or within the first frame structure and into voids at or within the layer stack; and removing the temporary carrier. The lower surface of the layer stack is an even surface. The opposite upper surface of the layer stack is an uneven surface. An electronic package can be manufactured with the described method.
    Type: Application
    Filed: September 16, 2022
    Publication date: March 23, 2023
    Inventors: Markus LEITGEB, Martin SCHREMS
  • Patent number: 11570897
    Abstract: A component carrier including a stack with a plurality of electrically insulating layer structures and/or a plurality of electrically conductive layer structures, and a component embedded in the stack, wherein at least a portion of a side wall of the component is exposed.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: January 31, 2023
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Bettina Schuster, Jonathan Silvano de Sousa, Andreas Zluc, Markus Leitgeb, Hannes Stahr
  • Patent number: 11452199
    Abstract: An electronic device including a first component carrier, a second component carrier connected with the first component carrier so that a thermal decoupling gap is formed between the first component carrier and the second component carrier, a first component on and/or in the second component carrier, and a second component having a first main surface mounted in the thermal decoupling gap so that at least part of an opposing second main surface and an entire sidewall of the second component is exposed with respect to material of the first component carrier and with respect to material of the second component carrier.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: September 20, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Martin Schrems, Markus Leitgeb, Steve Anderson
  • Patent number: 11450587
    Abstract: An electronic device includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a plurality of processing components on and/or in the stack, a process control component coupled with at least part of the processing components for transmitting signals and configured for controlling processes executed by the processing components and/or by the process control component, and a heat removal structure on or above which at least one of the process control component and the processing components is arranged.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: September 20, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Marco Gavagnin, Gerald Weis, Markus Leitgeb, Gernot Grober, Young Hy Jung
  • Patent number: 11388824
    Abstract: A component carrier and a method for manufacturing a component carrier is described wherein the component carrier includes a carrier body with a plurality of electrically conductive layer structures and/or electrically insulating layer structures and a wiring structure on and/or in the layer structures where the wiring structure is at least partially formed as a three-dimensionally printed structure.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: July 12, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Marco Gavagnin, Markus Leitgeb, Jonathan Silvano de Sousa, Ferdinand Lutschounig
  • Publication number: 20220190464
    Abstract: A component carrier and a method for manufacturing a component carrier are disclosed. The component carrier comprises a carrier body having a plurality of electrically conductive layer structures and/or electrically isolating layer structures and a three-dimensionally printed structure forming at least a part of an antenna on the carrier body.
    Type: Application
    Filed: March 4, 2022
    Publication date: June 16, 2022
    Inventors: Marco Gavagnin, Markus Leitgeb, Ahmad Bader Alothman Alterkawi, Ferdinand Lutschounig, Heinz Moitzi, Thomas Krivec, Gernot Grober, Erich Schlaffer, Mike Morianz, Rainer Frauwallner, Hubert Haidinger, Gernot Schulz, Gernot Gmunder
  • Patent number: 11277907
    Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and a partially exposed layer in a central region of the stack being exposed with regard to an upper side and a lower side by a respective blind hole formed in the stack, wherein each of opposing main surfaces of the exposed layer is partially covered by a respective adhesive layer.
    Type: Grant
    Filed: October 20, 2020
    Date of Patent: March 15, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Markus Leitgeb, Bernhard Reitmaier
  • Patent number: 11264708
    Abstract: An electronic assembly and a method for fabricating the same are disclosed. The assembly includes a component carrier, a wireless communication component and an antenna structure. The component carrier has at least one dielectric layer and a metallic layer. The wireless communication component is attached to the component carrier. The antenna structure is formed from a metallic material and is electrically connected with the wireless communication component. An opening formed in the component carrier extends from an upper surface into the interior of the component carrier. The antenna structure is formed at least partially at a wall of the opening.
    Type: Grant
    Filed: January 26, 2016
    Date of Patent: March 1, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Thomas Kristl, Martin Reiter, Johannes Stahr, Markus Leitgeb, Gernot Grober, Erich Schlaffer
  • Patent number: 11201119
    Abstract: A component carrier including i) an electronic component embedded in the component carrier, ii) an antenna structure arranged at a region of a first main surface of the component carrier, iii) a shielding structure made of an electrically conductive material and configured for shielding electromagnetic radiation from propagating between the antenna structure and the electronic component. Hereby, the shielding structure is arranged at least partially between the antenna structure and the electronic component. Furthermore, the component carrier includes an electrically conductive structure to electrically connect the electronic component and the antenna structure through the shielding structure. The shielding structure is non-perforated at least in a plane between the antenna structure and the electronic component.
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: December 14, 2021
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Markus Leitgeb, Martin Schrems, Erich Schlaffer, Steve Anderson
  • Publication number: 20210320068
    Abstract: An interposer-type component carrier includes a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure; a cavity formed in an upper portion of the stack; an active component embedded in the cavity and having at least one terminal facing upwards; and a redistribution structure having only one electrically insulating layer structure above the component. A method of manufacturing an interposer-type component carrier is also disclosed.
    Type: Application
    Filed: June 24, 2021
    Publication date: October 14, 2021
    Inventors: Markus Leitgeb, Gerhard Freydl
  • Publication number: 20210280490
    Abstract: An electronic device includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a plurality of processing components on and/or in the stack, a process control component coupled with at least part of the processing components for transmitting signals and configured for controlling processes executed by the processing components and/or by the process control component, and a heat removal structure on or above which at least one of the process control component and the processing components is arranged.
    Type: Application
    Filed: March 3, 2021
    Publication date: September 9, 2021
    Inventors: Marco Gavagnin, Gerald Weis, Markus Leitgeb, Gernot Grober, Young Hy Jung
  • Patent number: 11069622
    Abstract: An interposer-type component carrier includes a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure; a cavity formed in an upper portion of the stack; an active component embedded in the cavity and having at least one terminal facing upwards; and a redistribution structure having only one electrically insulating layer structure above the component. A method of manufacturing an interposer-type component carrier is also disclosed.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: July 20, 2021
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Markus Leitgeb, Gerhard Freydl