Patents by Inventor Markus Limacher

Markus Limacher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for mounting semiconductor chips
    Patent number: 6471110
    Abstract: With the mounting of semiconductor chips on a substrate having a solder portion a semiconductor chip held by a gripper spring mounted on a bondhead is lowered onto the substrate. In doing so, the gripper is deflected towards the bondhead. Subsequently, the semiconductor chip is raised by a predetermined distance and then released. Optionally, the semiconductor chip is moved up and down before being released. With this method, the semiconductor chip is under mechanical control until the solder has taken up a stable form and the semiconductor chip has achieved its final position.
    Type: Grant
    Filed: September 8, 2000
    Date of Patent: October 29, 2002
    Assignee: ESEC Trading SA
    Inventors: Christoph Luechinger, Markus Limacher