Patents by Inventor Markus Loehndorf
Markus Loehndorf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11287344Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.Type: GrantFiled: June 9, 2020Date of Patent: March 29, 2022Assignee: Infineon Technologies AGInventors: Mathias Vaupel, Matthias Boehm, Steven Gross, Markus Loehndorf, Stephan Schmitt, Horst Theuss, Helmut Wietschorke
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Publication number: 20200370983Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.Type: ApplicationFiled: June 9, 2020Publication date: November 26, 2020Applicant: Infineon Technologies AGInventors: Mathias Vaupel, Matthias Boehm, Steven Gross, Markus Loehndorf, Stephan Schmitt, Horst Theuss, Helmut Wietschorke
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Patent number: 10677675Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.Type: GrantFiled: August 28, 2018Date of Patent: June 9, 2020Assignee: Infineon Technologies AGInventors: Mathias Vaupel, Matthias Boehm, Steven Gross, Markus Loehndorf, Stephan Schmitt, Horst Theuss, Helmut Wietschorke
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Publication number: 20180364123Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.Type: ApplicationFiled: August 28, 2018Publication date: December 20, 2018Applicant: Infineon Technologies AGInventors: Mathias Vaupel, Matthias Boehm, Steven Gross, Markus Loehndorf, Stephan Schmitt, Horst Theuss, Helmut Wietschorke
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Patent number: 10060819Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.Type: GrantFiled: November 19, 2015Date of Patent: August 28, 2018Assignee: Infineon Technologies AGInventors: Mathias Vaupel, Matthias Boehm, Steven Gross, Markus Loehndorf, Stephan Schmitt, Horst Theuss, Helmut Wietschorke
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Publication number: 20160169763Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.Type: ApplicationFiled: November 19, 2015Publication date: June 16, 2016Applicant: INFINEON TECHNOLOGIES AGInventors: Mathias Vaupel, Matthias Boehm, Steven Gross, Markus Loehndorf, Stephan Schmitt, Horst Theuss, Helmut Wietschorke
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Patent number: 8106758Abstract: A tire localization system for locating the position of a tire of a vehicle having five or more wheels, includes a number of tire pressure monitoring system (TPMS) wheel modules of a vehicle TPMS, each wheel module being attached to each one of the wheels or a tire thereof, respectively. Each TPMS wheel module includes a radio, frequency identification (RFID) reader. The system further includes a number of RFID tags, each RFID tag being associated with and storing wheel position information of one of the wheels, and each RFID tag being positioned externally of its associated wheel. Each of the RFID readers is arranged, upon activation, to interrogate its associated RFID tag, and the associated RFID tag is arranged, upon interrogation, to transmit its stored position information to the RFID reader for transmission by the TPMS wheel module to a central control unit. A tire localization method is also provided.Type: GrantFiled: February 14, 2011Date of Patent: January 31, 2012Assignee: Infineon Technologies AGInventors: Markus Loehndorf, Terje Kvisteroey, Bjorn Blixhavn
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Patent number: 8098476Abstract: One embodiment of the present invention relates to a variable capacitor that operates without moving mechanical parts. In this capacitor electrically conductive electrodes are separated by an enclosed chamber filled with an electrically conductive material. The electrically conductive material can freely vary its position within the chamber. The capacitance of the device will vary as position of the conductive material changes due to external mechanical motion (ex: rotation, vibration, etc.) of the device. Other embodiments of this device are also disclosed.Type: GrantFiled: September 14, 2010Date of Patent: January 17, 2012Assignee: Infineon Technologies AGInventors: Markus Loehndorf, Terje Kvisteroey, Horst Theuss, Bjoern Blixhaven
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Patent number: 8087301Abstract: The invention is related to systems and methods for optically measuring conditions and characteristics related to vehicle tires. In one embodiment, a tire monitoring system comprises a grid, a camera, and a processor. The grid can be configured to deform in conjunction with a deformation of the tire. The camera can be mounted optically proximate the grid and configured to acquire an image of the grid. The processor can be in communication with the camera and configured detect the deformation of the tire from the image.Type: GrantFiled: September 24, 2007Date of Patent: January 3, 2012Assignee: Infineon Technologies AGInventors: Dirk Hammerschmidt, Markus Loehndorf, Terje Kvisteroey
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Patent number: 8049490Abstract: Embodiments of the invention are related to MEMS devices and methods. In one embodiment, a MEMS device includes a resonator element comprising a magnetic portion having a fixed magnetization, and at least one sensor element comprising a magnetoresistive portion, wherein a magnetization and a resistivity of the magnetoresistive portion vary according to a proximity of the magnetic portion.Type: GrantFiled: August 19, 2008Date of Patent: November 1, 2011Assignee: Infineon Technologies AGInventors: Markus Loehndorf, Wolfgang Raberg, Florian Schoen
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Patent number: 8049515Abstract: The invention relates to MEMS resonators. In one embodiment, an integrated resonator and sensor device includes a micro-electromechanical system (MEMS) resonator, and an anchor portion coupled to the MEMS resonator and configured to allow resonance of the MEMS resonator in a first plane of motion and movement of the MEMS resonator in a second plane of motion. In other embodiments, additional apparatuses, devices, systems and methods are disclosed.Type: GrantFiled: June 1, 2010Date of Patent: November 1, 2011Assignee: Infineon Technologies AGInventors: Florian Schoen, Markus Loehndorf
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Patent number: 7990257Abstract: A tire localization system for locating the position of a tire of a vehicle having five or more wheels, includes a number of tire pressure monitoring system (TPMS) wheel modules of a vehicle TPMS, each wheel module being attached to each one of the wheels or a tire thereof, respectively. Each TPMS wheel module includes a radio frequency identification (RFID) reader. The system further includes a number of RFID tags, each RFID tag being associated with and storing wheel position information of one of the wheels, and each RFID tag being positioned externally of its associated wheel. Each of the RFID readers is arranged, upon activation, to interrogate its associated RFID tag, and the associated RFID tag is arranged, upon interrogation, to transmit its stored position information to the RFID reader for transmission by the TPMS wheel module to a central control unit. A tire localization method is also provided.Type: GrantFiled: June 27, 2008Date of Patent: August 2, 2011Assignee: Infineon Technologies AGInventors: Markus Loehndorf, Terje Kvisteroey, Bjorn Blixhavn
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Publication number: 20110127877Abstract: The invention relates to MEMS resonators. In one embodiment, an integrated resonator and sensor device comprises a micro-electromechanical system (MEMS) resonator, and an anchor portion coupled to the MEMS resonator and configured to allow resonance of the MEMS resonator in a first plane of motion and movement of the MEMS resonator in a second plane of motion. In other embodiments, additional apparatuses, devices, systems and methods are disclosed.Type: ApplicationFiled: June 1, 2010Publication date: June 2, 2011Inventors: Florian Schoen, Markus Loehndorf
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Patent number: 7872851Abstract: One embodiment of the present invention relates to a variable capacitor that operates without moving mechanical parts. In this capacitor electrically conductive electrodes are separated by an enclosed chamber filled with an electrically conductive material. The electrically conductive material can freely vary its position within the chamber. The capacitance of the device will vary as position of the conductive material changes due to external mechanical motion (ex: rotation vibration, etc.) of the device. Other embodiments of this device are also disclosed.Type: GrantFiled: September 20, 2007Date of Patent: January 18, 2011Assignee: Infineon Technologies AGInventors: Markus Löhndorf, Terje Kvisteroey, Horst Theuss, Bjoern Blixhavn
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Publication number: 20110001493Abstract: One embodiment of the present invention relates to a variable capacitor that operates without moving mechanical parts. In this capacitor electrically conductive electrodes are separated by an enclosed chamber filled with an electrically conductive material. The electrically conductive material can freely vary its position within the chamber. The capacitance of the device will vary as position of the conductive material changes due to external mechanical motion (ex: rotation, vibration, etc.) of the device. Other embodiments of this device are also disclosed.Type: ApplicationFiled: September 14, 2010Publication date: January 6, 2011Applicant: Infineon Technologies AGInventors: Markus Löhndorf, Terje Kvisteroey, Horst Theuss, Bjoern Blixhavn
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Patent number: 7851925Abstract: A wafer-level packaged integrated circuit includes a semiconductor substrate including a first silicon layer. A micro-electromechanical system (MEMS) device is integrated into the first silicon layer. A thin-film deposited sealing member is deposited over the first silicon layer and is configured to seal a cavity in the first silicon layer. At least one additional layer is formed over the sealing member. At least one under bump metallization (UBM) is formed over the at least one additional layer.Type: GrantFiled: September 19, 2008Date of Patent: December 14, 2010Assignee: Infineon Technologies AGInventors: Horst Theuss, Markus Loehndorf, Florian Schoen
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Patent number: 7755367Abstract: The invention relates to MEMS resonators. In one embodiment, an integrated resonator and sensor device includes a micro-electromechanical system (MEMS) resonator, and an anchor portion coupled to the MEMS resonator and configured to allow resonance of the MEMS resonator in a first plane of motion and movement of the MEMS resonator in a second plane of motion. In other embodiments, additional apparatuses, devices, systems and methods are disclosed.Type: GrantFiled: June 2, 2008Date of Patent: July 13, 2010Assignee: Infineon Technologies, AGInventors: Florian Schoen, Markus Loehndorf
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Publication number: 20100072626Abstract: A wafer-level packaged integrated circuit includes a semiconductor substrate including a first silicon layer. A micro-electromechanical system (MEMS) device is integrated into the first silicon layer. A thin-film deposited sealing member is deposited over the first silicon layer and is configured to seal a cavity in the first silicon layer. At least one additional layer is formed over the sealing member. At least one under bump metallization (UBM) is formed over the at least one additional layer.Type: ApplicationFiled: September 19, 2008Publication date: March 25, 2010Applicant: INFINEON TECHNOLOGIES AGInventors: Horst Theuss, Markus Loehndorf, Florian Schoen
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Publication number: 20100045274Abstract: Embodiments of the invention are related to MEMS devices and methods. In one embodiment, a MEMS device includes a resonator element comprising a magnetic portion having a fixed magnetization, and at least one sensor element comprising a magnetoresistive portion, wherein a magnetization and a resistivity of the magnetoresistive portion vary according to a proximity of the magnetic portion.Type: ApplicationFiled: August 19, 2008Publication date: February 25, 2010Applicant: INFINEON TECHNOLOGIES AGInventors: Markus LOEHNDORF, Wolfgang RABERG, Florian SCHOEN
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Publication number: 20090301739Abstract: In one embodiment, a device comprises a container having a dispensing portion, a contents under pressure within the container, and an integrated circuit (IC) sensor device comprising a pressure sensor in communication with the contents under pressure. In various embodiments, the device can further comprise a fire extinguisher, a diving tank, a diving cylinder, a scuba tank, and an oxygen tank. Other embodiments of the invention relate to methods of monitoring, pressure sensing systems, and sensor and sensing modules.Type: ApplicationFiled: June 4, 2008Publication date: December 10, 2009Applicant: INFINEON TECHNOLOGIES AGInventors: Andreas Rother, Markus Loehndorf, Volker Taggruber