Patents by Inventor Markus Loehndorf

Markus Loehndorf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180364123
    Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.
    Type: Application
    Filed: August 28, 2018
    Publication date: December 20, 2018
    Applicant: Infineon Technologies AG
    Inventors: Mathias Vaupel, Matthias Boehm, Steven Gross, Markus Loehndorf, Stephan Schmitt, Horst Theuss, Helmut Wietschorke
  • Patent number: 10060819
    Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.
    Type: Grant
    Filed: November 19, 2015
    Date of Patent: August 28, 2018
    Assignee: Infineon Technologies AG
    Inventors: Mathias Vaupel, Matthias Boehm, Steven Gross, Markus Loehndorf, Stephan Schmitt, Horst Theuss, Helmut Wietschorke
  • Publication number: 20160169763
    Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.
    Type: Application
    Filed: November 19, 2015
    Publication date: June 16, 2016
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Mathias Vaupel, Matthias Boehm, Steven Gross, Markus Loehndorf, Stephan Schmitt, Horst Theuss, Helmut Wietschorke
  • Patent number: 8106758
    Abstract: A tire localization system for locating the position of a tire of a vehicle having five or more wheels, includes a number of tire pressure monitoring system (TPMS) wheel modules of a vehicle TPMS, each wheel module being attached to each one of the wheels or a tire thereof, respectively. Each TPMS wheel module includes a radio, frequency identification (RFID) reader. The system further includes a number of RFID tags, each RFID tag being associated with and storing wheel position information of one of the wheels, and each RFID tag being positioned externally of its associated wheel. Each of the RFID readers is arranged, upon activation, to interrogate its associated RFID tag, and the associated RFID tag is arranged, upon interrogation, to transmit its stored position information to the RFID reader for transmission by the TPMS wheel module to a central control unit. A tire localization method is also provided.
    Type: Grant
    Filed: February 14, 2011
    Date of Patent: January 31, 2012
    Assignee: Infineon Technologies AG
    Inventors: Markus Loehndorf, Terje Kvisteroey, Bjorn Blixhavn
  • Patent number: 8098476
    Abstract: One embodiment of the present invention relates to a variable capacitor that operates without moving mechanical parts. In this capacitor electrically conductive electrodes are separated by an enclosed chamber filled with an electrically conductive material. The electrically conductive material can freely vary its position within the chamber. The capacitance of the device will vary as position of the conductive material changes due to external mechanical motion (ex: rotation, vibration, etc.) of the device. Other embodiments of this device are also disclosed.
    Type: Grant
    Filed: September 14, 2010
    Date of Patent: January 17, 2012
    Assignee: Infineon Technologies AG
    Inventors: Markus Loehndorf, Terje Kvisteroey, Horst Theuss, Bjoern Blixhaven
  • Patent number: 8087301
    Abstract: The invention is related to systems and methods for optically measuring conditions and characteristics related to vehicle tires. In one embodiment, a tire monitoring system comprises a grid, a camera, and a processor. The grid can be configured to deform in conjunction with a deformation of the tire. The camera can be mounted optically proximate the grid and configured to acquire an image of the grid. The processor can be in communication with the camera and configured detect the deformation of the tire from the image.
    Type: Grant
    Filed: September 24, 2007
    Date of Patent: January 3, 2012
    Assignee: Infineon Technologies AG
    Inventors: Dirk Hammerschmidt, Markus Loehndorf, Terje Kvisteroey
  • Patent number: 8049490
    Abstract: Embodiments of the invention are related to MEMS devices and methods. In one embodiment, a MEMS device includes a resonator element comprising a magnetic portion having a fixed magnetization, and at least one sensor element comprising a magnetoresistive portion, wherein a magnetization and a resistivity of the magnetoresistive portion vary according to a proximity of the magnetic portion.
    Type: Grant
    Filed: August 19, 2008
    Date of Patent: November 1, 2011
    Assignee: Infineon Technologies AG
    Inventors: Markus Loehndorf, Wolfgang Raberg, Florian Schoen
  • Patent number: 8049515
    Abstract: The invention relates to MEMS resonators. In one embodiment, an integrated resonator and sensor device includes a micro-electromechanical system (MEMS) resonator, and an anchor portion coupled to the MEMS resonator and configured to allow resonance of the MEMS resonator in a first plane of motion and movement of the MEMS resonator in a second plane of motion. In other embodiments, additional apparatuses, devices, systems and methods are disclosed.
    Type: Grant
    Filed: June 1, 2010
    Date of Patent: November 1, 2011
    Assignee: Infineon Technologies AG
    Inventors: Florian Schoen, Markus Loehndorf
  • Patent number: 7990257
    Abstract: A tire localization system for locating the position of a tire of a vehicle having five or more wheels, includes a number of tire pressure monitoring system (TPMS) wheel modules of a vehicle TPMS, each wheel module being attached to each one of the wheels or a tire thereof, respectively. Each TPMS wheel module includes a radio frequency identification (RFID) reader. The system further includes a number of RFID tags, each RFID tag being associated with and storing wheel position information of one of the wheels, and each RFID tag being positioned externally of its associated wheel. Each of the RFID readers is arranged, upon activation, to interrogate its associated RFID tag, and the associated RFID tag is arranged, upon interrogation, to transmit its stored position information to the RFID reader for transmission by the TPMS wheel module to a central control unit. A tire localization method is also provided.
    Type: Grant
    Filed: June 27, 2008
    Date of Patent: August 2, 2011
    Assignee: Infineon Technologies AG
    Inventors: Markus Loehndorf, Terje Kvisteroey, Bjorn Blixhavn
  • Publication number: 20110127877
    Abstract: The invention relates to MEMS resonators. In one embodiment, an integrated resonator and sensor device comprises a micro-electromechanical system (MEMS) resonator, and an anchor portion coupled to the MEMS resonator and configured to allow resonance of the MEMS resonator in a first plane of motion and movement of the MEMS resonator in a second plane of motion. In other embodiments, additional apparatuses, devices, systems and methods are disclosed.
    Type: Application
    Filed: June 1, 2010
    Publication date: June 2, 2011
    Inventors: Florian Schoen, Markus Loehndorf
  • Patent number: 7872851
    Abstract: One embodiment of the present invention relates to a variable capacitor that operates without moving mechanical parts. In this capacitor electrically conductive electrodes are separated by an enclosed chamber filled with an electrically conductive material. The electrically conductive material can freely vary its position within the chamber. The capacitance of the device will vary as position of the conductive material changes due to external mechanical motion (ex: rotation vibration, etc.) of the device. Other embodiments of this device are also disclosed.
    Type: Grant
    Filed: September 20, 2007
    Date of Patent: January 18, 2011
    Assignee: Infineon Technologies AG
    Inventors: Markus Löhndorf, Terje Kvisteroey, Horst Theuss, Bjoern Blixhavn
  • Publication number: 20110001493
    Abstract: One embodiment of the present invention relates to a variable capacitor that operates without moving mechanical parts. In this capacitor electrically conductive electrodes are separated by an enclosed chamber filled with an electrically conductive material. The electrically conductive material can freely vary its position within the chamber. The capacitance of the device will vary as position of the conductive material changes due to external mechanical motion (ex: rotation, vibration, etc.) of the device. Other embodiments of this device are also disclosed.
    Type: Application
    Filed: September 14, 2010
    Publication date: January 6, 2011
    Applicant: Infineon Technologies AG
    Inventors: Markus Löhndorf, Terje Kvisteroey, Horst Theuss, Bjoern Blixhavn
  • Patent number: 7851925
    Abstract: A wafer-level packaged integrated circuit includes a semiconductor substrate including a first silicon layer. A micro-electromechanical system (MEMS) device is integrated into the first silicon layer. A thin-film deposited sealing member is deposited over the first silicon layer and is configured to seal a cavity in the first silicon layer. At least one additional layer is formed over the sealing member. At least one under bump metallization (UBM) is formed over the at least one additional layer.
    Type: Grant
    Filed: September 19, 2008
    Date of Patent: December 14, 2010
    Assignee: Infineon Technologies AG
    Inventors: Horst Theuss, Markus Loehndorf, Florian Schoen
  • Patent number: 7755367
    Abstract: The invention relates to MEMS resonators. In one embodiment, an integrated resonator and sensor device includes a micro-electromechanical system (MEMS) resonator, and an anchor portion coupled to the MEMS resonator and configured to allow resonance of the MEMS resonator in a first plane of motion and movement of the MEMS resonator in a second plane of motion. In other embodiments, additional apparatuses, devices, systems and methods are disclosed.
    Type: Grant
    Filed: June 2, 2008
    Date of Patent: July 13, 2010
    Assignee: Infineon Technologies, AG
    Inventors: Florian Schoen, Markus Loehndorf
  • Publication number: 20100072626
    Abstract: A wafer-level packaged integrated circuit includes a semiconductor substrate including a first silicon layer. A micro-electromechanical system (MEMS) device is integrated into the first silicon layer. A thin-film deposited sealing member is deposited over the first silicon layer and is configured to seal a cavity in the first silicon layer. At least one additional layer is formed over the sealing member. At least one under bump metallization (UBM) is formed over the at least one additional layer.
    Type: Application
    Filed: September 19, 2008
    Publication date: March 25, 2010
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Horst Theuss, Markus Loehndorf, Florian Schoen
  • Publication number: 20100045274
    Abstract: Embodiments of the invention are related to MEMS devices and methods. In one embodiment, a MEMS device includes a resonator element comprising a magnetic portion having a fixed magnetization, and at least one sensor element comprising a magnetoresistive portion, wherein a magnetization and a resistivity of the magnetoresistive portion vary according to a proximity of the magnetic portion.
    Type: Application
    Filed: August 19, 2008
    Publication date: February 25, 2010
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Markus LOEHNDORF, Wolfgang RABERG, Florian SCHOEN
  • Publication number: 20090301739
    Abstract: In one embodiment, a device comprises a container having a dispensing portion, a contents under pressure within the container, and an integrated circuit (IC) sensor device comprising a pressure sensor in communication with the contents under pressure. In various embodiments, the device can further comprise a fire extinguisher, a diving tank, a diving cylinder, a scuba tank, and an oxygen tank. Other embodiments of the invention relate to methods of monitoring, pressure sensing systems, and sensor and sensing modules.
    Type: Application
    Filed: June 4, 2008
    Publication date: December 10, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Andreas Rother, Markus Loehndorf, Volker Taggruber
  • Publication number: 20090295406
    Abstract: The invention relates to MEMS resonators. In one embodiment, an integrated resonator and sensor device comprises a micro-electromechanical system (MEMS) resonator, and an anchor portion coupled to the MEMS resonator and configured to allow resonance of the MEMS resonator in a first plane of motion and movement of the MEMS resonator in a second plane of motion. In other embodiments, additional apparatuses, devices, systems and methods are disclosed.
    Type: Application
    Filed: June 2, 2008
    Publication date: December 3, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Florian SCHOEN, Markus LOEHNDORF
  • Publication number: 20090080703
    Abstract: The invention is related to systems and methods for optically measuring conditions and characteristics related to vehicle tires. In one embodiment, a tire monitoring system comprises a grid, a camera, and a processor. The grid can be configured to deform in conjunction with a deformation of the tire. The camera can be mounted optically proximate the grid and configured to acquire an image of the grid. The processor can be in communication with the camera and configured detect the deformation of the tire from the image.
    Type: Application
    Filed: September 24, 2007
    Publication date: March 26, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Dirk HAMMERSCHMIDT, Terje KVISTEROEY, Markus LOEHNDORF
  • Patent number: 7472587
    Abstract: Embodiments of the invention are related to systems, methods, and apparatuses for detecting tire deformation. In one embodiment, a tire deformation detection system comprises a deformation detection structure, a transmitter, and receiver. The deformation detection structure can be mounted in a tire and configured to detect mechanical deformation of the tire. The transmitter can be configured to transmit data related to the mechanical deformation. The receiver can be configured to receive the data.
    Type: Grant
    Filed: September 18, 2007
    Date of Patent: January 6, 2009
    Assignee: Infineon Technologies AG
    Inventors: Markus Loehndorf, Horst Theuss, Matthias Karl Robert Hawraneck