Abstract: A microelectromechanical system (MEMS) resonator includes a substrate having a substantially planar surface and a resonant member having sidewalls disposed in a nominally perpendicular orientation with respect to the planar surface. Impurity dopant is introduced via the sidewalls of the resonant member such that a non-uniform dopant concentration profile is established along axis extending between the sidewalls parallel to the substrate surface and exhibits a relative minimum concentration in a middle region of the axis.

Abstract: A drive includes a transmission driven by an electric motor. A drive shaft of the transmission has multiple eccentric regions with differing widths in the axial direction, in which the high points thereof are offset relative to one another in the circumferential direction. The respective eccentric region is radially surrounded by a respective cam disk region, e.g., of a housing part of the transmission. Respective rollers are accommodated in respective recesses of a cage and arranged with a radial degree of freedom. The cage is rotationally fixed to the output shaft of the transmission, and the output shaft along with the cage is rotatably mounted both relative to the cam disk regions and relative to the drive shaft. During operation, the respective rollers are made to roll and/or slide on the respective cam disk region by the respective eccentric region. The eccentric regions are arranged behind one another in the axial direction such that the dynamic imbalance is minimized and/or eliminated.

Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead.

Abstract: A microelectromechanical system (MEMS) resonator includes a substrate having a substantially planar surface and a resonant member having sidewalls disposed in a nominally perpendicular orientation with respect to the planar surface. Impurity dopant is introduced via the sidewalls of the resonant member such that a non-uniform dopant concentration profile is established along axis extending between the sidewalls parallel to the substrate surface and exhibits a relative minimum concentration in a middle region of the axis.

Abstract: A drive includes a transmission driven by an electric motor. A drive shaft of the transmission has multiple eccentric regions with differing widths in the axial direction, in which the high points thereof are offset relative to one another in the circumferential direction. The respective eccentric region is radially surrounded by a respective cam disk region, e.g., of a housing part of the transmission. Respective rollers are accommodated in respective recesses of a cage and arranged with a radial degree of freedom. The cage is rotationally fixed to the output shaft of the transmission. The output shaft along with the cage is rotatably mounted both relative to the cam disk regions and relative to the drive shaft. During operation, the respective rollers are made to roll and/or slide on the respective cam disk region by the respective eccentric region. The eccentric regions are arranged behind one another in the axial direction such that the dynamic imbalance is minimized and/or eliminated.

Abstract: The present inventions, in one aspect, are directed to micromachined resonator comprising: a first resonant structure extending along a first axis, wherein the first axis is different from a crystal axis of silicon, a second resonant structure extending along a second axis, wherein the second axis is different from the first axis and the crystal axis of silicon and wherein the first resonant structure is coupled to the second resonant structure, and wherein the first and second resonant structures are comprised of silicon (for example, substantially monocrystalline) and include an impurity dopant (for example, phosphorus) having a concentrations which is greater than 1019 cm?3, and preferably between 1019 cm?3 and 1021 cm?3.

Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead.

Abstract: A gear motor includes an electric motor and a gearbox. The electric motor has a stator housing, a rotor shaft, and a first bearing for mounting the rotor shaft. A coupling sleeve is fitted onto the rotor shaft and is connected to the rotor shaft for conjoint rotation. An inner ring of a second bearing, e.g., a roller bearing, a ball bearing, etc., is fitted onto the coupling sleeve, and the outer ring of the second bearing is accommodated in an adapter ring which is connected to a housing part of the gearbox for conjoint rotation. The adapter ring is connected, on the side thereof facing away from the housing part, to an annular circular flange which is connected, on the side thereof facing away from the adapter ring, to a circular flange connected to the stator housing.

Abstract: A drive includes a transmission driven by an electric motor. A drive shaft of the transmission has multiple eccentric regions with differing widths in the axial direction, in which the high points thereof are offset relative to one another in the circumferential direction. The respective eccentric region is radially surrounded by a respective cam disk region, e.g., of a housing part of the transmission. Respective rollers are accommodated in respective recesses of a cage and arranged with a radial degree of freedom. The cage is rotationally fixed to the output shaft of the transmission, and the output shaft along with the cage is rotatably mounted both relative to the cam disk regions and relative to the drive shaft. During operation, the respective rollers are made to roll and/or slide on the respective cam disk region by the respective eccentric region. The eccentric regions are arranged behind one another in the axial direction such that the dynamic imbalance is minimized and/or eliminated.

Abstract: A planetary-gear mechanism includes a driving shaft and a first sun gear. The first sun gear is connected to the driving shaft for cojoint rotation. The driving shaft has a bore, e.g., an axial bore. The first sun gear has a stub portion, and a screw is screwed into a threaded bore in the stub portion. The screw head presses onto a plate part, which presses onto the stub portion via a spring device or via a spring device and at least one spacer, and the plate part bears against the driving shaft.

Abstract: A drive includes a transmission driven by an electric motor. A drive shaft of the transmission has multiple eccentric regions with differing widths in the axial direction, in which the high points thereof are offset relative to one another in the circumferential direction. The respective eccentric region is radially surrounded by a respective cam disk region, e.g., of a housing part of the transmission. Respective rollers are accommodated in respective recesses of a cage and arranged with a radial degree of freedom. The cage is rotationally fixed to the output shaft of the transmission. The output shaft along with the cage is rotatably mounted both relative to the cam disk regions and relative to the drive shaft. During operation, the respective rollers are made to roll and/or slide on the respective cam disk region by the respective eccentric region. The eccentric regions are arranged behind one another in the axial direction such that the dynamic imbalance is minimized and/or eliminated.

Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead.

Abstract: A resonator and/or MEMS device is provided with a flexible suspension mount to reduce mechanical stress and/or interference arising from other electrical components. In one illustrative embodiment, the flexible suspension mount can be configured as one or more metallic springs that provide for electrical connection as well as for specific spring and dampening coefficients. In another illustrative material, techniques can be use which change spring and/or dampening coefficients at a particular point in the manufacturing/assembly/distribution process, optionally before device characterization and/or programming.

Abstract: One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate-in effect, heating the MEMS component and optionally related circuitry to a steady-state “oven” temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).

Abstract: A gear motor includes an electric motor and a gearbox. The electric motor has a stator housing, a rotor shaft, and a first bearing for mounting the rotor shaft. A coupling sleeve is fitted onto the rotor shaft and is connected to the rotor shaft for conjoint rotation. An inner ring of a second bearing, e.g., a roller bearing, a ball bearing, etc., is fitted onto the coupling sleeve, and the outer ring of the second bearing is accommodated in an adapter ring which is connected to a housing part of the gearbox for conjoint rotation. The adapter ring is connected, on the side thereof facing away from the housing part, to an annular circular flange which is connected, on the side thereof facing away from the adapter ring, to a circular flange connected to the stator housing.

Abstract: A planetary-gear mechanism includes a driving shaft and a first sun gear. The first sun gear is connected to the driving shaft for cojoint rotation. The driving shaft has a bore, e.g., an axial bore. The first sun gear has a stub portion, and a screw is screwed into a threaded bore in the stub portion. The screw head presses onto a plate part, which presses onto the stub portion via a spring device or via a spring device and at least one spacer, and the plate part bears against the driving shaft.

Abstract: A bearing assembly includes a shaft, a first bearing, and a nut. The nut has a thread, which is screwed onto a threaded region formed on the shaft, and a bearing seat formed on the shaft adjoins the threaded region. The inner ring of the first bearing contacts the bearing seat, and the nut contacts the inner ring of the first bearing. The inner ring of the first bearing is arranged spaced apart from the threaded region of the shaft. A runout region of a thread cut into the threaded region of the shaft is arranged in a subsection of the bearing seat adjoining the threaded region.

Abstract: A microelectromechanical system (MEMS) resonator includes a substrate having a substantially planar surface and a resonant member having sidewalls disposed in a nominally perpendicular orientation with respect to the planar surface. Impurity dopant is introduced via the sidewalls of the resonant member such that a non-uniform dopant concentration profile is established along axis extending between the sidewalls parallel to the substrate surface and exhibits a relative minimum concentration in a middle region of the axis.

Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead.

Abstract: One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate—in effect, heating the MEMS component and optionally related circuitry to a steady-state “oven” temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).