Abstract: A method of manufacturing an assembly to couple an optical fiber to an opto-electronic component includes providing the optical fiber having an end section with a front face to couple light in and out of the optical fiber, providing a housing to encase the end section of the optical fiber. The housing is formed with an opening to receive the optical fiber. The method further includes inserting the optical fiber in the opening such that the end section of the optical fiber is disposed inside the housing, attaching the optical fiber to a surface of the housing arranged to form a boundary of the opening, and aligning the front face of the optical fiber to the opto-electronic component.

Abstract: An optical fiber having an end section with a front face to couple light in and out of the optical fiber is inserted in an opening of a housing to encase the end section of the optical fiber. The optical fiber is attached to a surface of the housing, wherein the surface forms a boundary of the opening. The front face of the optical fiber is aligned to the opto-electronic device such that light coupled out of the front face of the optical fiber is coupled into the opto-electronic device or light coupled out of the opto-electronic device is coupled into the optical fiber at the front face of the optical fiber.

Abstract: An optical splitter has an optical chip, in which a conductor track is arranged on a carrier substrate, wherein a conductor track section of the conductor track running from a first side of the chip branches into different conductor track sections which run to a second side of the chip via a plurality of branching nodes. An optical waveguide section of an optical waveguide is bonded at the first side of the chip by means of an adhesive material. Correspondingly, optical waveguide sections are bonded on the second side of the chip by means of an adhesive material. In order to reinforce the fixing, glass plates are arranged over and under the optical waveguides, said glass plates being bonded to the optical chip at the respective lateral surfaces.

Abstract: An optical splitter has an optical chip, in which a conductor track is arranged on a carrier substrate, wherein a conductor track section of the conductor track running from a first side of the chip branches into different conductor track sections which run to a second side of the chip via a plurality of branching nodes. An optical waveguide section of an optical waveguide is bonded at the first side of the chip by means of an adhesive material. Correspondingly, optical waveguide sections are bonded on the second side of the chip by means of an adhesive material. In order to reinforce the fixing, glass plates are arranged over and under the optical waveguides, said glass plates being bonded to the optical chip at the respective lateral surfaces.