Abstract: In accordance with an aspect of the invention, a collimator assembly for a X-ray spectrometer device is provided, the collimator assembly including a rotatable gear assembly including a collimator plate having a plurality of apertures of different size and/or shape arranged therein; a driving assembly for rotating the gear assembly to bring the gear assembly into a rotational position where a selected one of the plurality of apertures is spatially aligned with a predefined axis along which a collimated X-ray beam is to be provided from the X-ray spectrometer device; and a magnet arrangement for generating a magnetic force that is arranged to push or pull the gear assembly into a predefined direction of rotation to keep the selected one of the plurality of apertures spatially aligned with said predefined axis.

Abstract: In accordance with an aspect of the invention, a collimator assembly for a X-ray spectrometer device is provided, the collimator assembly including a rotatable gear assembly including a collimator plate having a plurality of apertures of different size and/or shape arranged therein; a driving assembly for rotating the gear assembly to bring the gear assembly into a rotational position where a selected one of the plurality of apertures is spatially aligned with a predefined axis along which a collimated X-ray beam is to be provided from the X-ray spectrometer device; and a magnet arrangement for generating a magnetic force that is arranged to push or pull the gear assembly into a predefined direction of rotation to keep the selected one of the plurality of apertures spatially aligned with said predefined axis.

Abstract: A three phase invertor has five coplanar leadframes for 2d-c terminals and 3a-c terminals. Power MOSFETs soldered around the periphery of one of the d-c leadframes are wire bonded to adjacent ones of the 3a-c leadframes which are mounted alongside the two edges and an end of one of the d-c leadframes. Further switching die are soldered to the 3a-c leadframes and wire bonded to the other d-c leadframe. The die are spaced along and follow a general U-shaped path. The leadframes are mounted on a heat sink which receives an insulation spacer and cap to form a hermetically sealed volume around the leadframes and die. The heat sink has cavities to mount bus capacitors and has a water cooling channel which follows and is below the U-shaped path of the die.