Patents by Inventor Markus Paul Wild

Markus Paul Wild has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8815039
    Abstract: A next processing pin is applied as a follow-on pin to a stone, wherein the stone is held by a preceding pin and fixed to the stone by way of a first adhesive bonding location. The preceding pin is separated from the stone. The follow-on pin is fixed to the stone by way of a second adhesive bonding location spaced from the first adhesive bonding location. The follow-on pin frontally receives a fluid adhesive at a spacing from the stone and the spacing between the adhesive-coated front end and the stone is reduced until the adhesive front end contacts the stone. The adhesive is hardened at the contact location as the second adhesive bonding location and heat is transferred by way of the preceding pin to the first adhesive bonding location A force component is exerted on the preceding pin to release the pin from the stone and to hold the stone with the next pin.
    Type: Grant
    Filed: December 23, 2008
    Date of Patent: August 26, 2014
    Assignee: Paul Wild OHG
    Inventors: Markus Paul Wild, Stefan Koehler
  • Publication number: 20110048626
    Abstract: A next processing pin is applied as a follow-on pin to a stone, wherein the stone is held by a preceding pin and fixed to the stone by way of a first adhesive bonding location. The preceding pin is separated from the stone. The follow-on pin is fixed to the stone by way of a second adhesive bonding location spaced from the first adhesive bonding location. The follow-on pin frontally receives a fluid adhesive at a spacing from the stone and the spacing between the adhesive-coated front end and the stone is reduced until the adhesive front end contacts the stone. The adhesive is hardened at the contact location as the second adhesive bonding location and heat is transferred by way of the preceding pin to the first adhesive bonding location A force component is exerted on the preceding pin to release the pin from the stone and to hold the stone with the next pin.
    Type: Application
    Filed: December 23, 2008
    Publication date: March 3, 2011
    Inventors: Markus Paul Wild, Stefan Koehler