Abstract: A composite system for the back contacting of photovoltaic modules includes a metal foil, which has a conducting-path structure, and at least one electrically insulating and stabilizing polymer layer, which is applied to the metal foil and adhesively connected to the metal foil. The main task of the stabilizing polymer layer is to mechanically stabilize the structured conducting paths such that the structured conducting paths do not move when shear forces occur, which are triggered, for example, by elevated temperature during the lamination process or during operation.

Abstract: The present disclosure relates to a composite assembly of plastic and metal films which can be used for the interconnection and connection of light emitting diodes. For this purpose, a flexible printed circuit board is provided, to which at least one radiation source is applied and which consists of a film system. The flexible printed circuit board has a thermal connection to a heat sink and the film system is composed at least of an insulating carrier layer and a metal film. The insulating carrier layer is opened at the locations at which the thermal connection to the heat sink is produced, and the metal film is subdivided into different sections.

Abstract: The present invention relates to a composite assembly of plastic (1, 3) and metal films (2.1, 2.2) which can be used for the interconnection and connection of light-emitting diodes (LEDs) (5). For this purpose, a flexible printed circuit board is provided, to which at least one radiation source is applied and which consists of a film system. The flexible printed circuit board has a thermal connection (6) to a heat sink (4) and the film system is composed at least of an insulating carrier layer and a metal film. The insulating carrier layer is opened at the locations at which the thermal connection to the heat sink is produced, and the metal film is subdivided into different sections.

Abstract: The present invention relates to a composite assembly of plastic (1, 3) and metal films (2.1, 2.2) which can be used for the interconnection and connection of light-emitting diodes (LEDs) (5). For this purpose, a flexible printed circuit board is provided, to which at least one radiation source is applied and which consists of a film system. The flexible printed circuit board has a thermal connection (6) to a heat sink (4) and the film system is composed at least of an insulating carrier layer and a metal film. The insulating carrier layer is opened at the locations at which the thermal connection to the heat sink is produced, and the metal film is subdivided into different sections.

Abstract: The present invention relates to a composite system for photovoltaic (PV) modules. The composite system consists of a carrier foil, a metal foil applied onto the carrier foil, and an insulating layer applied onto the metal foil. Using different connecting techniques, different photovoltaic (PV) cells can be fastened to the composite system and electrically interconnected thereby. In addition, the invention relates to a method for producing the composite system for PV modules, and to the use of the composite system for the back side contacting of wafer cells that have both contacts on the same side and that are placed, with the contacts, onto conductor structures that interconnect them into a module, and to the use of the composite system for modules of internally interconnected thin-film cells.