Abstract: The invention relates to a device and a method for simultaneously determining temperature-dependent thermal conductivity, thermal diffusivity and specific heat capacity and comprises a heat source for locally heating a solid body to be examined, a both locally and chronologically high-resolution line and/or surface detector for non-contact temperature measurement along the sample, and a cooling Circuit having a cooling liquid flowing around the lower sample edge, the temperature increase and flow rate of which cooling liquid are measured continuously. The thermal diffusivity is determined by means of the described method from the transient thermal States of the sample, which are adjusted in a controlled manner, during heating and cooling. The thermal conductivity is determined from the steady state with a constant heating output.

Abstract: A pressure sensor comprising two parts connected with one another via an active braze joint manufactured by active hard soldering, or brazing, with an active hard solder, or braze, especially a pressure contactable, pressure-dependently elastically deformable, measuring membrane, especially a ceramic measuring membrane, and a platform, especially a ceramic platform, which are connected by an active braze joint connecting an outer edge of the measuring membrane (which covers a pressure chamber with an outer edge of an end of the platform facing the measuring membrane, whose measuring characteristics are improved in that the active braze joint has a coefficient of thermal expansion dependent on the dimensions of the active braze joint and on the materials of the parts and matched to a coefficient of thermal expansion of at least one of the parts, especially the measuring membrane.

Abstract: A pressure sensor comprising two parts connected with one another via an active braze joint manufactured by active hard soldering, or brazing, with an active hard solder, or braze, especially a pressure contactable, pressure-dependently elastically deformable, measuring membrane, especially a ceramic measuring membrane, and a platform, especially a ceramic platform, which are connected by an active braze joint connecting an outer edge of the measuring membrane (which covers a pressure chamber with an outer edge of an end of the platform facing the measuring membrane, whose measuring characteristics are improved in that the active braze joint has a coefficient of thermal expansion dependent on the dimensions of the active braze joint and on the materials of the parts and matched to a coefficient of thermal expansion of at least one of the parts, especially the measuring membrane.

Abstract: An assembly comprising: two ceramic bodies, which are joined by means of a joint of an active hard solder, or braze, wherein the active hard solder, or braze, has a continuous core volume, which is spaced, in each case, from the ceramic bodies by at least 1 ?m, and an average composition CK with a liquidus temperature Tl(CK), wherein the composition CK has a coefficient of thermal expansion ?(CK), wherein ?(CK)=m·?(K), wherein m?1.5, especially m?1.3 and preferably m?1.2, wherein ?(K) is the average coefficient of thermal expansion of the ceramic material of the ceramic bodies, wherein the joint has boundary layers, which border on the ceramic body, wherein at least one of the boundary layers, which lies outside of the core volume, has an average composition CB with a liquidus temperature Tl(CB), which lies not less than 50 K, preferably not less than 100 K, and especially preferably not less than 200 K, under the liquidus temperature Tl(CK) of the average composition CK of the core volume.

Abstract: An assembly comprising: two ceramic bodies, which are joined by means of a joint of an active hard solder, or braze, wherein the active hard solder, or braze, has a continuous core volume, which is spaced, in each case, from the ceramic bodies by at least 1 ?m, and an average composition CK with a liquidus temperature Tl(CK), wherein the composition CK has a coefficient of thermal expansion ?(CK), wherein ?(CK)=m·?(K), wherein m?1.5, especially m?1.3 and preferably m?1.2, wherein ?(K) is the average coefficient of thermal expansion of the ceramic material of the ceramic bodies, wherein the joint has boundary layers, which border on the ceramic body, wherein at least one of the boundary layers, which lies outside of the core volume, has an average composition CB with a liquidus temperature Tl(CB), which lies not less than 50 K, preferably not less than 100 K, and especially preferably not less than 200 K, under the liquidus temperature Tl(CK) of the average composition CK of the core volume.

Abstract: The invention concerns a lead-free solder comprising a bismuth-based alloy. The lead-free solder has a proportion of at least 80 percent by weight of bismuth and a solidus temperature of at least 260° C.