Patents by Inventor Markus Rogalla
Markus Rogalla has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7592195Abstract: In a method for producing a sensor arrangement and the resulting sensor arrangement, a sensor is provided on or in a chip and the chip is covered with a protective cover, the cover being an interface between the sensor and the environment. An adhesive layer is provided between the chip and the protective cover, the adhesive layer alone or together with the protective cover being an interface between the sensor and the environment. The protective cover and/or the adhesive layer may have a channel formed therein, the channel functioning as the reception channel for a sensor. In an alternative embodiment, the protective cover placed on a wafer with several chips, and the wafer is cut up to produce the individual chips with the protective cover. Thus, a sensor arrangement may have the protective cover applied to the individual chip after the chip is cut from the wafer, or the protective cover may be applied to the wafer, and the wafer and cover are then cut up into the individual chips and corresponding covers.Type: GrantFiled: February 7, 2003Date of Patent: September 22, 2009Assignee: Micronas GmbHInventors: Markus Rogalla, Ingo Freund, Mirko Lehmann
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Publication number: 20090153187Abstract: The invention relates to integrated circuits comprising a monolithically integrated logic IC and a monolithically integrated interface circuit that is conductively connected to the logic IC. The electrical properties of said interface circuit are programmable. The interface circuit also has a lower integration density than the logic IC, and comprises monitoring modules for monitoring the logic ICs.Type: ApplicationFiled: November 24, 2004Publication date: June 18, 2009Applicant: Micronas GmbHInventors: Reiner Bidenbach, Jörg Franke, Burkhard Giebel, Markus Rogalla
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Patent number: 7414308Abstract: An integrated circuit comprises a package and having adjacent connection pins on two opposite sides of the package, with every second connection pin being inwardly bent so that the connection pins are offset. The ends of the inwardly bent connection pins and the ends of the outer connection pins each lie on a straight line, where the offset connection pins are bent by different angles out of the plane of the package.Type: GrantFiled: December 7, 2005Date of Patent: August 19, 2008Assignee: Micronas GmbHInventors: Wolfgang Hauser, Heiko Dreher, Christian Kimstedt, Markus Rogalla
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Patent number: 7284321Abstract: A method for testing a chip with a package having connecting pins and mounting the package on a board combines the advantages of a package with inline connecting pins with that of a package with offset connecting pins. The package with inline connecting is inserted into a socket for testing. Before mounting on the board, at least one connecting pin, preferably every second connecting pin, of the package is bent inward by a bending tool to achieve an offset arrangement of the connecting pins. The package is preferably mounted on the board using the bending tool. Since every second connecting pin is not bent inward immediately before insertion of the connecting pins, no subsequent corrective alignment of the offset connecting pins is required.Type: GrantFiled: May 17, 2005Date of Patent: October 23, 2007Assignee: Micronas GmbHInventors: Wolfgang Hauser, Heiko Dreher, Christian Kimstedt, Markus Rogalla
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Publication number: 20060151772Abstract: A carrier device for a monolithic integrated circuit has portions for the connection of bonding wires in the form of pedestals that rise above a chip connection area on the carrier device and have steep sides.Type: ApplicationFiled: October 6, 2003Publication date: July 13, 2006Inventors: Giovanni Tricomi, Michael Schmidt, Wolfgang Hauser, Markus Rogalla
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Patent number: 7053480Abstract: The invention relates to the fabrication and testing of a chip with a package (2) having connecting pins (1) as well as to mounting the package (2) on a board (5), whereby in order to combine the advantages of a package (2) with inline connecting pins (1) with the advantages of a package (2) with offset connecting pins (11, 12), the package (2) is fabricated with inline connecting pins (1) and inserted into a test socket (3) for testing. Immediately before mounting on the board (5), at least one connecting pin, preferably every second connecting pin (12), of the package (2) is bent inward by a bending tool (6) so as to achieve an offset arrangement of the connecting pins (11, 12). The package (2) is preferably mounted on the board (5) using the bending tool (6). A simple, inexpensively produced test socket (3) is sufficient for the purpose of testing the chip. An inexpensively produced guide brace (4), for example, is suitable as a packaging means.Type: GrantFiled: July 26, 2002Date of Patent: May 30, 2006Assignee: MICRONAS GmbHInventors: Wolfgang Hauser, Heiko Dreher, Christian Kimstedt, Markus Rogalla
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Publication number: 20060108679Abstract: The invention relates to the fabrication and testing of a chip with a package (2) having connecting pins (1) as well as to mounting the package (2) on a board (5), whereby in order to combine the advantages of a package (2) with inline connecting pins (1) with the advantages of a package (2) with offset connecting pins (11, 12), the package (2) is fabricated with inline connecting pins (1) and inserted into a test socket (3) for testing. Immediately before mounting on the board (5), at least one connecting pin, preferably every second connecting pin (12), of the package (2) is bent inward by a bending tool (6) so as to achieve an offset arrangement of the connecting pins (11, 12). The package (2) is preferably mounted on the board (5) using the bending tool (6). A simple, inexpensively produced test socket (3) is sufficient for the purpose of testing the chip. An inexpensively produced guide brace (4), for example, is suitable as a packaging means.Type: ApplicationFiled: December 7, 2005Publication date: May 25, 2006Inventors: Wolfgang Hauser, Heiko Dreher, Christian Kimstedt, Markus Rogalla
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Publication number: 20050258849Abstract: The invention relates to the fabrication and testing of a chip with a package (2) having connecting pins (1) as well as to mounting the package (2) on a board (5), whereby in order to combine the advantages of a package (2) with inline connecting pins (1) with the advantages of a package (2) with offset connecting pins (11, 12), the package (2) is fabricated with inline connecting pins (1) and inserted into a test socket (3) for testing. Immediately before mounting on the board (5), at least one connecting pin, preferably every second connecting pin (12), of the package (2) is bent inward by a bending tool (6) so as to achieve an offset arrangement of the connecting pins (11, 12). The package (2) is preferably mounted on the board (5) using the bending tool (6). A simple, inexpensively produced test socket (3) is sufficient for the purpose of testing the chip. An inexpensively produced guide brace (4), for example, is suitable as a packaging means.Type: ApplicationFiled: May 17, 2005Publication date: November 24, 2005Inventors: Wolfgang Hauser, Heiko Dreher, Christian Kimstedt, Markus Rogalla
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Patent number: 6964927Abstract: The invention relates to a method for producing a sensor (1), wherein a carrier chip (2) is produced. Said chip is provided with a sensor structure (3) comprising an active sensor surface (4). A material (9) capable of flowing is applied onto carrier chips (2) in such a way that the sensor structure (3) has a thinner layer thickness on said active sensor surface (4) than on the area of the carrier chip (2) which borders on the active sensor surface (4). The material (9) which is capable of flowing is hardened thereafter. The hardened material (9) is subsequently removed by chemical means from the surface which faces said carrier chip (2) until the active sensor surface of the sensor structure is layed bare.Type: GrantFiled: December 7, 2001Date of Patent: November 15, 2005Assignee: Micronas GmbHInventors: Günter Igel, Markus Rogalla
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Publication number: 20050155411Abstract: In a method for producing a sensor arrangement and the resulting sensor arrangement, a sensor is provided on or in a chip and the chip is covered with a protective cover, the cover being an interface between the sensor and the environment. An adhesive layer is provided between the chip and the protective cover, the adhesive layer alone or together with the protective cover being an interface between the sensor and the environment. The protective cover and/or the adhesive layer may have a channel formed therein, the channel functioning as the reception channel for a sensor. In an alternative embodiment, the protective cover placed on a wafer with several chips, and the wafer is cut up to produce the individual chips with the protective cover. Thus, a sensor arrangement may have the protective cover applied to the individual chip after the chip is cut from the wafer, or the protective cover may be applied to the wafer, and the wafer and cover are then cut up into the individual chips and corresponding covers.Type: ApplicationFiled: February 7, 2003Publication date: July 21, 2005Inventors: Markus Rogalla, Ingo Freund, Mirko Lehmann
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Publication number: 20050009216Abstract: The invention relates to the fabrication and testing of a chip with a package (2) having connecting pins (1) as well as to mounting the package (2) on a board (5), whereby in order to combine the advantages of a package (2) with inline connecting pins (1) with the advantages of a package (2) with offset connecting pins (11, 12), the package (2) is fabricated with inline connecting pins (1) and inserted into a test socket (3) for testing. Immediately before mounting on the board (5), at least one connecting pin, preferably every second connecting pin (12), of the package (2) is bent inward by a bending tool (6) so as to achieve an offset arrangement of the connecting pins (11, 12). The package (2) is preferably mounted on the board (5) using the bending tool (6). A simple, inexpensively produced test socket (3) is sufficient for the purpose of testing the chip. An inexpensively produced guide brace (4), for example, is suitable as a packaging means.Type: ApplicationFiled: July 26, 2002Publication date: January 13, 2005Inventors: Wolfgang Hauser, Heiko Dreher, Christian Kimstedt, Markus Rogalla
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Publication number: 20030148610Abstract: The invention relates to a method for producing a sensor (1), wherein a carrier chip (2) is produced. Said chip is provided with a sensor structure (3) comprising an active sensor surface (4). A material (9) capable of flowing is applied onto carrier chips (2) in such a way that the sensor structure (3) has a thinner layer thickness on said active sensor surface (4) than on the area of the carrier chip (2) which borders on the active sensor surface (4). The material (9) which is capable of flowing is hardened thereafter. The hardened material (9) is subsequently removed by chemical means from the surface which faces said carrier chip (2) until the active sensor surface of the sensor structure is layed bare.Type: ApplicationFiled: January 13, 2003Publication date: August 7, 2003Inventors: Gunter Igel, Markus Rogalla