Abstract: Disclosed is a radiation-sensitive recording material comprising a support, a radiation-sensitive recording layer and a rough covering layer which is applied by spraying and drying a solution which has substantially the same composition as the recording layer. Due to its rough surface, the material provides for accelerated vacuum contact in the copying process. Also disclosed is a process for producing the radiation-sensitive recording material described above.

Abstract: Method and manufacture for electrically insulating base material used for perforated plated-through printed circiut panels with a metal core. The method includes applying a radiation-curable layer of insulating material to the preperforated metal core by an electrostatic spray method and precuring by irradiation or heat, coating with a further thin, thermally curable layer of insulating material by electrophoresis, drying the layer by heating and likewise partially curing it so that it is no longer capable of flowing, but yet is still reactive, optionally applying further curable insulating layers, and finally, fully thermally curing the entire coating of insulating material. The coatings obtained are impervious and are of uniform thickness even at the hole walls.

Abstract: A process for the manufacture of through-hole plated electric printed-circuit boards is described, in which a board of an insulating material is provided with plated-through holes which are arranged in a grid pattern and the walls of which are coated with a conductive metal layer. The board is covered with a conductive metal layer on at least one side thereof. After metallizing the holes, the metal layer is covered imagewise and the areas of the metal layer which are not covered are either reinforced by metal deposition or removed by etching. Together with the metal layer, part of the holes are covered in such a way that only the required portion of all holes act as conductive connections in the final product. The process of the present invention permits the large-scale manufacture of a predrilled or prepunched and premetallized base material for printed circuits.

Abstract: This invention relates to an improvement in a light-sensitive layer transfer material comprising a temporary film support and a light-sensitive thermoplastic photoresist layer detachably connected therewith, the improvement being that the underside of the film support has a lower adhesion to the photoresist layer than its upper side. The invention also relates to a process for transferring a light-sensitive photoresist layer from a temporary to a permanent support.

Abstract: An electrophotographic recording material comprising an electrically conductive support, a photoconductor layer and an about 1 to about 50 .mu.m thick protective layer comprising a radiation-hardened, crosslinked polyester which is formed from trimethylol propane, adipic acid and acrylic acid and which has a surface resistance ranging from about 5.5.multidot.10.sup.12 to about 2.5.multidot.10.sup.13 ohm and a volume resistivity ranging from about 7.multidot.10.sup.10 to about 5.multidot.10.sup.13 ohm cm, measured at 23.degree. C. and 50 percent relative humidity, and a process for producing such a recording material.

Abstract: A light-sensitive vesicular recording material comprising a support and a layer comprised of a binder and a light-sensitive compound applied to the support, said binder comprising a butanone soluble copolymer of methacrylonitrile and vinylidene chloride; particularly, a mixture of a butanone soluble methacrylonitrile/vinylidene chloride copolymer and a vinylidene chloride/acrylonitrile copolymer, said copolymers being miscible with each other in butanone.