Patents by Inventor Markus Steinkellner

Markus Steinkellner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Component carrier with a solid body protecting a component carrier hole from foreign material ingression
    Patent number: 11612064
    Abstract: A component carrier includes (a) a first stack with at least one first electrically conductive layer structure and/or at least one first electrically insulating layer structure; (b) a hole formed within the first stack; and (c) a non-deformable solid body closing a portion of the hole and being spaced with respect to side walls of the hole by a gap. A component carrier assembly includes (a) a component carrier as described above; (b) a second stack having at least one second electrically conductive layer structure and/or at least one second electrically insulating layer structure; and (c) a connection piece connecting the first stack with the second stack. Further described are methods for manufacturing such a component carrier and such a component carrier assembly.
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: March 21, 2023
    Assignee: AT&SAustria Technologie & Systemtechnik AG
    Inventors: Erich Schlaffer, Markus Steinkellner
  • Component Carrier With a Solid Body Protecting a Component Carrier Hole From Foreign Material Ingression
    Publication number: 20210360795
    Abstract: A component carrier includes (a) a first stack with at least one first electrically conductive layer structure and/or at least one first electrically insulating layer structure; (b) a hole formed within the first stack; and (c) a non-deformable solid body closing a portion of the hole and being spaced with respect to side walls of the hole by a gap. A component carrier assembly includes (a) a component carrier as described above; (b) a second stack having at least one second electrically conductive layer structure and/or at least one second electrically insulating layer structure; and (c) a connection piece connecting the first stack with the second stack. Further described are methods for manufacturing such a component carrier and such a component carrier assembly.
    Type: Application
    Filed: May 7, 2021
    Publication date: November 18, 2021
    Inventors: Erich Schlaffer, Markus Steinkellner