Patents by Inventor Markus Steinlin

Markus Steinlin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12528140
    Abstract: A an optical device for shaping an electromagnetic wave beam and a use thereof, a beam treatment device and a use thereof, and a beam treatment method are provided. The optical device has an optical element positioned within beam propagation direction, and an exciter means functionally connected to the optical element for inducing an oscillation of the focal point in at least one of an x direction and any direction of a plane perpendicular to the beam propagation direction along a focal point oscillation path.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: January 20, 2026
    Assignee: Bystronic Laser AG
    Inventors: Thomas Rataj, Markus Steinlin, Simon Scheidiger
  • Patent number: 12285820
    Abstract: A control unit for calculating a spatially and time-resolved, combined setpoint data set for control of a laser cutting process includes a measurement data interface for accessing sensor data during the cutting operation, a process interface to a first memory that stores a process model that estimates status data of the laser cutting process and a cutting result, a machine interface to a second memory in which a machine model is stored which represents a kinematic behaviour of the laser cutting head and estimates status data of a movement process and the cutting result thereof, and a processor that executes an algorithm that couples the process model and the machine model via a feed rate value and/or via a nozzle spacing value. The processor accesses the process model and the machine model in order to calculate the spatially and time-resolved, combined setpoint data set with coordinated setpoints.
    Type: Grant
    Filed: September 17, 2024
    Date of Patent: April 29, 2025
    Assignee: BYSTRONIC LASER AG
    Inventors: Markus Steinlin, Titus Haas
  • Patent number: 12269122
    Abstract: In one aspect, the present invention relates to a control unit (RE) for calculating a spatially and time-resolved, combined setpoint data set (SW-DS) for open- and/or closed-loop control of a laser cutting process during laser cutting with a laser cutting machine (L), wherein a processor (P) is intended to access a process model (PM) in a first memory (SI) via a process interface (P-SS) and a machine model (MM) in a second memory (S2) via a machine interface (M-SS) in order, on the basis of an estimated status data of the laser cutting process and the movement process, to calculate the spatially and time-resolved, combined setpoint data set (SW-DS) with coordinated setpoints for the laser cutting process and setpoints for the movement process, taking into account the read-in sensor data.
    Type: Grant
    Filed: October 15, 2021
    Date of Patent: April 8, 2025
    Assignee: BYSTRONIC LASER AG
    Inventors: Markus Steinlin, Titus Haas
  • Publication number: 20250001527
    Abstract: A control unit for calculating a spatially and time-resolved, combined setpoint data set for control of a laser cutting process includes a measurement data interface for accessing sensor data during the cutting operation, a process interface to a first memory that stores a process model that estimates status data of the laser cutting process and a cutting result, a machine interface to a second memory in which a machine model is stored which represents a kinematic behaviour of the laser cutting head and estimates status data of a movement process and the cutting result thereof, and a processor that executes an algorithm that couples the process model and the machine model via a feed rate value and/or via a nozzle spacing value. The processor accesses the process model and the machine model in order to calculate the spatially and time-resolved, combined setpoint data set with coordinated setpoints.
    Type: Application
    Filed: September 17, 2024
    Publication date: January 2, 2025
    Inventors: Markus STEINLIN, Titus HAAS
  • Patent number: 12042880
    Abstract: Cutting a workpiece and producing workpiece parts are disclosed. The device has a cutting head with laser beam optics with a dynamic laser beam movement unit. A cutting head movement unit moves the laser beam over the workpiece. A control unit has a determination module to determine a movement trajectory of the laser beam, a memory unit from which at least one predetermined parameter selected from a movement parameter of the cutting head movement unit, a movement parameter of the laser beam movement unit and a parameter of a deviation of a cut contour from a predetermined contour is retrievable, and an optimization module for adjusting the movement trajectory by overlaying the movement of the laser beam via the cutting head with a high frequency beam-shaping movement of the laser beam via the laser beam movement unit based on the at least one predetermined parameter.
    Type: Grant
    Filed: March 9, 2022
    Date of Patent: July 23, 2024
    Assignee: BYSTRONIC LASER AG
    Inventors: Titus Haas, Simon Scheidiger, Markus Steinlin, Michael Berger
  • Publication number: 20240033858
    Abstract: Cutting a workpiece and producing workpiece parts are disclosed. The device has a cutting head with laser beam optics with a dynamic laser beam movement unit. A cutting head movement unit moves the laser beam over the workpiece. A control unit has a determination module to determine a movement trajectory of the laser beam, a memory unit from which at least one predetermined parameter selected from a movement parameter of the cutting head movement unit, a movement parameter of the laser beam movement unit and a parameter of a deviation of a cut contour from a predetermined contour is retrievable, and an optimization module for adjusting the movement trajectory by overlaying the movement of the laser beam via the cutting head with a high frequency beam-shaping movement of the laser beam via the laser beam movement unit based on the at least one predetermined parameter.
    Type: Application
    Filed: March 9, 2022
    Publication date: February 1, 2024
    Inventors: Titus HAAS, Simon SCHEIDIGER, Markus STEINLIN, Michael BERGER
  • Publication number: 20230271276
    Abstract: In one aspect, the present invention relates to a control unit (RE) for calculating a spatially and time-resolved, combined setpoint data set (SW-DS) for open- and/or closed-loop control of a laser cutting process during laser cutting with a laser cutting machine (L), wherein a processor (P) is intended to access a process model (PM) in a first memory (SI) via a process interface (P-SS) and a machine model (MM) in a second memory (S2) via a machine interface (M-SS) in order, on the basis of an estimated status data of the laser cutting process and the movement process, to calculate the spatially and time-resolved, combined setpoint data set (SW-DS) with coordinated setpoints for the laser cutting process and setpoints for the movement process, taking into account the read-in sensor data.
    Type: Application
    Filed: October 15, 2021
    Publication date: August 31, 2023
    Inventors: Markus STEINLIN, Titus HAAS
  • Patent number: 11554454
    Abstract: The present disclosure relates to a fixing device arranged to be fastened to a machining head such as a drill head. A machine tool for machining workpieces such as metal sheets at a machining point is also disclosed. The workpieces may be machined from a machining side. A fastening device is included and adapted for fastening the fixing device to the machining head. A fixing head is included and adapted for releasably, locally fixing the workpiece on its machining side and adjacent to the machining point. A controller is included and configured to control the fixing and releasing of the fixing head on a workpiece.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: January 17, 2023
    Assignee: Bystronic Laser AG
    Inventors: Michael Berger, Markus Steinlin, Wilfried Liegard
  • Patent number: 11478879
    Abstract: According to the present application, a machining apparatus (10) for the laser machining of a workpiece (12) in a machining zone (13) is provided, having a first interface (14) for a machining laser source for generating a machining laser beam (15), a second interface (16) for a detector device (for detecting radiation (17) emitted by the machining zone (13); an outlet opening (18) for the machining laser beam (14); and first and second laser beam guiding devices (20, 22), wherein the first laser beam guiding device (20), 20a, 20b) is arranged and designed such that it guides the machining laser beam (14) to the second laser beam guiding device (22) and dynamically moves the machining laser beam (14), and the second laser beam guiding device (22) is arranged and designed such that it guides the dynamically moved machining laser beam (14) through the outlet opening (18) and at least partially guides the radiation (17) emitted by the machining zone (13) through the outlet opening to the second interface (16).
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: October 25, 2022
    Assignee: BYSTRONIC LASER AG
    Inventors: Simon Scheidiger, Andreas Luedi, Martin Mumenthaler, Markus Steinlin
  • Publication number: 20220143756
    Abstract: According to the present application, a machining apparatus (10) for the laser machining of a workpiece (12) in a machining zone (13) is provided, having a first interface (14) for a machining laser source for generating a machining laser beam (15), a second interface (16) for a detector device (for detecting radiation (17) emitted by the machining zone (13); an outlet opening (18) for the machining laser beam (14); and first and second laser beam guiding devices (20, 22), wherein the first laser beam guiding device (20), 20a, 20b) is arranged and designed such that it guides the machining laser beam (14) to the second laser beam guiding device (22) and dynamically moves the machining laser beam (14), and the second laser beam guiding device (22) is arranged and designed such that it guides the dynamically moved machining laser beam (14) through the outlet opening (18) and at least partially guides the radiation (17) emitted by the machining zone (13) through the outlet opening to the second interface (16).
    Type: Application
    Filed: June 5, 2020
    Publication date: May 12, 2022
    Inventors: Simon SCHEIDIGER, Andreas LUEDI, Martin MUMENTHALER, Markus STEINLIN
  • Publication number: 20220040807
    Abstract: The present disclosure relates to a fixing device arranged to be fastened to a machining head such as a drill head. A machine tool for machining workpieces such as metal sheets at a machining point is also disclosed. The workpieces may be machined from a machining side. A fastening device is included and adapted for fastening the fixing device to the machining head. A fixing head is included and adapted for releasably, locally fixing the workpiece on its machining side and adjacent to the machining point. A controller is included and configured to control the fixing and releasing of the fixing head on a workpiece.
    Type: Application
    Filed: October 20, 2021
    Publication date: February 10, 2022
    Inventors: Michael Berger, Markus Steinlin, Wilfried Liegard
  • Publication number: 20210379711
    Abstract: The present disclosure relates to a fixing device arranged to be fastened to a machining head such as a drill head. A machine tool for machining workpieces such as metal sheets at a machining point is also disclosed. The workpieces may be machined from a machining side. A fastening device is included and adapted for fastening the fixing device to the machining head. A fixing head is included and adapted for releasably, locally fixing the workpiece on its machining side and adjacent to the machining point. A controller is included and configured to control the fixing and releasing of the fixing head on a workpiece.
    Type: Application
    Filed: October 8, 2019
    Publication date: December 9, 2021
    Inventors: Michael BERGER, Markus STEINLIN, Wilfried LIEGARD
  • Publication number: 20200398373
    Abstract: A an optical device for shaping an electromagnetic wave beam and a use thereof, a beam treatment device and a use thereof, and a beam treatment method are provided. The optical device has an optical element positioned within beam propagation direction, and an exciter means functionally connected to the optical element for inducing an oscillation of the focal point in at least one of an x direction and any direction of a plane perpendicular to the beam propagation direction along a focal point oscillation path.
    Type: Application
    Filed: January 28, 2019
    Publication date: December 24, 2020
    Inventors: Thomas Rataj, Markus Steinlin, Simon Scheidiger
  • Patent number: 10507555
    Abstract: Beam processing machines such as laser beam or fluid jet processing machines (1) for processing workpieces (5) include a frame (3), a workpiece rest (4) held by the frame (3), and a beam tool (2) movable relative to the workpiece rest (4). Incorporated in a vibration-transmitting connecting path between the beam tool and the rest surface for workpieces defined by the workpiece rest are a plurality of damping elements that decouple vibrations between the rest surface and beam tool, its mounting, or the frame.
    Type: Grant
    Filed: April 3, 2015
    Date of Patent: December 17, 2019
    Assignee: BYSTRONIC LASER AG
    Inventors: Sergio Bossoni, Markus Steinlin
  • Publication number: 20150283662
    Abstract: Beam processing machines such as laser beam or fluid jet processing machines (1) for processing workpieces (5) include a frame (3), a workpiece rest (4) held by the frame (3), and a beam tool (2) movable relative to the workpiece rest (4). Incorporated in a vibration-transmitting connecting path between the beam tool and the rest surface for workpieces defined by the workpiece rest are a plurality of damping elements that decouple vibrations between the rest surface and beam tool, its mounting, or the frame.
    Type: Application
    Filed: April 3, 2015
    Publication date: October 8, 2015
    Inventors: Sergio Bossoni, Markus Steinlin