Abstract: A composition that can be activated by irradiation and cured by moisture comprises (A) one or more moisture-curable compounds from the group of alkoxy silanes, (B) at least one acid generator releasing an acid when exposed to actinic radiation, and (C) at least one carbonyl compound and/or carbonyl derivative selected from the group of aldehydes, ketones, hemiacetals and hemiketals. Moreover, the compositions according to the present invention can additionally contain an alcohol and/or thiol (D), a catalyst for moisture-curing (E), a radiation-curable compound (F), a photoinitiator for radical polymerization (G), and further additives (H). After activation of the acid generator the composition cures even in high layer thicknesses independently of the ingress of external moisture. Furthermore, a method for the bonding, molding, sealing and coating of substrates using the composition is described.

Abstract: A composition that can be activated by irradiation and cured by moisture comprises (A) one or more moisture-curable compounds from the group of alkoxy silanes, (B) at least one acid generator releasing an acid when exposed to actinic radiation, and (C) at least one carbonyl compound and/or carbonyl derivative selected from the group of aldehydes, ketones, hemiacetals and hemiketals. Moreover, the compositions according to the present invention can additionally contain an alcohol and/or thiol (D), a catalyst for moisture-curing (E), a radiation-curable compound (F), a photoinitiator for radical polymerization (G), and further additives (H). After activation of the acid generator the composition cures even in high layer thicknesses independently of the ingress of external moisture. Furthermore, a method for the bonding, molding, sealing and coating of substrates using the composition is described.

Abstract: A composition curing upon exposure to moisture comprises (A) one or more at least bifunctional silane compounds with at least two alkoxysilane groups, (B) at least one monofunctional silane compound with only one alkoxysilane group, and/or a partially condensed or bridged derivative thereof, and (C) at least one acid generator which, upon exposure to actinic radiation or heat, releases an acid. In addition, further additives (D) may be contained in the compositions according to the present invention. The composition is liquid at room temperature and, apart from the latent acid generator, does not contain any further catalysts for moisture-curing of alkoxysilanes. After activation of the acid generator the composition cures in the presence of moisture, while remaining liquid at room temperature in the presence of humidity over a period of at least 24 hours prior to activation of the acid generator. Furthermore, a method of joining or casting structural elements using the composition is described.

Abstract: A composition curing upon exposure to moisture comprises (A) one or more at least bifunctional silane compounds with at least two alkoxysilane groups, (B) at least one monofunctional silane compound with only one alkoxysilane group, and/or a partially condensed or bridged derivative thereof, and (C) at least one acid generator which, upon exposure to actinic radiation or heat, releases an acid. In addition, further additives (D) may be contained in the compositions according to the present invention. The composition is liquid at room temperature and, apart from the latent acid generator, does not contain any further catalysts for moisture-curing of alkoxysilanes. After activation of the acid generator the composition cures in the presence of moisture, while remaining liquid at room temperature in the presence of humidity over a period of at least 24 hours prior to activation of the acid generator. Furthermore, a method of joining or casting structural elements using the composition is described.

Abstract: The invention relates to combined radiation- and moisture-curing compounds, which are characterized in particular by rapid curing by means of moisture. The compounds can be used as adhesives, coatings or potting materials. The use of the compounds according to the invention is particularly preferred for filling electro-optical components.

Abstract: The invention relates to combined radiation- and moisture-curing compounds, which are characterized in particular by rapid curing by means of moisture. The compounds can be used as adhesives, coatings or potting materials. The use of the compounds according to the invention is particularly preferred for filling electro-optical components.