Patents by Inventor Markus Ulm
Markus Ulm has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9725298Abstract: A method of fabricating a semiconductor device comprises forming a dielectric layer above a substrate, the dielectric layer including a fixed dielectric portion and a proof mass portion, forming a source region and a drain region in the substrate, forming a gate electrode in the proof mass portion, and releasing the proof mass portion, such that the proof mass portion is movable with respect to the fixed dielectric portion and the gate electrode is movable with the proof mass portion relative to the source region and the drain region.Type: GrantFiled: January 6, 2016Date of Patent: August 8, 2017Assignee: Robert Bosch GmbHInventors: Ando Feyh, Po-Jui Chen, Markus Ulm
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Publication number: 20160115013Abstract: A method of fabricating a semiconductor device comprises forming a dielectric layer above a substrate, the dielectric layer including a fixed dielectric portion and a proof mass portion, forming a source region and a drain region in the substrate, forming a gate electrode in the proof mass portion, and releasing the proof mass portion, such that the proof mass portion is movable with respect to the fixed dielectric portion and the gate electrode is movable with the proof mass portion relative to the source region and the drain region.Type: ApplicationFiled: January 6, 2016Publication date: April 28, 2016Inventors: Ando Feyh, Po-Jui Chen, Markus Ulm
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Patent number: 9255000Abstract: A semiconductor device includes a substrate, a first dielectric layer located above the substrate, a moving-gate transducer, and a proof mass. The moving-gate transducer is at least partially formed within the substrate and is at least partially formed within the first dielectric layer. The proof mass includes a portion of the first dielectric layer and a portion of a silicon layer. The silicon layer is located above the first dielectric layer.Type: GrantFiled: December 17, 2013Date of Patent: February 9, 2016Assignee: Robert Bosch GmbHInventors: Ando Lars Feyh, Po-Jui Chen, Markus Ulm
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Patent number: 9003885Abstract: A tri-axis accelerometer includes a proof mass, at least four anchor points arranged in at least two opposite pairs, a first pair of anchor points being arranged opposite one another along a first axis, a second pair of anchor points being arranged opposite one another along a second axis, the first axis and the second axis being perpendicular to one another, and at least four spring units to connect the proof mass to the at least four anchor points, the spring units each including a pair of identical springs, each spring including a sensing unit.Type: GrantFiled: March 14, 2013Date of Patent: April 14, 2015Assignee: Robert Bosch GmbHInventors: Zhiyu Pan, Christoph Lang, Gary Yama, Matthias Metz, Markus Ulm
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Patent number: 8786419Abstract: A device for controlling a device by using a rotation-rate sensor. In order to provide a device for determining a triggering signal for a safety device which allows a particularly compact implementation of the device, the device is set up to ascertain an acceleration variable on the basis of a first sensor signal for a first seismic mass of the rotation-rate sensor and the second sensor signal for a second seismic mass of the rotation-rate sensor and to control the device as a function of the acceleration variable.Type: GrantFiled: November 3, 2009Date of Patent: July 22, 2014Assignee: Robert Bosch GmbHInventors: Markus Ulm, Mathias Reimann, Harald Emmerich, Udo-Martin Gomez, Emma Abel
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Publication number: 20140175525Abstract: A semiconductor device includes a substrate, a first dielectric layer located above the substrate, a moving-gate transducer, and a proof mass. The moving-gate transducer is at least partially formed within the substrate and is at least partially formed within the first dielectric layer. The proof mass includes a portion of the first dielectric layer and a portion of a silicon layer. The silicon layer is located above the first dielectric layer.Type: ApplicationFiled: December 17, 2013Publication date: June 26, 2014Applicant: Robert Bosch GmbHInventors: Ando Feyh, Po-Jui Chen, Markus Ulm
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Patent number: 8418559Abstract: A tri-axis accelerometer includes a proof mass, at least four anchor points arranged in at least two opposite pairs, a first pair of anchor points being arranged opposite one another along a first axis, a second pair of anchor points being arranged opposite one another along a second axis, the first axis and the second axis being perpendicular to one another, and at least four spring units to connect the proof mass to the at least four anchor points, the spring units each including a pair of identical springs, each spring including a sensing unit.Type: GrantFiled: June 28, 2010Date of Patent: April 16, 2013Assignee: Robert Bosch GmbHInventors: Zhiyu Pan, Christoph Lang, Gary Yama, Matthias Metz, Markus Ulm
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Patent number: 8276446Abstract: A sensor device includes a housing base part, a bearer part, a chip structure situated on the bearer part, and a spring/damper combination via which the housing base part and the bearer part are elastically connected to one another. In the sensor device, the housing base part, the spring/damper combination and the bearer part are situated one over the other.Type: GrantFiled: January 26, 2010Date of Patent: October 2, 2012Assignee: Robert Bosch GmbHInventors: Markus Ulm, Michael Struchholz, Tristan Jobert, Klaus Offterdinger, Thomas Klaus, Christian Gerhardt, Florian Grabmaier, Dirk Dittmann
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Patent number: 8020266Abstract: Methods of making an energy harvesting device are described. A case and integrated piezoelectric cantilever to harvest vibration energy from an environment being sensed is produced via a print forming method injection molding method. The cantilever device consists of a piezoelectric material member, and a proof mass of high density material coupled to the piezoelectric member. The print forming method is used to build up the base and walls of the device as well as the neutral layers of the piezoelectric member. Metal layers are printed to form the electrode layers of the piezoelectric member and the electrical contact portions of the device. Passive components can also be formed as part of the layers of the device. The entire assembly can be encapsulated in plastic.Type: GrantFiled: July 14, 2008Date of Patent: September 20, 2011Assignee: Robert Bosch GmbhInventors: Markus Ulm, Brian Stark, Matthias Metz
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Patent number: 7898046Abstract: An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450 C is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.Type: GrantFiled: July 20, 2009Date of Patent: March 1, 2011Assignee: Robert Bosch GmbHInventors: Markus Ulm, Brian Stark, Matthias Metz, Tino Fuchs, Franz Laermer, Silvia Kronmueller
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Publication number: 20100263447Abstract: A tri-axis accelerometer includes a proof mass, at least four anchor points arranged in at least two opposite pairs, a first pair of anchor points being arranged opposite one another along a first axis, a second pair of anchor points being arranged opposite one another along a second axis, the first axis and the second axis being perpendicular to one another, and at least four spring units to connect the proof mass to the at least four anchor points, the spring units each including a pair of identical springs, each spring including a sensing unit.Type: ApplicationFiled: June 28, 2010Publication date: October 21, 2010Inventors: Zhiyu Pan, Christoph Lang, Gary Yama, Matthias Metz, Markus Ulm
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Publication number: 20100225500Abstract: A device for controlling a device by using a rotation-rate sensor. In order to provide a device for determining a triggering signal for a safety device which allows a particularly compact implementation of the device, the device is set up to ascertain an acceleration variable on the basis of a first sensor signal for a first seismic mass of the rotation-rate sensor and the second sensor signal for a second seismic mass of the rotation-rate sensor and to control the device as a function of the acceleration variable.Type: ApplicationFiled: November 3, 2009Publication date: September 9, 2010Inventors: Markus ULM, Mathias Reimann, Harald Emmerich, Udo-Martin Gomez, Emma Abel
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Publication number: 20100192689Abstract: A sensor device includes a housing base part, a bearer part, a chip structure situated on the bearer part, and a spring/damper combination via which the housing base part and the bearer part are elastically connected to one another. In the sensor device, the housing base part, the spring/damper combination and the bearer part are situated one over the other.Type: ApplicationFiled: January 26, 2010Publication date: August 5, 2010Inventors: Markus Ulm, Michael Struchholz, Tristan Jobert, Klaus Offterdinger, Thomas Klaus, Christian Gerhardt, Florian Grabmaier, Dirk Dittmann
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Patent number: 7757555Abstract: A tri-axis accelerometer includes a proof mass, at least four anchor points arranged in at least two opposite pairs, a first pair of anchor points being arranged opposite one another along a first axis, a second pair of anchor points being arranged opposite one another along a second axis, the first axis and the second axis being perpendicular to one another, and at least four spring units to connect the proof mass to the at least four anchor points, the spring units each including a pair of identical springs, each spring including a sensing unit.Type: GrantFiled: August 30, 2006Date of Patent: July 20, 2010Assignee: Robert Bosch GmbHInventors: Zhiyu Pan, Christoph Lang, Gary Yama, Matthias Metz, Markus Ulm
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Patent number: 7671515Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. An embodiment further includes location of a piezoelectric material as part of a semiconductor sensing structure. The semiconductor sensing structure, in conjunction with the piezoelectric material, can be used as a sensing device to provide an output signal associated with a sensed event.Type: GrantFiled: November 7, 2006Date of Patent: March 2, 2010Assignee: Robert Bosch, GmbHInventors: Matthias Metz, Zhiyu Pan, Brian Stark, Markus Ulm, Gary Yama
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Patent number: 7625773Abstract: A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure.Type: GrantFiled: November 4, 2008Date of Patent: December 1, 2009Assignee: Robert Bosch GmbHInventors: Markus Lutz, Aaron Partridge, Wilhelm Frey, Markus Ulm, Matthias Metz, Brian Stark, Gary Yama
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Publication number: 20090278214Abstract: An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450 C is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.Type: ApplicationFiled: July 20, 2009Publication date: November 12, 2009Applicant: ROBERT BOSCH GMBHInventors: Markus Ulm, Brian Stark, Matthias Metz, Tino Fuchs, Franz Laermer, Silvia Kronmueller
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Patent number: 7582514Abstract: An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450° C. is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.Type: GrantFiled: August 24, 2007Date of Patent: September 1, 2009Assignee: Robert Bosch GmbHInventors: Cyril Vancura, Markus Ulm, Brian Stark, Matthias Metz, Tino Fuchs, Franz Laermer, Silvia Kronmueller
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Patent number: 7563633Abstract: An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450 C is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.Type: GrantFiled: August 25, 2006Date of Patent: July 21, 2009Assignee: Robert Bosch GmbHInventors: Markus Ulm, Brian Stark, Matthias Metz, Tino Fuchs, Franz Laermer, Silvia Kronmueller
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Patent number: 7535325Abstract: A component is provided for an impedance change in a coplanar waveguide which includes two grounding conductors and a signal line lying between the grounding conductors, as well as a conducting connecting element, which has a covering surface for the two grounding conductors and the signal line, and is electrically insulated, so that in each case a capacitor is formed. The connecting element and the lines are situated and arranged so that the respective capacitor between the grounding conductors and the connecting element has an invariable capacitance, but the capacitor between the connecting element and the signal line has a variable capacitance. A structure is also provided in which in an exactly opposite way, the respective capacitor between the grounding conductors and the connecting element has a variable capacitance, but the capacitor between the connecting element and the signal line has an invariable capacitance. Furthermore, a method for producing such a component is also provided.Type: GrantFiled: July 24, 2004Date of Patent: May 19, 2009Assignee: Robert Bosch GmbHInventors: Roland Mueller-Fiedler, Markus Ulm, Mathias Reimann, Thomas Buck